Langham Recruitment
NPI Lead (Photonics – New Product Introduction)
Langham Recruitment, Palo Alto, California, United States, 94306
Overview
Sales at Navan | Travel and Expense Made Easy NPI Lead (Photonics – New Product Introduction) | Palo Alto, California | Hybrid | up to $200k Are you a hands-on, data-driven engineer with a passion for innovation? Do you thrive at the intersection of cutting-edge design and high-volume manufacturing? If so, we have an exciting opportunity for you. We’re looking for a New Product Introduction (NPI) Lead to spearhead the development and industrialization of our advanced Silicon Photonics products. In this role, you’ll be the go-to technical expert in assembly and packaging processes—playing a pivotal role in translating next-generation designs into scalable, production-ready solutions. This is more than just a technical role—this is your chance to shape the future of photonic manufacturing.
Base pay
$160,000.00/yr - $200,000.00/yr
Responsibilities
Own Process Development
– Lead the design, characterization, and optimization of critical processes like precision die bonding, wire bonding, and optical alignment.
Enable High-Volume Manufacturing (HVM)
– Define equipment specs, design custom tooling, and qualify processes for seamless scale-up.
Implement SPC & DOE
– Use advanced statistical methods to monitor process health, drive yield improvements, and ensure process stability.
Master Silicon Photonics Assembly
– Tackle complex packaging challenges involving fiber attach, thermal management, and high-density interconnects.
Drive Design for Manufacturability (DFM)
– Collaborate with design teams to ensure products are optimized for robust, high-yield production.
Boost Yields
– Lead root cause analyses and implement corrective/preventative actions to hit and exceed yield targets.
Lead Manufacturing Transfers
– Develop detailed documentation and manage the technical transfer of processes to contract manufacturing (CM) partners.
Skills & Experience
Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or related field; Master’s or PhD preferred.
5+ years of experience in NPI or process engineering within semiconductor, electronics, or photonics packaging.
Hands-on experience in assembly processes: die bonding, wire bonding, optical alignment.
Expertise in Silicon Photonics packaging.
Strong command of SPC, DOE, and statistical tools for manufacturing optimization.
Track record of ramping processes from R&D to high-volume manufacturing.
Deep materials knowledge (epoxies, solders) and process characterization expertise.
Experience with automation equipment and process qualification.
Proficiency with statistical software (JMP, Minitab).
Experience working with offshore CM partners.
Strong analytical, problem-solving, and communication skills.
What’s in it for you?
Salary up to $200k DOE
Bonus 10%-20%
Equity DOE
Medical and Dental
Job details
Seniority level: Mid-Senior level
Employment type: Full-time
Job function: Engineering, Product Management, and Manufacturing
Industries: Semiconductor Manufacturing, Computer Hardware Manufacturing, and Computers and Electronics Manufacturing
Referrals increase your chances of interviewing at Langham Recruitment by 2x
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Sales at Navan | Travel and Expense Made Easy NPI Lead (Photonics – New Product Introduction) | Palo Alto, California | Hybrid | up to $200k Are you a hands-on, data-driven engineer with a passion for innovation? Do you thrive at the intersection of cutting-edge design and high-volume manufacturing? If so, we have an exciting opportunity for you. We’re looking for a New Product Introduction (NPI) Lead to spearhead the development and industrialization of our advanced Silicon Photonics products. In this role, you’ll be the go-to technical expert in assembly and packaging processes—playing a pivotal role in translating next-generation designs into scalable, production-ready solutions. This is more than just a technical role—this is your chance to shape the future of photonic manufacturing.
Base pay
$160,000.00/yr - $200,000.00/yr
Responsibilities
Own Process Development
– Lead the design, characterization, and optimization of critical processes like precision die bonding, wire bonding, and optical alignment.
Enable High-Volume Manufacturing (HVM)
– Define equipment specs, design custom tooling, and qualify processes for seamless scale-up.
Implement SPC & DOE
– Use advanced statistical methods to monitor process health, drive yield improvements, and ensure process stability.
Master Silicon Photonics Assembly
– Tackle complex packaging challenges involving fiber attach, thermal management, and high-density interconnects.
Drive Design for Manufacturability (DFM)
– Collaborate with design teams to ensure products are optimized for robust, high-yield production.
Boost Yields
– Lead root cause analyses and implement corrective/preventative actions to hit and exceed yield targets.
Lead Manufacturing Transfers
– Develop detailed documentation and manage the technical transfer of processes to contract manufacturing (CM) partners.
Skills & Experience
Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or related field; Master’s or PhD preferred.
5+ years of experience in NPI or process engineering within semiconductor, electronics, or photonics packaging.
Hands-on experience in assembly processes: die bonding, wire bonding, optical alignment.
Expertise in Silicon Photonics packaging.
Strong command of SPC, DOE, and statistical tools for manufacturing optimization.
Track record of ramping processes from R&D to high-volume manufacturing.
Deep materials knowledge (epoxies, solders) and process characterization expertise.
Experience with automation equipment and process qualification.
Proficiency with statistical software (JMP, Minitab).
Experience working with offshore CM partners.
Strong analytical, problem-solving, and communication skills.
What’s in it for you?
Salary up to $200k DOE
Bonus 10%-20%
Equity DOE
Medical and Dental
Job details
Seniority level: Mid-Senior level
Employment type: Full-time
Job function: Engineering, Product Management, and Manufacturing
Industries: Semiconductor Manufacturing, Computer Hardware Manufacturing, and Computers and Electronics Manufacturing
Referrals increase your chances of interviewing at Langham Recruitment by 2x
#J-18808-Ljbffr