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Avicena Inc.

Process Engineer – Plasma Etch

Avicena Inc., Sunnyvale, California, United States, 94087

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Avicena

is a privately held company developingmicroLEDbased ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace.Avicenais headquartered inSunnyvale, California with a development center inEdinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry witha track recordof delivering breakthrough products. ( www.avicena.tech ) About the role: Responsible for developing, optimizing, and maintaining plasma etching processes used in semiconductor manufacturing. Design of Experiments for process performance, yield, and efficiency. Responsible for fabrication of components partially between foundry services and in-house wafer fabrication resources. Source and manage foundry services, contractors, and vendors. Characterize processes and components using semiconductor metrology tools, profilometers, interferometers, SEM, electrical testers and optical testers. Work with outside laboratories to characterize processes and devices, conduct failure analyses and model optoelectronic devices. Regularly interface with other engineers in Process Engineering and Equipment Engineering. Troubleshoot and resolve technical issues with photolithography equipment and processes. Indirectly manage engineering technicians and operators. Requirements

: BS in Chemical Engineering, Materials Science, Electrical Engineering or a related field. 10+ years of related industrial experience and managing semiconductor or MEMS foundries. Hands-on experience with plasma etch and micro-machining, including strong knowledge of ICP, RIE, DRIE, and wet etching of GaN and silicon. Strong knowledge of other MEMS-relevant materials such as sacrificial and structural layers, wet/dry release layers, SU-8, and temporary wafer bonding processes. Strong understanding of the effects of film stresses and the management of silicon integrity. Strong familiarity with a clean room environment and other semiconductor processing equipment, including contact aligners, steppers, CVD, PVD, ALD, plasma ashing. Proficient in Design of Experiments and Statistical Process Control methodologies. Extremely organized, data-driven, and detail-oriented, with a strong desire to maintain thorough documentation and a baseline. Ability to identify, troubleshoot, and communicate significantly complex engineering problems through documentation and regular presentations to senior and executive staff members. Familiarity with health and safety regulations in a cleanroom environment. Preferred Requirements: MS or PhD in Engineering 15+ years of related industrial experience Strong knowledge of semiconductor device physics. Proficient with JMP software. Proficient with database queries using SQL Computer modeling and simulation (optical, thermo-mechanical) desired, but not required.

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