Piper Companies
Advanced Packaging Integration Engineer
Piper Companies, California, Missouri, United States, 65018
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Advanced Packaging Integration Engineer
role at
Piper Companies 1 day ago Be among the first 25 applicants Join to apply for the
Advanced Packaging Integration Engineer
role at
Piper Companies Piper Companies is looking for an
Advanced Packaging Integration Engineer
to join a cutting-edge startup
onsite in Saratoga, CA . The ideal Advanced Packaging Integration Engineer will drive the development and integration of next-generation packaging solutions for high-performance semiconductor products.
Responsibilities for the Advanced Packaging Integration Engineer:
Lead advanced packaging initiatives, including 2.5D CoWoS and chiplet-based integration, from concept through production. Collaborate with global teams to align packaging strategies with system-level requirements. Own the development of test vehicles and qualification plans for multi-die and high-density packaging technologies. Influence system architecture by integrating packaging solutions that optimize thermal, mechanical, and electrical performance.
Qualifications for the Advanced Packaging Integration Engineer:
10+ years of experience in advanced IC packaging, with a strong background in system-level integration. Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance. Knowledge in CoWoS technology Strong experience with 2.5D and 3D stacking and chiplet-based architectures. Proven ability to lead cross-functional teams and manage vendor relationships with foundries and OSATs. Strong understanding of substrate technologies and multi-die co-design. Bachelor’s degree in Mechanical, Electrical Engineering or Materials science background are a plus.
Compensation/Benefits for the Advanced Packaging Integration Engineer:
Salary Range: $200,000 – $275,000 annually Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave (as required by law), and Paid Holidays
This job opens for applications on August 1, 2025. Applications for this job will be accepted for at least 30 days from the posting date.
Keywords: Advanced Packaging, CoWoS, 2.5D, 3D, Stacking, Chiplet, Multi-Die Packaging, OSAT, Substrate, system integration, Semiconductor Packaging, Mechanical Engineering, Electrical Engineering, IC Packaging, Packaging Engineer, 3D, integrator, package development
Seniority level
Seniority level Not Applicable Employment type
Employment type Full-time Job function
Job function Information Technology Industries Business Consulting and Services Referrals increase your chances of interviewing at Piper Companies by 2x Get notified about new Packager jobs in
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Advanced Packaging Integration Engineer
role at
Piper Companies 1 day ago Be among the first 25 applicants Join to apply for the
Advanced Packaging Integration Engineer
role at
Piper Companies Piper Companies is looking for an
Advanced Packaging Integration Engineer
to join a cutting-edge startup
onsite in Saratoga, CA . The ideal Advanced Packaging Integration Engineer will drive the development and integration of next-generation packaging solutions for high-performance semiconductor products.
Responsibilities for the Advanced Packaging Integration Engineer:
Lead advanced packaging initiatives, including 2.5D CoWoS and chiplet-based integration, from concept through production. Collaborate with global teams to align packaging strategies with system-level requirements. Own the development of test vehicles and qualification plans for multi-die and high-density packaging technologies. Influence system architecture by integrating packaging solutions that optimize thermal, mechanical, and electrical performance.
Qualifications for the Advanced Packaging Integration Engineer:
10+ years of experience in advanced IC packaging, with a strong background in system-level integration. Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance. Knowledge in CoWoS technology Strong experience with 2.5D and 3D stacking and chiplet-based architectures. Proven ability to lead cross-functional teams and manage vendor relationships with foundries and OSATs. Strong understanding of substrate technologies and multi-die co-design. Bachelor’s degree in Mechanical, Electrical Engineering or Materials science background are a plus.
Compensation/Benefits for the Advanced Packaging Integration Engineer:
Salary Range: $200,000 – $275,000 annually Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave (as required by law), and Paid Holidays
This job opens for applications on August 1, 2025. Applications for this job will be accepted for at least 30 days from the posting date.
Keywords: Advanced Packaging, CoWoS, 2.5D, 3D, Stacking, Chiplet, Multi-Die Packaging, OSAT, Substrate, system integration, Semiconductor Packaging, Mechanical Engineering, Electrical Engineering, IC Packaging, Packaging Engineer, 3D, integrator, package development
Seniority level
Seniority level Not Applicable Employment type
Employment type Full-time Job function
Job function Information Technology Industries Business Consulting and Services Referrals increase your chances of interviewing at Piper Companies by 2x Get notified about new Packager jobs in
Orange County, CA . Assembler - Medical Packaging- 3rd shift
Newport Beach, CA $30.00-$40.00 3 days ago Newport Beach, CA $25.00-$30.00 1 week ago Rancho Santa Margarita, CA $20.00-$28.00 1 month ago Senior On-Site Service Specialist / Mail Processing Specialist
Sr. Process Engineer - Semiconductor Packaging (Night Shift)
Irvine, CA $89,100.00-$172,100.00 2 days ago Assembly and Packaging Development Engineer
Orange, CA $65,000.00-$80,000.00 2 weeks ago Rancho Santa Margarita, CA $23.00-$26.00 1 month ago Administrative Assistant- Data Reporting and Operations
Operations Support Coordinator & Receptionist
Executive Personal Assistant & Office Administrator
Orange County, CA $70,000.00-$80,000.00 1 month ago Production Packaging Associate - 3rd Shift
Executive Assistant / Personal Assistant
We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.
#J-18808-Ljbffr