Clearance Jobs
Microelectronics Engineer
Clearance Jobs, Fort George G Meade, Maryland, United States, 20755
Microelectronics Engineer Opportunities
As an Engineering and Physical Science professional, you will use your skills to create the systems and tools that will be used to enhance the operation of intelligence. You will advise, administer, and perform scientific projects, such as planning, designing, and constructing specialized equipment, and ensuring adherence to sound engineering and scientific standards and principles. The National Security Agency (NSA) offers multiple areas of focus for facilities engineers, including computer, architectural, electrical, mechanical, and structural. In addition, we are seeking skills that include computer design, microelectronics, radio frequency design, and systems engineering. Apply your science and engineering skills to protect the nation. The NSA currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer Microelectronics Process Engineer Microelectronics Technology Engineer Each role requires specific knowledge and experience in microelectronics systems. The responsibilities and required experience levels vary by position: Microelectronics Package Design Engineer
Focused on developing advanced microelectronics systems through the design of custom multichip modules, printed circuit boards, high-density redistribution layers, 3D multi-layer integrated technologies, and system enclosures. Areas of responsibility can also include: Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis Understanding and development of assembly specifications in accordance with industry standards Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design Conduct research including studies, experiments, and investigations on new or alternate methodologies Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics Microelectronics Process Engineer
Focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules, printed circuit boards, high-density redistribution layers, 3D multi-layer integrated technologies, and system enclosures. Areas of responsibility can also include: Participate in assembly and fabrication process improvement efforts Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics Microelectronics Technology Engineer
Focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules, printed circuit boards, high-density redistribution layers, 3D multi-layer integrated technologies, and system enclosures. Areas of responsibility can also include: Conduct environmental and reliability tests High-pin-count Integrated Circuit (IC) design and operation validation Parametric testing Accelerated testing/qualification/screening Develop test plans according to industry and military specifications Design and develop test platforms Support quality assurance efforts for developed and fielded systems Disassembly and sample preparation for physical analysis of ICs for failure analysis Perform scanning electron microscopy (SEM), low energy electron microscopy (LEEM), and/or atomic force microscopy (AFM) The qualifications listed are the minimum acceptable to be considered for the position. For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field. If program is not ABET EAC accredited, it must include specified coursework. Pay: Salary offers are based on candidates' education level and years of experience relevant to the position and also take into account information provided by the hiring manager/organization regarding the work level for the position. Salary Range: $86,498 - $195,200 (Entry, Full Performance, Senior, Expert). Salary range varies by location, work level, and relevant experience to the position. Training will be provided based on the selectee's needs and experience.
As an Engineering and Physical Science professional, you will use your skills to create the systems and tools that will be used to enhance the operation of intelligence. You will advise, administer, and perform scientific projects, such as planning, designing, and constructing specialized equipment, and ensuring adherence to sound engineering and scientific standards and principles. The National Security Agency (NSA) offers multiple areas of focus for facilities engineers, including computer, architectural, electrical, mechanical, and structural. In addition, we are seeking skills that include computer design, microelectronics, radio frequency design, and systems engineering. Apply your science and engineering skills to protect the nation. The NSA currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer Microelectronics Process Engineer Microelectronics Technology Engineer Each role requires specific knowledge and experience in microelectronics systems. The responsibilities and required experience levels vary by position: Microelectronics Package Design Engineer
Focused on developing advanced microelectronics systems through the design of custom multichip modules, printed circuit boards, high-density redistribution layers, 3D multi-layer integrated technologies, and system enclosures. Areas of responsibility can also include: Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis Understanding and development of assembly specifications in accordance with industry standards Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design Conduct research including studies, experiments, and investigations on new or alternate methodologies Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics Microelectronics Process Engineer
Focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules, printed circuit boards, high-density redistribution layers, 3D multi-layer integrated technologies, and system enclosures. Areas of responsibility can also include: Participate in assembly and fabrication process improvement efforts Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics Microelectronics Technology Engineer
Focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules, printed circuit boards, high-density redistribution layers, 3D multi-layer integrated technologies, and system enclosures. Areas of responsibility can also include: Conduct environmental and reliability tests High-pin-count Integrated Circuit (IC) design and operation validation Parametric testing Accelerated testing/qualification/screening Develop test plans according to industry and military specifications Design and develop test platforms Support quality assurance efforts for developed and fielded systems Disassembly and sample preparation for physical analysis of ICs for failure analysis Perform scanning electron microscopy (SEM), low energy electron microscopy (LEEM), and/or atomic force microscopy (AFM) The qualifications listed are the minimum acceptable to be considered for the position. For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field. If program is not ABET EAC accredited, it must include specified coursework. Pay: Salary offers are based on candidates' education level and years of experience relevant to the position and also take into account information provided by the hiring manager/organization regarding the work level for the position. Salary Range: $86,498 - $195,200 (Entry, Full Performance, Senior, Expert). Salary range varies by location, work level, and relevant experience to the position. Training will be provided based on the selectee's needs and experience.