Sandisk
Principal Engineer, Packaging Engineering
Sandisk, Milpitas, California, United States, 95035
Overview
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. Our innovations in Flash and memory technologies drive the digital world. Sandisk is committed to equal opportunity employment and an inclusive work environment. Responsibilities
As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuit board assembly (PCBA) level, and host level. The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques. The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments. Qualifications
Ph.D. in Mechanical Engineering plus >3 years, or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience. Solid knowledge through academic coursework or experience in thermal modeling and measurements of IC packaging and related areas. A strong background in thermal sciences with emphasis on both analytical and measurement methods. Thorough knowledge of material thermal properties and test methods. Working knowledge in applying Computational Fluid Dynamics (CFD) in related areas; familiarity with software tools such as FloTHERM and ANSYS Icepak. Working knowledge in scientific programming. Demonstrated strong work ethic and ability to work in a team environment to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development. Skills
Strong oral and written communication skills. Ability to work in a global team environment and interact with engineers to define and implement experiments and conduct relevant simulations for feasibility and validation of concepts. Additional Information
Sandisk is committed to equal opportunities and will not discriminate based on protected characteristics. Our policies comply with applicable laws and include accommodations for applicants with disabilities. If you require accommodations, contact jobs.accommodations@sandisk.com with the job title and requisition number. Based on our experience, the application deadline is 08/21/2025 (3 months from posting); we reserve the right to close earlier if we hire someone before the deadline. If not filled, we will update the posting with a new deadline. Compensation & Benefits Details: pay ranges may vary by location and other factors. Benefits include health insurance, retirement plans, paid time off, and additional programs as described in our benefits documentation. Compensation & Benefits Details
An employee’s pay position within the salary range may be based on factors including education, qualifications, certifications, experience, skills, location, and organizational needs. The salary range is the range of possible compensation at the time of posting and may be adjusted in the future. Eligible to participate in Sandisk’s Short-Term Incentive Plan and, depending on role and performance, possibly the Long-Term Incentive plan (RSUs or cash equivalents). We offer a comprehensive benefits package including paid time off, health/dental/vision insurance, life & disability insurance, flexible spending and health savings accounts, EAP, tuition reimbursement, transit benefits, stock purchase plan, and 401(k).
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Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. Our innovations in Flash and memory technologies drive the digital world. Sandisk is committed to equal opportunity employment and an inclusive work environment. Responsibilities
As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuit board assembly (PCBA) level, and host level. The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques. The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments. Qualifications
Ph.D. in Mechanical Engineering plus >3 years, or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience. Solid knowledge through academic coursework or experience in thermal modeling and measurements of IC packaging and related areas. A strong background in thermal sciences with emphasis on both analytical and measurement methods. Thorough knowledge of material thermal properties and test methods. Working knowledge in applying Computational Fluid Dynamics (CFD) in related areas; familiarity with software tools such as FloTHERM and ANSYS Icepak. Working knowledge in scientific programming. Demonstrated strong work ethic and ability to work in a team environment to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development. Skills
Strong oral and written communication skills. Ability to work in a global team environment and interact with engineers to define and implement experiments and conduct relevant simulations for feasibility and validation of concepts. Additional Information
Sandisk is committed to equal opportunities and will not discriminate based on protected characteristics. Our policies comply with applicable laws and include accommodations for applicants with disabilities. If you require accommodations, contact jobs.accommodations@sandisk.com with the job title and requisition number. Based on our experience, the application deadline is 08/21/2025 (3 months from posting); we reserve the right to close earlier if we hire someone before the deadline. If not filled, we will update the posting with a new deadline. Compensation & Benefits Details: pay ranges may vary by location and other factors. Benefits include health insurance, retirement plans, paid time off, and additional programs as described in our benefits documentation. Compensation & Benefits Details
An employee’s pay position within the salary range may be based on factors including education, qualifications, certifications, experience, skills, location, and organizational needs. The salary range is the range of possible compensation at the time of posting and may be adjusted in the future. Eligible to participate in Sandisk’s Short-Term Incentive Plan and, depending on role and performance, possibly the Long-Term Incentive plan (RSUs or cash equivalents). We offer a comprehensive benefits package including paid time off, health/dental/vision insurance, life & disability insurance, flexible spending and health savings accounts, EAP, tuition reimbursement, transit benefits, stock purchase plan, and 401(k).
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