Amkor Technology, Inc.
A leading semiconductor packaging company is hiring an IC Package Design Engineer in Tempe, AZ. The candidate will design laminate and wafer-level packages, create engineering drawings, and work closely with product and sales teams. The ideal candidate is self-motivated, has CAD experience, and ideally has semiconductor packaging and PCB design skills. A hybrid schedule is available, and candidates must be eligible for ITAR-sensitive information.
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