Clearance Jobs
Microelectronics Engineer - Entry to Expert Level (Maryland)
Clearance Jobs, Fort George G Meade, Maryland, United States, 20755
Microelectronics Engineer
Help with the ever-increasing technological complexities in the world of Microelectronics, we need talented Microelectronics Engineers to be part of our team designing, assembling, testing, and qualifying the next generation of electronics hardware in support of our mission. Our goal is to provide microelectronics services of the highest quality to ensure the success of the Agency's mission. Microelectronics Engineers utilize electrical, computer, mechanical, and materials engineering knowledge and skills to design, assemble, test, analyze and qualify the next generation of electronics hardware in support of the NSA mission. The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer
A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include: Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis Understanding and development of assembly specifications in accordance with industry standards Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design Conduct research including studies, experiments, and investigations on new or alternate methodologies Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics Microelectronics Process Engineer
A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include: Participate in assembly and fabrication process improvement efforts Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics Microelectronics Technology Engineer
A Microelectronics Technology Engineer is focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies, and/or system enclosures. Areas of responsibility can also include: Conduct environmental and reliability tests High-pin-count Integrated Circuit (IC) design and operation validation Parametric testing Accelerated testing / qualification / screening Develop test plans according to industry and military specifications Design and develop test platforms Support quality assurance efforts for developed and fielded systems Disassembly and sample preparation for physical analysis of ICs for failure analysis Perform scanning electron microscopy (SEM), low energy electrons microscopy (LEEM), and/or atomic force microscopy (AFM) When submitting your application, please ensure that you fully populate all sections of the resume tool with all relevant skills, experience, and education, as the resume entered into the tool will be the primary resume used to evaluate your application. Please attach an unofficial copy of your transcripts from all schools attended when applying for this position. Providing a copy of your transcripts is especially critical to ensure the position's coursework obligations have been met. Requirements: All applicants and employees are subject to random drug testing in accordance with Executive Order 12564. Employment is contingent upon successful completion of a security background investigation and polygraph. Qualifications: The qualifications listed are the minimum acceptable to be considered for the position. For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology). For all of the above degrees, if program is not ABET EAC accredited, it must include specified coursework. Additional information: Pay: Salary offers are based on candidates' education level and years of experience relevant to the position and also take into account information provided by the hiring manager/organization regarding the work level for the position. Salary Range: $86,498 - $195,200 (Entry, Full Performance, Senior, Expert). Salary range varies by location, work level, and relevant experience to the position. Training will be provided based on the selectee's needs and experience. Benefits: NSA offers a comprehensive benefits package. Work Schedule: This is a full-time position, Monday - Friday, with basic 8hr/day work requirement between 6:00 a.m. and 6:00 p.m. (flexible).
Help with the ever-increasing technological complexities in the world of Microelectronics, we need talented Microelectronics Engineers to be part of our team designing, assembling, testing, and qualifying the next generation of electronics hardware in support of our mission. Our goal is to provide microelectronics services of the highest quality to ensure the success of the Agency's mission. Microelectronics Engineers utilize electrical, computer, mechanical, and materials engineering knowledge and skills to design, assemble, test, analyze and qualify the next generation of electronics hardware in support of the NSA mission. The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer
A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include: Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis Understanding and development of assembly specifications in accordance with industry standards Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design Conduct research including studies, experiments, and investigations on new or alternate methodologies Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics Microelectronics Process Engineer
A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include: Participate in assembly and fabrication process improvement efforts Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics Microelectronics Technology Engineer
A Microelectronics Technology Engineer is focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies, and/or system enclosures. Areas of responsibility can also include: Conduct environmental and reliability tests High-pin-count Integrated Circuit (IC) design and operation validation Parametric testing Accelerated testing / qualification / screening Develop test plans according to industry and military specifications Design and develop test platforms Support quality assurance efforts for developed and fielded systems Disassembly and sample preparation for physical analysis of ICs for failure analysis Perform scanning electron microscopy (SEM), low energy electrons microscopy (LEEM), and/or atomic force microscopy (AFM) When submitting your application, please ensure that you fully populate all sections of the resume tool with all relevant skills, experience, and education, as the resume entered into the tool will be the primary resume used to evaluate your application. Please attach an unofficial copy of your transcripts from all schools attended when applying for this position. Providing a copy of your transcripts is especially critical to ensure the position's coursework obligations have been met. Requirements: All applicants and employees are subject to random drug testing in accordance with Executive Order 12564. Employment is contingent upon successful completion of a security background investigation and polygraph. Qualifications: The qualifications listed are the minimum acceptable to be considered for the position. For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology). For all of the above degrees, if program is not ABET EAC accredited, it must include specified coursework. Additional information: Pay: Salary offers are based on candidates' education level and years of experience relevant to the position and also take into account information provided by the hiring manager/organization regarding the work level for the position. Salary Range: $86,498 - $195,200 (Entry, Full Performance, Senior, Expert). Salary range varies by location, work level, and relevant experience to the position. Training will be provided based on the selectee's needs and experience. Benefits: NSA offers a comprehensive benefits package. Work Schedule: This is a full-time position, Monday - Friday, with basic 8hr/day work requirement between 6:00 a.m. and 6:00 p.m. (flexible).