Boeing
Process Integration Engineer - Superconducting Technologies
Boeing - Malibu, California, United States, 90263
Work at Boeing
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Overview
Process Integration Engineer - Superconducting Technologies
2 days ago Be among the first 25 applicants Get AI-powered advice on this job and more exclusive features. General Description:
The Interconnect and Integrated Devices Group at HRL Laboratories is a talented team of scientists and engineers with diverse backgrounds in integrated circuit design, microfabrication, advanced packaging, materials characterization, and device testing. The team focuses on developing new technologies and transitioning them from research to development. We seek a process integration engineer with superconducting device experience to support new technology development. The ideal candidate is collaborative, with hands-on experience in superconducting device design, fabrication, and testing. Responsibilities include supporting prototyping, process development, and packaging activities. Essential Duties:
As an integration engineer, you will manage process development in our internal foundry and support process transfer to external vendors. Responsibilities include: Develop processes and integration schemes for superconducting device architectures. Document processes, prepare reports, review metrology and electrical data, and perform failure analyses. Support mask design and tape-out activities by defining design rules and reviewing mask data for process compliance. Coordinate technical activities with subcontractors and vendors. Required Skills:
Candidates should possess: Cleanroom fabrication experience. Semiconductor process development expertise. Knowledge of semiconductor device physics. Ability to solve complex technical problems. Effective communication skills for technical topics. Experience with Statistical Process Control (SPC) and data analysis using JMP or similar software is desired. Experience with packaging, 3D integration, and superconducting device fabrication and testing is preferred. Required Education:
M.S. in Electrical Engineering, Physics, Chemistry, Materials Science, or related STEM field, plus 2+ years of relevant semiconductor wafer processing experience. Advanced degrees are preferred. Physical Requirements:
Willingness to work in a cleanroom environment up to 30% of the time. Special Requirements:
U.S. citizenship required; ability to obtain and maintain security clearance, with active SSBI preferred. Compensation:
Salary range $132,765 - $165,983 plus bonus and benefits. Compensation depends on role, experience, skills, and location.
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2 days ago Be among the first 25 applicants Get AI-powered advice on this job and more exclusive features. General Description:
The Interconnect and Integrated Devices Group at HRL Laboratories is a talented team of scientists and engineers with diverse backgrounds in integrated circuit design, microfabrication, advanced packaging, materials characterization, and device testing. The team focuses on developing new technologies and transitioning them from research to development. We seek a process integration engineer with superconducting device experience to support new technology development. The ideal candidate is collaborative, with hands-on experience in superconducting device design, fabrication, and testing. Responsibilities include supporting prototyping, process development, and packaging activities. Essential Duties:
As an integration engineer, you will manage process development in our internal foundry and support process transfer to external vendors. Responsibilities include: Develop processes and integration schemes for superconducting device architectures. Document processes, prepare reports, review metrology and electrical data, and perform failure analyses. Support mask design and tape-out activities by defining design rules and reviewing mask data for process compliance. Coordinate technical activities with subcontractors and vendors. Required Skills:
Candidates should possess: Cleanroom fabrication experience. Semiconductor process development expertise. Knowledge of semiconductor device physics. Ability to solve complex technical problems. Effective communication skills for technical topics. Experience with Statistical Process Control (SPC) and data analysis using JMP or similar software is desired. Experience with packaging, 3D integration, and superconducting device fabrication and testing is preferred. Required Education:
M.S. in Electrical Engineering, Physics, Chemistry, Materials Science, or related STEM field, plus 2+ years of relevant semiconductor wafer processing experience. Advanced degrees are preferred. Physical Requirements:
Willingness to work in a cleanroom environment up to 30% of the time. Special Requirements:
U.S. citizenship required; ability to obtain and maintain security clearance, with active SSBI preferred. Compensation:
Salary range $132,765 - $165,983 plus bonus and benefits. Compensation depends on role, experience, skills, and location.
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