Applied Materials
Design Engineer, Senior Director
Applied Materials - Santa Clara, California, us, 95053
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Design Engineer, Senior Director
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Applied Materials 3 days ago Be among the first 25 applicants Join to apply for the
Design Engineer, Senior Director
role at
Applied Materials A 3D IC (Integrated Circuit) Package Designer is responsible for the development and design of advanced packaging solutions for integrated circuits. This role typically involves the following key responsibilities and requirements:
Key Responsibilities
Design Development: Create and develop 3D packaging designs for ICs, ensuring optimal performance, thermal management, and reliability. Simulation and Analysis: Utilize simulation tools to analyze the electrical, thermal, and mechanical performance of package designs. Collaboration: Work closely with cross-functional teams, including chip designers, system engineers, and manufacturing teams, to ensure package designs meet specifications and integration requirements. Prototyping: Oversee the prototyping process to validate designs through testing and iterations. Documentation: Prepare detailed documentation for design specifications, test plans, and design reviews. Industry Standards: Stay updated on industry standards, materials, and technologies relevant to 3D IC packaging. Problem Solving: Identify and address design-related issues and challenges throughout the development process. Project Management: Manage timelines and deliverables for packaging design projects, ensuring timely completion.
Required Qualifications:
Education: Master’s degree in Electrical Engineering, Physics, or a related field. Experience: Proven experience in IC packaging design, with expertise in 3D packaging technologies and methodologies. Software Proficiency: Proficiency in CAD software and simulation tools (e.g. SPICE, Sigrity, ANSYS-EM, Cadence Allegro, IBIS, Scripting). Knowledge of Materials: Understanding of materials used in semiconductor packaging and their properties. Attention to Detail: Strong analytical skills and attention to detail to ensure high-quality and reliable designs. Team Player: Excellent communication and collaboration skills to work effectively in a team environment.
Preferred Qualifications:
Certifications: Relevant certifications in IC design or packaging may be an advantage. Advanced Tools Experience: Familiarity with advanced tools and methodologies in 3D IC design and packaging. Research and Development: Experience in R&D projects related to new packaging technologies or applications.
Successful candidates must be eligible to lawfully receive export-controlled information, without the need for the company to seek a license. Furthermore, since the role entails work on a US government funded project, the successful candidate must also be able to meet the government’s requirements for eligibility to participate in the project, without the need for the company to seek an exception/extraordinary approval. The government’s requirements include certain restrictions on nationality and association/affiliation with entities deemed to be of concern.
Qualifications
Education:
Bachelor's Degree (Required), Master's Degree (Required)
Skills
Certifications:
Languages:
Years of Experience:
15+ Years
Work Experience:
Additional Information
Shift:
10-Day 8-Hr (United States of America)
Travel:
Yes, 25% of the Time
Relocation Eligible:
Yes
U.S. Salary Range:
$216,000.00 - $302,500.00
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. Seniority level
Seniority level Director Employment type
Employment type Full-time Job function
Job function Engineering and Information Technology Industries Appliances, Electrical, and Electronics Manufacturing, Nanotechnology Research, and Semiconductor Manufacturing Referrals increase your chances of interviewing at Applied Materials by 2x Get notified about new Senior Design Engineer jobs in
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Design Engineer, Senior Director
role at
Applied Materials 3 days ago Be among the first 25 applicants Join to apply for the
Design Engineer, Senior Director
role at
Applied Materials A 3D IC (Integrated Circuit) Package Designer is responsible for the development and design of advanced packaging solutions for integrated circuits. This role typically involves the following key responsibilities and requirements:
Key Responsibilities
Design Development: Create and develop 3D packaging designs for ICs, ensuring optimal performance, thermal management, and reliability. Simulation and Analysis: Utilize simulation tools to analyze the electrical, thermal, and mechanical performance of package designs. Collaboration: Work closely with cross-functional teams, including chip designers, system engineers, and manufacturing teams, to ensure package designs meet specifications and integration requirements. Prototyping: Oversee the prototyping process to validate designs through testing and iterations. Documentation: Prepare detailed documentation for design specifications, test plans, and design reviews. Industry Standards: Stay updated on industry standards, materials, and technologies relevant to 3D IC packaging. Problem Solving: Identify and address design-related issues and challenges throughout the development process. Project Management: Manage timelines and deliverables for packaging design projects, ensuring timely completion.
Required Qualifications:
Education: Master’s degree in Electrical Engineering, Physics, or a related field. Experience: Proven experience in IC packaging design, with expertise in 3D packaging technologies and methodologies. Software Proficiency: Proficiency in CAD software and simulation tools (e.g. SPICE, Sigrity, ANSYS-EM, Cadence Allegro, IBIS, Scripting). Knowledge of Materials: Understanding of materials used in semiconductor packaging and their properties. Attention to Detail: Strong analytical skills and attention to detail to ensure high-quality and reliable designs. Team Player: Excellent communication and collaboration skills to work effectively in a team environment.
Preferred Qualifications:
Certifications: Relevant certifications in IC design or packaging may be an advantage. Advanced Tools Experience: Familiarity with advanced tools and methodologies in 3D IC design and packaging. Research and Development: Experience in R&D projects related to new packaging technologies or applications.
Successful candidates must be eligible to lawfully receive export-controlled information, without the need for the company to seek a license. Furthermore, since the role entails work on a US government funded project, the successful candidate must also be able to meet the government’s requirements for eligibility to participate in the project, without the need for the company to seek an exception/extraordinary approval. The government’s requirements include certain restrictions on nationality and association/affiliation with entities deemed to be of concern.
Qualifications
Education:
Bachelor's Degree (Required), Master's Degree (Required)
Skills
Certifications:
Languages:
Years of Experience:
15+ Years
Work Experience:
Additional Information
Shift:
10-Day 8-Hr (United States of America)
Travel:
Yes, 25% of the Time
Relocation Eligible:
Yes
U.S. Salary Range:
$216,000.00 - $302,500.00
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. Seniority level
Seniority level Director Employment type
Employment type Full-time Job function
Job function Engineering and Information Technology Industries Appliances, Electrical, and Electronics Manufacturing, Nanotechnology Research, and Semiconductor Manufacturing Referrals increase your chances of interviewing at Applied Materials by 2x Get notified about new Senior Design Engineer jobs in
Santa Clara, CA . Staff Design Manager, Discover and Explore
Mountain View, CA $178,000.00-$265,000.00 2 weeks ago Sunnyvale, CA $170,000.00-$240,000.00 1 day ago Sunnyvale, CA $204,000.00-$281,000.00 2 weeks ago Design Manager - Higher Education - Mid Level
San Jose, CA $88,000.00-$107,000.00 5 days ago Manager and Associate Creative Director, Design (GTM)
Sr. Mechanical Design Engineer, Structures, Drive Systems, Semi
Milpitas, CA $140,700.00-$239,200.00 3 weeks ago Design Manager - Workplace Technology - Mid Level
San Jose, CA $88,000.00-$107,000.00 4 hours ago Sr. Mechanical Design Engineer, Power Electronics
Senior Design and Simulation Engineer (HIL)
San Francisco Bay Area $160,000.00-$240,000.00 3 weeks ago Sr. Mechanical Design Engineer - Wafer Chucks & Wafer Positioning Stages
San Jose, CA $185,000.00-$225,000.00 6 days ago CAD/CAM Engineering Manager 2 - R10197802
Sunnyvale, CA $142,200.00-$213,400.00 18 hours ago San Mateo, CA $169,500.00-$254,300.00 5 days ago Senior Mechanical Engineer (Vision Equipment)
Sunnyvale, CA $129,000.00-$218,300.00 3 weeks ago San Jose, CA $200,000.00-$230,000.00 2 weeks ago Mountain View, CA $178,000.00-$265,000.00 17 hours ago Sr. Opto-Mechanical Design Engineer (Opto-Mech camera development technical lead)
Mountain View, CA $178,000.00-$265,000.00 17 hours ago Interaction Design Manager, Google Search
Mountain View, CA $224,000.00-$315,000.00 1 day ago Mountain View, CA $183,000.00-$271,000.00 2 weeks ago San Jose, CA $108,000.00-$135,000.00 13 hours ago Lead Contracts Manager - Data Center Design, Engineering & Construction
Menlo Park, CA $144,000.00-$201,000.00 2 weeks ago Lead Contracts Manager - Data Center Design, Engineering & Construction
Fremont, CA $144,000.00-$201,000.00 2 weeks ago Santa Clara, CA $200,000.00-$250,000.00 5 days ago Senior Mechanical Engineer – Mechatronics
San Jose, CA $200,000.00-$300,000.00 2 weeks ago Manager, Digital Design - Mixed-Signal High-Speed I/O SerDes
We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.
#J-18808-Ljbffr