NPI Lead

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Direct message the job poster from Xscape Photonics Inc

We are seeking a highly skilled and motivated NPI (New Product Introduction) Lead to own the manufacturing process development for our state-of-the-art photonic products. This is a hands-on role responsible for bridging the gap between design and high-volume production.

You will be the technical expert for our assembly and packaging processes, with a special focus on Silicon Photonics devices. Your primary mission will be to develop robust, scalable, and cost-effective manufacturing processes and transfer them successfully to our production partners. If you are a data-driven engineer who thrives on solving complex manufacturing challenges, this is the role for you.

What You'll Do (Responsibilities)

• Process Development & Optimization: Lead the hands-on development, characterization, and optimization of core assembly processes, including precision die bonding, wire bonding, and active/passive optical alignment.
• High-Volume Scalability: Design, develop, and qualify manufacturing processes and equipment with a clear path to ramping to high-volume manufacturing (HVM). Define equipment specifications and drive the design of custom fixtures and tooling.
• Statistical Process Control (SPC): Implement and manage SPC for critical process parameters. Use statistical methods (DOE, Cp/Cpk analysis) to monitor process health, drive yield improvements, and ensure manufacturability.
• Silicon Photonics Assembly: Serve as the subject matter expert for the unique challenges associated with Silicon Photonics device assembly , including fiber attach, thermal management, and high-density interconnects.
• Design for Manufacturability (DFM): Work closely with the design engineering team to provide critical DFM feedback, ensuring that new products are designed for robust, high-yield manufacturing.
• Yield Improvement: Drive root cause analysis for yield excursions and process failures. Implement robust corrective and preventative actions to achieve and exceed yield targets.
• Manufacturing Transfer: Create comprehensive documentation (work instructions, control plans, PFMEAs) and lead the technical transfer of new products and processes to our contract manufacturing (CM) partners.

What You'll Bring (Qualifications)

Minimum Qualifications:

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.
• 5+ years of experience in a process engineering or NPI role within the semiconductor, electronics, or photonics packaging industry.
• Direct, hands-on experience developing and sustaining key assembly processes such as precision die bonding, wire bonding, and optical alignment.
• Demonstrated experience working with Silicon Photonics devices and their associated assembly and packaging processes.
• Proficiency in applying Statistical Process Control (SPC) and Design of Experiments (DOE) to solve manufacturing problems.

Preferred Qualifications:

• Master’s degree or PhD in a relevant technical discipline.
• A proven track record of successfully developing manufacturing processes and ramping them into high-volume manufacturing.
• Deep expertise in materials (e.g., epoxies, solders) and characterization techniques used in microelectronic and photonic assembly.
• Experience specifying, sourcing, and qualifying automated or semi-automated manufacturing equipment.
• Experience with statistical analysis software such as JMP or Minitab.
• Experience working with and managing offshore contract manufacturers (CMs).
• Strong problem-solving skills and a hands-on, data-driven approach.

Seniority level

• Seniority level

  Mid-Senior level

Employment type

• Employment type

  Full-time

Job function

• Industries

  Computer Hardware Manufacturing

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Medical insurance

Vision insurance

401(k)

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