GlobalFoundries
3D Advanced Heterogeneous Integration Development Intern (Summer 2026)
GlobalFoundries, Round Lake, New York, United States, 12151
GlobalFoundries Internship Program
GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you'll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives. Summary Of Role
Intern engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes wafer to wafer hybrid bonding, die to wafer hybrid bonding, TSV/TOV and interposer development. Essential Responsibilities Include:
Performing DOEs utilizing internal semiconductor tooling and at external partners. Analyzing engineering data from experiments and optimizations Modeling of processes Assisting engineers in daily integration/process development tasks Other Responsibilities:
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Required Qualifications:
Education
At least a sophomore at time of application and actively pursuing a Bachelors or Masters in Engineering or related field through an accredited degree program during the internship. Must have at least an overall 3.0 GPA and be in good academic standing. Language Fluency - English (Written & Verbal) Travel - Up to 10% Ability to work at least 40 hours per week during the internship. Preferred Qualifications:
Education
Pursuing a PhD in Engineering or related field through an accredited degree program during the internship. Prior related internship or co-op experience Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. Strong written and verbal communication skills Strong planning & organizational skills Any Advanced Semiconductor Packaging or Semiconductor Integration experience a big plus 6-month co-op position preferred for this role Expected Salary Range $0.00 - $0.00. The exact salary will be determined based on qualifications, experience, and location.
GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you'll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives. Summary Of Role
Intern engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes wafer to wafer hybrid bonding, die to wafer hybrid bonding, TSV/TOV and interposer development. Essential Responsibilities Include:
Performing DOEs utilizing internal semiconductor tooling and at external partners. Analyzing engineering data from experiments and optimizations Modeling of processes Assisting engineers in daily integration/process development tasks Other Responsibilities:
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Required Qualifications:
Education
At least a sophomore at time of application and actively pursuing a Bachelors or Masters in Engineering or related field through an accredited degree program during the internship. Must have at least an overall 3.0 GPA and be in good academic standing. Language Fluency - English (Written & Verbal) Travel - Up to 10% Ability to work at least 40 hours per week during the internship. Preferred Qualifications:
Education
Pursuing a PhD in Engineering or related field through an accredited degree program during the internship. Prior related internship or co-op experience Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. Strong written and verbal communication skills Strong planning & organizational skills Any Advanced Semiconductor Packaging or Semiconductor Integration experience a big plus 6-month co-op position preferred for this role Expected Salary Range $0.00 - $0.00. The exact salary will be determined based on qualifications, experience, and location.