GlobalFoundries
MTS Silicon Photonics Product Packaging Materials
GlobalFoundries, Round Lake, New York, United States, 12151
Job Opportunities at GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. Summary of Role
This hands-on packaging materials integration role will deliver industry leading electro-optical transceivers using GF's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on packaging and assembly materials used for each step in SiPh Flip Chip packaging, including laminate buildup, optical adhesives, interconnect metallurgy, underfills and adhesives, thermal materials, and more. Focus on materials and material selection to insure product and module assembly manufacturability and reliability, performance, reducing package risk factors, meeting packaging design rules, and material selection criteria to meet assembly, electrical, photonic, and thermal requirements for chiplet and photonic packages and modules. A successful candidate would possess material characterization expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions. It is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding. Responsibilities
Defines process integration materials specifications for assembly flow of co-packaged optics modules driving toward assembly manufacturability cost, yield, and reliability targets. Establishment of manufacturing driven design rules consistent with industry capabilities for manufacture of subcomponents. Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts. Driving SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems. Provides tools and complex analysis of quality issues and associated financial implications. Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs. Ensures standardization of site-based quality processes are executed appropriately. Drives discipline and qualification robustness through a consistent global qualification process. Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager: Perform project management and data analysis. Identify and resolve process integration issues and related problems. Develop custom or derivative processes to meet customer needs. Support new designs with module characterization and design rule development. Work with cross function teams to resolve technical & yield concerns. Develop and improve test structures that enable fast and rigorous characterization of process. Drive CIP (Continuous improvement plans) to deliver organizational goals. Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Required Qualifications
MS, or PhD + 3 or more years of experience. Materials science, thermal, mechanical, simulation background. Experience with failure analysis, design of experiments, & packaging process integration. Experience in bringing packaged products from development into production. Strong written and spoken English communication skills. Preferred Qualifications
Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem. Expert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging. Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing. Expected Salary Range $94,300.00 - $175,100.00. The exact salary will be determined based on qualifications, experience, and location. If you need a reasonable accommodation for any part of the employment process, please contact us by email at
usaaccommodations@gf.com
and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations. GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law.
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. Summary of Role
This hands-on packaging materials integration role will deliver industry leading electro-optical transceivers using GF's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on packaging and assembly materials used for each step in SiPh Flip Chip packaging, including laminate buildup, optical adhesives, interconnect metallurgy, underfills and adhesives, thermal materials, and more. Focus on materials and material selection to insure product and module assembly manufacturability and reliability, performance, reducing package risk factors, meeting packaging design rules, and material selection criteria to meet assembly, electrical, photonic, and thermal requirements for chiplet and photonic packages and modules. A successful candidate would possess material characterization expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions. It is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding. Responsibilities
Defines process integration materials specifications for assembly flow of co-packaged optics modules driving toward assembly manufacturability cost, yield, and reliability targets. Establishment of manufacturing driven design rules consistent with industry capabilities for manufacture of subcomponents. Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts. Driving SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems. Provides tools and complex analysis of quality issues and associated financial implications. Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs. Ensures standardization of site-based quality processes are executed appropriately. Drives discipline and qualification robustness through a consistent global qualification process. Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager: Perform project management and data analysis. Identify and resolve process integration issues and related problems. Develop custom or derivative processes to meet customer needs. Support new designs with module characterization and design rule development. Work with cross function teams to resolve technical & yield concerns. Develop and improve test structures that enable fast and rigorous characterization of process. Drive CIP (Continuous improvement plans) to deliver organizational goals. Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Required Qualifications
MS, or PhD + 3 or more years of experience. Materials science, thermal, mechanical, simulation background. Experience with failure analysis, design of experiments, & packaging process integration. Experience in bringing packaged products from development into production. Strong written and spoken English communication skills. Preferred Qualifications
Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem. Expert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging. Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing. Expected Salary Range $94,300.00 - $175,100.00. The exact salary will be determined based on qualifications, experience, and location. If you need a reasonable accommodation for any part of the employment process, please contact us by email at
usaaccommodations@gf.com
and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations. GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law.