Veracity
Principal Application Engineer - Sintering & Electronics Materials
Veracity, Irvine, California, United States, 92713
Principal Application Engineer
Irvine, California
Full Time
Traveling of up to 10% is required for this role.
We are seeking a
Principal Application Engineer
with a strong background in
semiconductor materials , specifically
sintering pastes , to join our Electronics team. You'll be responsible for
technical leadership, application development, and customer interaction
to support and optimize material usage in power electronics and packaging. Key Responsibilities:
Lead technical engineering efforts for
sintering paste products
and applications in electronics. Optimize material performance and processing for both development-stage and commercialized products. Provide
hands-on technical support
and troubleshooting for customer processes. Serve as the key liaison for
application engineering across internal R&D, product development, and external clients . Develop in-depth understanding of customer requirements and deliver high-value, technically sound solutions. Lead
DOE (Design of Experiments)
and statistical analysis to validate performance and reliability. Maintain
customer satisfaction
by managing complex, on-site support for application issues. Document and report experimental data, insights, and recommendations. Collaborate cross-functionally with
product managers, quality, and sales teams . Required Qualifications:
Master's degree in
Material Science, Mechanical Engineering, Chemical Engineering , or related fields. 10+ years
of hands-on experience in materials for
semiconductor packaging or power electronics . Strong knowledge of
high thermal adhesives ,
sintering paste technology , and advanced packaging trends. Proficient in
statistical analysis, DOE methodology , and materials characterization. Excellent verbal and written communication skills. Demonstrated ability to handle
on-site technical support
and customer interactions. Strong sense of ownership and a
customer-centric mindset . Preferred Qualifications:
PhD in a related field. Experience working in
power electronics ,
automotive electronics , or
high-performance computing
environments. Prior experience in
adhesives or functional coatings
within semiconductor manufacturing. Recruiter Submission Template - Principal Application Engineer - Sintering & Electronics Materials
Full Name: Degree Major with University and Completion Year: Total Experience in Materials Engineering / Semiconductor Environment: Total Experience in Power Electronics / Packaging / Sintering Materials: Do you have 10+ years of experience working with materials in semiconductor, power packaging, or electronics environments? Do you have experience working with sintering adhesives, high thermal interface materials, or similar materials? Have you supported or led customer-facing application engineering projects? Do you have experience applying Design of Experiments (DOE) and statistical analysis methods? Do you have hands-on experience with reliability or performance testing of adhesive technologies? Do you have experience supporting process optimization and troubleshooting in electronics packaging? Have you worked on cross-functional teams (R&D, Sales, Manufacturing, etc.)? Are you experienced in semiconductor packaging trends (e.g., power modules, sintered die attach)? Are you willing to travel up to 10% for customer support or collaboration? Motivation / Reason for Relocation (if applicable): Motivation / Reason for Interest in this Position: Contact Number: Email ID: LinkedIn Profile: Full Address (Street, City, State, ZIP Code): Notice Period (in weeks): Ideal Start Date for the Candidate: Current Work Authorization Status (U.S. Citizen, Green Card, etc.): Expected Salary: Are you willing to work onsite in Irvine, CA (with occasional travel)? (Yes/No):
Principal Application Engineer
with a strong background in
semiconductor materials , specifically
sintering pastes , to join our Electronics team. You'll be responsible for
technical leadership, application development, and customer interaction
to support and optimize material usage in power electronics and packaging. Key Responsibilities:
Lead technical engineering efforts for
sintering paste products
and applications in electronics. Optimize material performance and processing for both development-stage and commercialized products. Provide
hands-on technical support
and troubleshooting for customer processes. Serve as the key liaison for
application engineering across internal R&D, product development, and external clients . Develop in-depth understanding of customer requirements and deliver high-value, technically sound solutions. Lead
DOE (Design of Experiments)
and statistical analysis to validate performance and reliability. Maintain
customer satisfaction
by managing complex, on-site support for application issues. Document and report experimental data, insights, and recommendations. Collaborate cross-functionally with
product managers, quality, and sales teams . Required Qualifications:
Master's degree in
Material Science, Mechanical Engineering, Chemical Engineering , or related fields. 10+ years
of hands-on experience in materials for
semiconductor packaging or power electronics . Strong knowledge of
high thermal adhesives ,
sintering paste technology , and advanced packaging trends. Proficient in
statistical analysis, DOE methodology , and materials characterization. Excellent verbal and written communication skills. Demonstrated ability to handle
on-site technical support
and customer interactions. Strong sense of ownership and a
customer-centric mindset . Preferred Qualifications:
PhD in a related field. Experience working in
power electronics ,
automotive electronics , or
high-performance computing
environments. Prior experience in
adhesives or functional coatings
within semiconductor manufacturing. Recruiter Submission Template - Principal Application Engineer - Sintering & Electronics Materials
Full Name: Degree Major with University and Completion Year: Total Experience in Materials Engineering / Semiconductor Environment: Total Experience in Power Electronics / Packaging / Sintering Materials: Do you have 10+ years of experience working with materials in semiconductor, power packaging, or electronics environments? Do you have experience working with sintering adhesives, high thermal interface materials, or similar materials? Have you supported or led customer-facing application engineering projects? Do you have experience applying Design of Experiments (DOE) and statistical analysis methods? Do you have hands-on experience with reliability or performance testing of adhesive technologies? Do you have experience supporting process optimization and troubleshooting in electronics packaging? Have you worked on cross-functional teams (R&D, Sales, Manufacturing, etc.)? Are you experienced in semiconductor packaging trends (e.g., power modules, sintered die attach)? Are you willing to travel up to 10% for customer support or collaboration? Motivation / Reason for Relocation (if applicable): Motivation / Reason for Interest in this Position: Contact Number: Email ID: LinkedIn Profile: Full Address (Street, City, State, ZIP Code): Notice Period (in weeks): Ideal Start Date for the Candidate: Current Work Authorization Status (U.S. Citizen, Green Card, etc.): Expected Salary: Are you willing to work onsite in Irvine, CA (with occasional travel)? (Yes/No):