Senior IC Package Designer — Equity & NPI at Scale

A leading semiconductor company in California is seeking an experienced IC Packaging Engineer to deliver advanced packaging solutions and collaborate closely with chip design, system design, and manufacturing teams. The ideal candidate should have extensive experience in substrate design, signal integrity, and thermal management, with a strong background in BGA packaging technologies. This role offers a competitive salary, annual bonus, and a comprehensive benefits package, ensuring a dynamic work environment focused on innovation. #J-18808-Ljbffr