Nokia
Overview
Failure Analysis / Yield Improvement Engineer Responsible for failure analysis, with an emphasis on driving process and tool characterization, as well as yield improvement, in a wafer fab that manufactures photonic integrated circuits. This includes: Operating cross-section SEMs as well as Focused Ion Beam SEMs. Maintaining the health of SEM equipment Interfacing with equipment vendors for support Working with internal customers to understand their requests and provide the desired data Qualifications
Minimum Knowledge/Skills/Abilities Experience with Failure Analysis equipment in a wafer fab environment Data analysis skills Excellent communication skills, writing reports and presenting findings Work in a team environment consisting of engineers and operators Ability to work in a fast-paced environment and meet business needs with short deadlines Experience with III-V devices a plus Education Required: Requires a BS degree in Electrical Engineering, Materials Science, Physics or a related field, with a concentration in microelectronics, optoelectronics, electronics, or physics plus 2-3 years of experience or a MS degree in Electrical Engineering, Materials Science, Physics or a related field. Responsibilities
Prepare samples and perform failure analysis work (FIB/Cross-section/EDX/etc.) Review diagnostic/test data of current and next generation products to identify issues, plan FA next steps (what type of FA, sampling plan, etc.) Interpret FA outcomes and determine root cause of device failures Present FA findings and work with stakeholders to implement recommendations for improvement arising from FA analysis Coordinate with outside providers for FA work that cannot be done in-house
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Failure Analysis / Yield Improvement Engineer Responsible for failure analysis, with an emphasis on driving process and tool characterization, as well as yield improvement, in a wafer fab that manufactures photonic integrated circuits. This includes: Operating cross-section SEMs as well as Focused Ion Beam SEMs. Maintaining the health of SEM equipment Interfacing with equipment vendors for support Working with internal customers to understand their requests and provide the desired data Qualifications
Minimum Knowledge/Skills/Abilities Experience with Failure Analysis equipment in a wafer fab environment Data analysis skills Excellent communication skills, writing reports and presenting findings Work in a team environment consisting of engineers and operators Ability to work in a fast-paced environment and meet business needs with short deadlines Experience with III-V devices a plus Education Required: Requires a BS degree in Electrical Engineering, Materials Science, Physics or a related field, with a concentration in microelectronics, optoelectronics, electronics, or physics plus 2-3 years of experience or a MS degree in Electrical Engineering, Materials Science, Physics or a related field. Responsibilities
Prepare samples and perform failure analysis work (FIB/Cross-section/EDX/etc.) Review diagnostic/test data of current and next generation products to identify issues, plan FA next steps (what type of FA, sampling plan, etc.) Interpret FA outcomes and determine root cause of device failures Present FA findings and work with stakeholders to implement recommendations for improvement arising from FA analysis Coordinate with outside providers for FA work that cannot be done in-house
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