eTeam
IC Packaging & Chiplet Integration
2.5D/3D packaging, flip-chip bonding, TSV, hybrid bonding Semiconductor Processing: BEOL/FEOL integration, advanced interconnects, thin-film deposition (PVD, PECVD, ALD, CVD) Design & Simulation: Siemens NX, Cadence, ANSYS, EasyEDA, ThermoCalc High-Speed I/O & Signal Integrity: Imp...
2.5D/3D packaging, flip-chip bonding, TSV, hybrid bonding Semiconductor Processing: BEOL/FEOL integration, advanced interconnects, thin-film deposition (PVD, PECVD, ALD, CVD) Design & Simulation: Siemens NX, Cadence, ANSYS, EasyEDA, ThermoCalc High-Speed I/O & Signal Integrity: Imp...