Insight Global
Optoelectronics Packaging Design Engineer
Insight Global, San Francisco, California, United States, 94199
Base pay range
$120,000.00/yr - $200,000.00/yr
Job title
Optoelectronics Packaging Design Engineer
Location
San Francisco, CA (travel required)
Job description
We are looking for an Optoelectronics Packaging Design Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, manufacturing, systems, IC and operations to drive our packaging development.
Responsibilities
Lead the design, simulation, and development of high-performance IC package designs and chip carriers to meet product and qualification requirements. Own each IC package end-to-end.
Work across hardware engineering disciplines to design best-in-class package assemblies for advanced laser and opto-electronic ASIC chips operating in harsh environments.
Collaborate with manufacturing engineering and quality teams to ensure a seamless transition from prototype to high-volume production.
Define and execute test plans for package/system level reliability.
Conduct failure analysis to drive continuous improvement.
Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of substrates, epoxies, coated glass, PCBAs, and tooling.
Preferred Skills & Experience
5+ years in Semiconductor Package/Process Development or 2+ years with a relevant master’s degree.
Proficiency in 3D CAD (e.g., SolidWorks) and FEA simulation tools (e.g., ANSYS).
Hands-on experience with automated high-accuracy die bonding, wirebonding, and active optical alignment systems.
Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates.
Experience with optical systems (LiDAR, Camera, Microscope, etc.).
Seniority level
Mid-Senior level
Employment type
Full-time
Job function
Design
Industries
Semiconductor Manufacturing and Photography
Medical insurance
Vision insurance
401(k)
#J-18808-Ljbffr
$120,000.00/yr - $200,000.00/yr
Job title
Optoelectronics Packaging Design Engineer
Location
San Francisco, CA (travel required)
Job description
We are looking for an Optoelectronics Packaging Design Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, manufacturing, systems, IC and operations to drive our packaging development.
Responsibilities
Lead the design, simulation, and development of high-performance IC package designs and chip carriers to meet product and qualification requirements. Own each IC package end-to-end.
Work across hardware engineering disciplines to design best-in-class package assemblies for advanced laser and opto-electronic ASIC chips operating in harsh environments.
Collaborate with manufacturing engineering and quality teams to ensure a seamless transition from prototype to high-volume production.
Define and execute test plans for package/system level reliability.
Conduct failure analysis to drive continuous improvement.
Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of substrates, epoxies, coated glass, PCBAs, and tooling.
Preferred Skills & Experience
5+ years in Semiconductor Package/Process Development or 2+ years with a relevant master’s degree.
Proficiency in 3D CAD (e.g., SolidWorks) and FEA simulation tools (e.g., ANSYS).
Hands-on experience with automated high-accuracy die bonding, wirebonding, and active optical alignment systems.
Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates.
Experience with optical systems (LiDAR, Camera, Microscope, etc.).
Seniority level
Mid-Senior level
Employment type
Full-time
Job function
Design
Industries
Semiconductor Manufacturing and Photography
Medical insurance
Vision insurance
401(k)
#J-18808-Ljbffr