eTeam
Job Title: Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration
Location: Fremont, CA (Hybrid - 3 days a week in office)
Job Type: 12+ Months Contract
Job Description:
We are seeking a Senior Electrical Engineer with expertise in Advanced Semiconductor Packaging and ASIC Design to lead cutting-edge projects in AI and semiconductor innovation. The ideal candidate will have extensive experience in mixed-signal design, chiplet integration, and advanced packaging .
Responsibilities:
Location: Fremont, CA (Hybrid - 3 days a week in office)
Job Type: 12+ Months Contract
Job Description:
We are seeking a Senior Electrical Engineer with expertise in Advanced Semiconductor Packaging and ASIC Design to lead cutting-edge projects in AI and semiconductor innovation. The ideal candidate will have extensive experience in mixed-signal design, chiplet integration, and advanced packaging .
Responsibilities:
- Lead the design and development of advanced semiconductor electronics and ASICs for high-performance applications.
- Develop and optimize mixed-signal designs , balancing analog and digital circuit requirements.
- Oversee semiconductor processing (FEOL & BEOL) and advanced packaging technologies .
- Integrate High Bandwidth Memory (HBM) and LPDDR memory for enhanced efficiency and speed.
- Implement chiplet integration techniques , focusing on high-speed chiplet I/O and interconnects .
- Ensure signal integrity and power integrity throughout the design process.
- Automate chip layout generation and format conversion for streamlined workflows.
- Design PCBs with a focus on performance, reliability, and manufacturability .
- Conduct thermal simulations to optimize device reliability under various conditions.
- Collaborate with cross-functional teams to ensure seamless integration and timely delivery.
- Mentor and guide junior engineers , fostering innovation and continuous learning.
- M.S. in Electrical Engineering, Computer Engineering, or related field .
- Extensive experience in semiconductor electronics and ASIC design .
- Proficiency in mixed-signal design and semiconductor processing .
- Strong knowledge of advanced packaging technologies , including HBM and LPDDR integration .
- Experience with chiplet integration, high-speed chiplet I/O, and interconnects .
- Expertise in signal integrity, power integrity, and automated chip layout generation .
- Proven track record in PCB design and thermal simulations .
- Published works or patents in semiconductor technologies are highly desirable.
- Excellent leadership, communication, and project management skills.
- Ability to work collaboratively in a fast-paced and dynamic environment .
- Ph.D. in Electrical Engineering or related field .
- Experience with leading industry-standard design and simulation tools .
- Strong background in AI-driven semiconductor applications .