Northrop Grumman
Sr. Principal Microelectronic Semiconductor Photolithography Process Engineer -
Northrop Grumman, Apopka, Florida, United States, 32703
Sr. Principal Microelectronic Semiconductor Photolithography Process Engineer - R10200231
Join Northrop Grumman as a
Senior Principal Microelectronics Semiconductor Photolithography Process Engineer
at our Advanced Packaging Technology µ-Line in
Apopka, Florida . This role involves supporting photolithography processes, developing new technologies, and collaborating with cross-functional teams to improve process stability, yield, and efficiency. The position requires working in a cleanroom environment, supporting capital projects, and engaging in continuous process improvement initiatives. Basic qualifications include:
a Bachelor’s degree in a STEM field with at least 8 years of relevant experience, proficiency in photolithography, process control, and semiconductor processing, and the ability to obtain a Secret Clearance. Experience with DOE, SPC, and data analysis tools is also required. Preferred qualifications include:
experience with Matlab, CAD software, SAP, and specific knowledge of bump metallurgy and advanced packaging technologies. An active Secret Clearance and Blackbelt Certification are highly desirable. The salary range for this position is $118,600 to $178,000, with additional benefits and potential bonuses. The application period is approximately 20 days from posting, subject to change. Northrop Grumman is an Equal Opportunity Employer and values diversity in its workforce.
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Join Northrop Grumman as a
Senior Principal Microelectronics Semiconductor Photolithography Process Engineer
at our Advanced Packaging Technology µ-Line in
Apopka, Florida . This role involves supporting photolithography processes, developing new technologies, and collaborating with cross-functional teams to improve process stability, yield, and efficiency. The position requires working in a cleanroom environment, supporting capital projects, and engaging in continuous process improvement initiatives. Basic qualifications include:
a Bachelor’s degree in a STEM field with at least 8 years of relevant experience, proficiency in photolithography, process control, and semiconductor processing, and the ability to obtain a Secret Clearance. Experience with DOE, SPC, and data analysis tools is also required. Preferred qualifications include:
experience with Matlab, CAD software, SAP, and specific knowledge of bump metallurgy and advanced packaging technologies. An active Secret Clearance and Blackbelt Certification are highly desirable. The salary range for this position is $118,600 to $178,000, with additional benefits and potential bonuses. The application period is approximately 20 days from posting, subject to change. Northrop Grumman is an Equal Opportunity Employer and values diversity in its workforce.
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