Qualcomm
Company:
Qualcomm Technologies, Inc. Job Area:
Engineering Group, Engineering Group > CPU Engineering General Summary:
Hiring in Multiple Locations Our Mission
We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing server-class high performance solutions that are highly optimized for the needs of the server product. We are seeking a highly experienced engineering lead to join our team. If you possess a deep understanding of Server SoC designs and have a passion for architecting and designing complex, high performance and low power designs at advanced process nodes, we would be pleased to hear from you. This critical role has the responsibility for planning and execution through all phases of the project from concept to commercialization across all engineering teams. The ideal candidate will have extensive knowledge of semiconductor architecture, design, test and commercialization of datacenter SoCs. The candidate is expected to work closely with other cross-functional leads of the product and drive resolution of all engineering issues within and across subsystems and chipset components. Ability to clearly communicate engineering status of the project is essential for excelling in this position. Minimum Qualifications
Bachelor\'s degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 8+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience. OR Master\'s degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 7+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience. OR PhD in Electrical Engineering, Computer Engineering, Computer Science, or related field and 6+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience.
Preferred Qualifications
Master\'s in Computer Science/Engineering, Electrical Engineering, or related field with 15 years of experience in semiconductor product development (Ex: System design, SoC architecture, HW design and validation, Silicon test, SW development).
Over 10 years of experience in one or more areas of semiconductor product development
5+ years in a technical leadership role
Expertise in architecting and/or designing high performance solutions in multiple functional areas of high performance SoCs. Ex: Memory, Coherent interconnects, CPUs, Chiplet infrastructure, Power Management, DFX, etc.
Experience in one or more aspects of commercializing a chipset including post-silicon validation, power and thermal convergence, silicon characterization and test, compliance certifications, etc.
5+ years of experience in engineering tradeoff analysis
Experience with ARM architecture and related SoC development
Proven track record in hyperscale data center solutions
Principal Duties and Responsibilities
Oversee chipset development and ensure KPIs are met (PPA, schedule, cost) by working with various domain experts
Drive resolution of all engineering issues on the chipset within and across various functional blocks and components of the chipset.
Identify key risks to the project and mitigate them
Identify gaps in existing processes and influence development of new methodologies to ensure product KPIs and specifications are met.
Must have good communication skills and able to work in dynamic environment with top level engineers and technologists
Level of Responsibility
Provides supervision to direct reports.
Decision-making is significant in nature and affects work beyond immediate work group.
Requires verbal and written communication skills to convey complex information. May require negotiation, influence, tact, etc.
Has a great degree of influence over key organizational decisions.
Tasks often require multiple steps which can be performed in various orders; extensive planning, problem-solving, and prioritization must occur to complete the tasks effectively.
Equal Employment Opportunity
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process. Disability-accommodations@qualcomm.com Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (We will not respond here to requests for updates on applications or resume inquiries). Pay range and Other Compensation & Benefits
$233,000.00 - $349,600.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Salary is one component of total compensation; Qualcomm offers a competitive discretionary bonus program and potential RSU grants. Benefits are described in the company materials and discussed with the recruiter.
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Qualcomm Technologies, Inc. Job Area:
Engineering Group, Engineering Group > CPU Engineering General Summary:
Hiring in Multiple Locations Our Mission
We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing server-class high performance solutions that are highly optimized for the needs of the server product. We are seeking a highly experienced engineering lead to join our team. If you possess a deep understanding of Server SoC designs and have a passion for architecting and designing complex, high performance and low power designs at advanced process nodes, we would be pleased to hear from you. This critical role has the responsibility for planning and execution through all phases of the project from concept to commercialization across all engineering teams. The ideal candidate will have extensive knowledge of semiconductor architecture, design, test and commercialization of datacenter SoCs. The candidate is expected to work closely with other cross-functional leads of the product and drive resolution of all engineering issues within and across subsystems and chipset components. Ability to clearly communicate engineering status of the project is essential for excelling in this position. Minimum Qualifications
Bachelor\'s degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 8+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience. OR Master\'s degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 7+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience. OR PhD in Electrical Engineering, Computer Engineering, Computer Science, or related field and 6+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience.
Preferred Qualifications
Master\'s in Computer Science/Engineering, Electrical Engineering, or related field with 15 years of experience in semiconductor product development (Ex: System design, SoC architecture, HW design and validation, Silicon test, SW development).
Over 10 years of experience in one or more areas of semiconductor product development
5+ years in a technical leadership role
Expertise in architecting and/or designing high performance solutions in multiple functional areas of high performance SoCs. Ex: Memory, Coherent interconnects, CPUs, Chiplet infrastructure, Power Management, DFX, etc.
Experience in one or more aspects of commercializing a chipset including post-silicon validation, power and thermal convergence, silicon characterization and test, compliance certifications, etc.
5+ years of experience in engineering tradeoff analysis
Experience with ARM architecture and related SoC development
Proven track record in hyperscale data center solutions
Principal Duties and Responsibilities
Oversee chipset development and ensure KPIs are met (PPA, schedule, cost) by working with various domain experts
Drive resolution of all engineering issues on the chipset within and across various functional blocks and components of the chipset.
Identify key risks to the project and mitigate them
Identify gaps in existing processes and influence development of new methodologies to ensure product KPIs and specifications are met.
Must have good communication skills and able to work in dynamic environment with top level engineers and technologists
Level of Responsibility
Provides supervision to direct reports.
Decision-making is significant in nature and affects work beyond immediate work group.
Requires verbal and written communication skills to convey complex information. May require negotiation, influence, tact, etc.
Has a great degree of influence over key organizational decisions.
Tasks often require multiple steps which can be performed in various orders; extensive planning, problem-solving, and prioritization must occur to complete the tasks effectively.
Equal Employment Opportunity
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process. Disability-accommodations@qualcomm.com Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (We will not respond here to requests for updates on applications or resume inquiries). Pay range and Other Compensation & Benefits
$233,000.00 - $349,600.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Salary is one component of total compensation; Qualcomm offers a competitive discretionary bonus program and potential RSU grants. Benefits are described in the company materials and discussed with the recruiter.
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