Indotronix International Corporation
Assembler | Owego, New York, United States
Job Description:
BGA (Ball Grid Array) reballing and replacement. QFN (Quad Flat No-Lead) and other leadless package rework. High-density connector rework and repair. Complex SMT (Surface Mount Technology) component replacement. Through-hole and surface mount technology (SMT) components. Fine pitch and high-density components. Utilize various soldering techniques, including hand soldering and reflow soldering. Uses microscope to verify correct part placement and orientation. Inspect and troubleshoot assemblies to identify defects and areas for improvement. Develop and implement rework procedures for new and existing products. Collaborate with engineering teams to resolve design and manufacturing issues. Assembling and aligning complex mechanical components. Using adhesives, epoxies, and other bonding agents.
BGA (Ball Grid Array) reballing and replacement. QFN (Quad Flat No-Lead) and other leadless package rework. High-density connector rework and repair. Complex SMT (Surface Mount Technology) component replacement. Through-hole and surface mount technology (SMT) components. Fine pitch and high-density components. Utilize various soldering techniques, including hand soldering and reflow soldering. Uses microscope to verify correct part placement and orientation. Inspect and troubleshoot assemblies to identify defects and areas for improvement. Develop and implement rework procedures for new and existing products. Collaborate with engineering teams to resolve design and manufacturing issues. Assembling and aligning complex mechanical components. Using adhesives, epoxies, and other bonding agents.