Rival
We are looking for a highly motivated Mechanical/Thermal Engineer responsible for mechanical design on server hardware using Rivos chips and other electronic components. This position reports to the Thermal/Mechanical Engineering Manager.
What will you do?
Mechanical design at the component, board, and chassis levels. Assembly design including high power ASICs, sockets, heat sinks. Mechanical design of air/liquid cooled heat sinks & exchangers/cold plates. Collaborate with board designers to determine dimensions, keep-out zones, translate ECAD into MCAD, and prepare board layouts. Work with other engineering teams (Reliability, SI/PI, Power, General HW) and update mechanical designs accordingly. Follow OCP guidelines, attend meetings, and apply updates to Rivos chassis mechanical design. Design cables and bundling for Rivos chassis across various form factors. Perform FEA analysis at board and chassis levels to ensure mechanical integrity. Generate and maintain BOM. Coordinate with CM, OEM, and ODMs to develop mockups, test samples, and high-volume products. Desired Skills and Experience:
Good communication and interpersonal skills as a team player. Passionate about startup environments, eager to explore and learn new techniques. Experience with electro-mechanical design for rack-mounted servers or networking equipment. Experience collaborating with CM, OEM, and ODMs. Proficiency in board/PCB/PWB mechanical design. Experience with cabling and bundling in electronic enclosures. Knowledge of fabrication processes like sheet metal, injection molding, tooling. Familiarity with OCP mechanical guidelines and Colo box designs. Experience with air & liquid cooling systems. Knowledge of tolerance analysis and ASME Y14.5 GD&T guidelines. Expertise in MCAD and PDM tools (NX & SolidWorks preferred). Experience with IDF and ECAD-MCAD transfer processes. Ability to work on mock-up designs and prepare testing setups and procedures. Experience in designing fixtures and components for prototypes. Proficiency with MS or Google Office Suite. Ability to implement test plans and conduct detailed tests or experiments. Strong troubleshooting skills in mechanical/thermal design and testing. Optional Skills:
Familiarity with ANSYS Mechanical. Experience with Thermal Design Software like Ansys IcePak. Knowledge of airflow and wind tunnel measurement techniques. Education and Experience:
B.S. in Mechanical/Thermal Engineering, Applied Mechanics, or Physics. Minimum 8 years in product development or qualification, preferably in electronics/semiconductor industries.
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Mechanical design at the component, board, and chassis levels. Assembly design including high power ASICs, sockets, heat sinks. Mechanical design of air/liquid cooled heat sinks & exchangers/cold plates. Collaborate with board designers to determine dimensions, keep-out zones, translate ECAD into MCAD, and prepare board layouts. Work with other engineering teams (Reliability, SI/PI, Power, General HW) and update mechanical designs accordingly. Follow OCP guidelines, attend meetings, and apply updates to Rivos chassis mechanical design. Design cables and bundling for Rivos chassis across various form factors. Perform FEA analysis at board and chassis levels to ensure mechanical integrity. Generate and maintain BOM. Coordinate with CM, OEM, and ODMs to develop mockups, test samples, and high-volume products. Desired Skills and Experience:
Good communication and interpersonal skills as a team player. Passionate about startup environments, eager to explore and learn new techniques. Experience with electro-mechanical design for rack-mounted servers or networking equipment. Experience collaborating with CM, OEM, and ODMs. Proficiency in board/PCB/PWB mechanical design. Experience with cabling and bundling in electronic enclosures. Knowledge of fabrication processes like sheet metal, injection molding, tooling. Familiarity with OCP mechanical guidelines and Colo box designs. Experience with air & liquid cooling systems. Knowledge of tolerance analysis and ASME Y14.5 GD&T guidelines. Expertise in MCAD and PDM tools (NX & SolidWorks preferred). Experience with IDF and ECAD-MCAD transfer processes. Ability to work on mock-up designs and prepare testing setups and procedures. Experience in designing fixtures and components for prototypes. Proficiency with MS or Google Office Suite. Ability to implement test plans and conduct detailed tests or experiments. Strong troubleshooting skills in mechanical/thermal design and testing. Optional Skills:
Familiarity with ANSYS Mechanical. Experience with Thermal Design Software like Ansys IcePak. Knowledge of airflow and wind tunnel measurement techniques. Education and Experience:
B.S. in Mechanical/Thermal Engineering, Applied Mechanics, or Physics. Minimum 8 years in product development or qualification, preferably in electronics/semiconductor industries.
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