Chipton-Ross
Chipton-Ross is seeking multiple Microelectronic Wire Bonders ) for a contract opportunity in Chelmsford, MA.
BASIC QUALIFICATIONS (REQUIRED SKILLS/EXPERIENCE): High School Diploma or GED Familiarity with manual gold ball and ribbon bonding Experience with manual and automatic bonding equipment Basic computer skills for timekeeping, work instructions, and task confirmation Strong attention to detail and ability to work in a fast-paced environment Ability to follow written and verbal instructions Knowledge of ESD procedures and test equipment Must be able to read and write English Must pass a medical exam as outlined in the supplier guide Interim Secret Clearance required to start (supplier must initiate clearance process at offer stage)
POSITION RESPONSIBILITIES: Fabricate microelectronic components and sub-assemblies using wire and ribbon bonding techniques Use microscopes, measuring instruments, and electronic test equipment Read and interpret work instructions and process documentation Work with microscopic components requiring visual magnification for extended periods Use hand tools (tweezers, rulers, cutters) and pneumatic tools (torque drivers, screwdrivers) Maintain accurate data entry related to production processes Collaborate with team members to support throughput and continuous improvement
DESIRED EXPERIENCE: Experience with J-STD-001 and/or IPC-A-610 Strong work ethic, punctuality, and reliability
REQUIRED EDUCATION: Accredited High School Diploma or Equivalent
WORK HOURS: 4/10 work schedule 2nd Shift Monday-Thursday, 4:00 PM - 2:30 AM EST Overtime may be available
BASIC QUALIFICATIONS (REQUIRED SKILLS/EXPERIENCE): High School Diploma or GED Familiarity with manual gold ball and ribbon bonding Experience with manual and automatic bonding equipment Basic computer skills for timekeeping, work instructions, and task confirmation Strong attention to detail and ability to work in a fast-paced environment Ability to follow written and verbal instructions Knowledge of ESD procedures and test equipment Must be able to read and write English Must pass a medical exam as outlined in the supplier guide Interim Secret Clearance required to start (supplier must initiate clearance process at offer stage)
POSITION RESPONSIBILITIES: Fabricate microelectronic components and sub-assemblies using wire and ribbon bonding techniques Use microscopes, measuring instruments, and electronic test equipment Read and interpret work instructions and process documentation Work with microscopic components requiring visual magnification for extended periods Use hand tools (tweezers, rulers, cutters) and pneumatic tools (torque drivers, screwdrivers) Maintain accurate data entry related to production processes Collaborate with team members to support throughput and continuous improvement
DESIRED EXPERIENCE: Experience with J-STD-001 and/or IPC-A-610 Strong work ethic, punctuality, and reliability
REQUIRED EDUCATION: Accredited High School Diploma or Equivalent
WORK HOURS: 4/10 work schedule 2nd Shift Monday-Thursday, 4:00 PM - 2:30 AM EST Overtime may be available