MediaTek
1 day ago Be among the first 25 applicants
Get AI-powered advice on this job and more exclusive features.
Job Description
MediaTek is seeking a talented and experienced technical leader with expertise in advanced packaging technologies, specifically 2.5D/3D. This role involves close collaboration with cross-functional teams, including IP, ASIC Design, Package Design, Signal Integrity, Power Integrity, Thermal, product engineering, Test engineering, etc. The goal is to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications. Job Description
MediaTek is seeking a talented and experienced technical leader with expertise in advanced packaging technologies, specifically 2.5D/3D. This role involves close collaboration with cross-functional teams, including IP, ASIC Design, Package Design, Signal Integrity, Power Integrity, Thermal, product engineering, Test engineering, etc. The goal is to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications.
The ideal candidate will be instrumental in developing key packaging technologies, establishing third-party relationships, and addressing challenges in areas such as 2.5D/3D package integration, including but not limited to CoWoS, EMIB, SoIC, HBM, FCBGA, and HBPOP. The candidate should demonstrate ownership, high standards, strategic thinking, and customer obsession.
Role and Responsibilities
Collaborate with internal teams, external customers, and key partners to develop advanced packaging solutions from concept to mass production Coordinate with package design, substrate, and assembly partners to select materials and BOM, ensuring manufacturability and meeting electrical, mechanical, thermal, and system-level requirements Lead and coordinate projects across design, engineering, supply chain, manufacturing, and quality assurance to ensure successful execution Establish and maintain strong relationships with suppliers, customers, and internal teams to meet project requirements and resolve supply chain or manufacturing issues Monitor and report on project progress, supply chain performance, and manufacturing metrics to senior management
Requirement
Expertise in 2.5D/3D package architecture and advanced packaging technologies such as CoWoS, EMIB, SoIC, CoW, WoW, POP, etc. Working knowledge of package design, electrical signal integrity, power integrity, thermal, and thermomechanical principles, with a fundamental understanding of 2.5D/3D package challenges Experience with wafer level processes, package assembly processes, and substrate technology. Strong supply chain and quality management skills, including BOM management, procurement, logistics, and inventory Understanding of legacy packaging technologies, package failure mechanisms, and quick problem-solving skills Ability to develop and maintain strong relationships with key enablement partners and customers, ensuring smooth communication and alignment on project requirements, product quality, reliability, system, and operational needs Excellent communication skills 10-15% international travel required
Salary range: $180,000 - $250,000
Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Paid time off (PTO), Parental leave, 401K and more.
MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.
Seniority level
Seniority level Not Applicable Employment type
Employment type Full-time Job function
Job function Design, Art/Creative, and Information Technology Industries Computer Hardware Manufacturing, Semiconductor Manufacturing, and Wireless Services Referrals increase your chances of interviewing at MediaTek by 2x Sign in to set job alerts for “Packaging Technologist” roles.
San Jose, CA $136,500.00-$253,500.00 3 days ago Fremont, CA $138,000.00-$162,500.00 3 days ago Food Safety and Quality Assurance Technician
Quality Control Technician - Night Shift 5 pm - 5 am
San Francisco Bay Area $102,085.00-$132,110.00 2 weeks ago Santa Clara, CA $150,000.00-$234,000.00 1 day ago San Francisco Bay Area $160,000.00-$250,000.00 2 weeks ago San Jose, CA $150,938.00-$226,406.00 1 week ago San Jose, CA $141,000.00-$226,000.00 2 weeks ago Internship, Packaging Engineer, Supply Chain (Winter/Spring 2026)
Sunnyvale, CA $185,000.00-$225,000.00 5 months ago Packaging Design Engineer - Advanced Wafer-Level & OSAT Processes
Santa Clara, CA $155,000.00-$275,000.00 6 days ago Santa Clara, CA $165,000.00-$205,000.00 5 days ago Livermore, CA $105,000.00-$160,000.00 2 weeks ago Advanced Packaging Optical Engineer - Office of the CTO
Santa Clara, CA $124,000.00-$171,000.00 3 days ago Principal Advanced Packaging Technology Engineer
San Jose, CA $221,360.00-$332,040.00 1 week ago Advanced Packaging Laser Engineer - Office of the CTO
Santa Clara, CA $124,000.00-$171,000.00 3 days ago Santa Clara, CA $147,000.00-$202,500.00 3 days ago Packaging Design Engineer - Optical Interfaces
Santa Clara, CA $125,000.00-$255,000.00 6 days ago Santa Clara, CA $138,000.00-$183,500.00 3 days ago Senior Automation Engineer, Optical Packaging
Milpitas, CA $156,000.00-$200,000.00 1 week ago Fremont, CA $110,100.00-$214,650.00 1 week ago San Jose, CA $136,500.00-$253,500.00 3 days ago Livermore, CA $95,000.00-$135,000.00 2 weeks ago 3DIC Packaging SI/PI Applications Engineer
Fremont, CA $142,800.00-$285,600.00 2 weeks ago We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.
#J-18808-Ljbffr
MediaTek is seeking a talented and experienced technical leader with expertise in advanced packaging technologies, specifically 2.5D/3D. This role involves close collaboration with cross-functional teams, including IP, ASIC Design, Package Design, Signal Integrity, Power Integrity, Thermal, product engineering, Test engineering, etc. The goal is to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications. Job Description
MediaTek is seeking a talented and experienced technical leader with expertise in advanced packaging technologies, specifically 2.5D/3D. This role involves close collaboration with cross-functional teams, including IP, ASIC Design, Package Design, Signal Integrity, Power Integrity, Thermal, product engineering, Test engineering, etc. The goal is to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications.
The ideal candidate will be instrumental in developing key packaging technologies, establishing third-party relationships, and addressing challenges in areas such as 2.5D/3D package integration, including but not limited to CoWoS, EMIB, SoIC, HBM, FCBGA, and HBPOP. The candidate should demonstrate ownership, high standards, strategic thinking, and customer obsession.
Role and Responsibilities
Collaborate with internal teams, external customers, and key partners to develop advanced packaging solutions from concept to mass production Coordinate with package design, substrate, and assembly partners to select materials and BOM, ensuring manufacturability and meeting electrical, mechanical, thermal, and system-level requirements Lead and coordinate projects across design, engineering, supply chain, manufacturing, and quality assurance to ensure successful execution Establish and maintain strong relationships with suppliers, customers, and internal teams to meet project requirements and resolve supply chain or manufacturing issues Monitor and report on project progress, supply chain performance, and manufacturing metrics to senior management
Requirement
Expertise in 2.5D/3D package architecture and advanced packaging technologies such as CoWoS, EMIB, SoIC, CoW, WoW, POP, etc. Working knowledge of package design, electrical signal integrity, power integrity, thermal, and thermomechanical principles, with a fundamental understanding of 2.5D/3D package challenges Experience with wafer level processes, package assembly processes, and substrate technology. Strong supply chain and quality management skills, including BOM management, procurement, logistics, and inventory Understanding of legacy packaging technologies, package failure mechanisms, and quick problem-solving skills Ability to develop and maintain strong relationships with key enablement partners and customers, ensuring smooth communication and alignment on project requirements, product quality, reliability, system, and operational needs Excellent communication skills 10-15% international travel required
Salary range: $180,000 - $250,000
Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Paid time off (PTO), Parental leave, 401K and more.
MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.
Seniority level
Seniority level Not Applicable Employment type
Employment type Full-time Job function
Job function Design, Art/Creative, and Information Technology Industries Computer Hardware Manufacturing, Semiconductor Manufacturing, and Wireless Services Referrals increase your chances of interviewing at MediaTek by 2x Sign in to set job alerts for “Packaging Technologist” roles.
San Jose, CA $136,500.00-$253,500.00 3 days ago Fremont, CA $138,000.00-$162,500.00 3 days ago Food Safety and Quality Assurance Technician
Quality Control Technician - Night Shift 5 pm - 5 am
San Francisco Bay Area $102,085.00-$132,110.00 2 weeks ago Santa Clara, CA $150,000.00-$234,000.00 1 day ago San Francisco Bay Area $160,000.00-$250,000.00 2 weeks ago San Jose, CA $150,938.00-$226,406.00 1 week ago San Jose, CA $141,000.00-$226,000.00 2 weeks ago Internship, Packaging Engineer, Supply Chain (Winter/Spring 2026)
Sunnyvale, CA $185,000.00-$225,000.00 5 months ago Packaging Design Engineer - Advanced Wafer-Level & OSAT Processes
Santa Clara, CA $155,000.00-$275,000.00 6 days ago Santa Clara, CA $165,000.00-$205,000.00 5 days ago Livermore, CA $105,000.00-$160,000.00 2 weeks ago Advanced Packaging Optical Engineer - Office of the CTO
Santa Clara, CA $124,000.00-$171,000.00 3 days ago Principal Advanced Packaging Technology Engineer
San Jose, CA $221,360.00-$332,040.00 1 week ago Advanced Packaging Laser Engineer - Office of the CTO
Santa Clara, CA $124,000.00-$171,000.00 3 days ago Santa Clara, CA $147,000.00-$202,500.00 3 days ago Packaging Design Engineer - Optical Interfaces
Santa Clara, CA $125,000.00-$255,000.00 6 days ago Santa Clara, CA $138,000.00-$183,500.00 3 days ago Senior Automation Engineer, Optical Packaging
Milpitas, CA $156,000.00-$200,000.00 1 week ago Fremont, CA $110,100.00-$214,650.00 1 week ago San Jose, CA $136,500.00-$253,500.00 3 days ago Livermore, CA $95,000.00-$135,000.00 2 weeks ago 3DIC Packaging SI/PI Applications Engineer
Fremont, CA $142,800.00-$285,600.00 2 weeks ago We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.
#J-18808-Ljbffr