Xscape Photonics Inc
We are seeking a highly skilled and motivated NPI (New Product Introduction) Lead to own the manufacturing process development for our state-of-the-art photonic products.
This is a hands-on role responsible for bridging the gap between design and high-volume production.
You will be the technical expert for our assembly and packaging processes, with a special focus on Silicon Photonics devices. Your primary mission will be to develop robust, scalable, and cost-effective manufacturing processes and transfer them successfully to our production partners.
If you are a data-driven engineer who thrives on solving complex manufacturing challenges, this is the role for you.
What You'll Do (Responsibilities)
Process Development & Optimization: Lead the hands-on development, characterization, and optimization of core assembly processes, alignment. High-Volume Scalability: Design, develop, and qualify manufacturing processes and equipment with a clear path to ramping to high-volume manufacturing (HVM). Statistical Process Control (SPC): Implement and manage SPC for critical process parameters. Silicon Photonics Assembly: Serve as the subject matter expert for the unique challenges associated with Silicon Photonics device assembly. Design for Manufacturability (DFM): Work closely with the design engineering team to provide critical DFM feedback. Yield Improvement: Drive root cause analysis for yield excursions and process failures. What You'll Bring (Qualifications)
Minimum Qualifications: Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field. 5+ years of experience in a process engineering or NPI role within the semiconductor, electronics, or photonics packaging industry. Direct, hands-on experience developing and sustaining key assembly processes such as precision die bonding, wire bonding, and optical alignment. Demonstrated experience working with Silicon Photonics devices and their associated assembly and packaging processes. Proficiency in applying Statistical Process Control (SPC) and Design of Experiments (DOE) to solve manufacturing problems. Preferred Qualifications
Master’s degree or PhD in a relevant technical discipline. A proven track record of successfully developing manufacturing processes and ramping them into high-volume manufacturing. Deep expertise in materials and characterization techniques used in microelectronic and photonic assembly.
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Process Development & Optimization: Lead the hands-on development, characterization, and optimization of core assembly processes, alignment. High-Volume Scalability: Design, develop, and qualify manufacturing processes and equipment with a clear path to ramping to high-volume manufacturing (HVM). Statistical Process Control (SPC): Implement and manage SPC for critical process parameters. Silicon Photonics Assembly: Serve as the subject matter expert for the unique challenges associated with Silicon Photonics device assembly. Design for Manufacturability (DFM): Work closely with the design engineering team to provide critical DFM feedback. Yield Improvement: Drive root cause analysis for yield excursions and process failures. What You'll Bring (Qualifications)
Minimum Qualifications: Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field. 5+ years of experience in a process engineering or NPI role within the semiconductor, electronics, or photonics packaging industry. Direct, hands-on experience developing and sustaining key assembly processes such as precision die bonding, wire bonding, and optical alignment. Demonstrated experience working with Silicon Photonics devices and their associated assembly and packaging processes. Proficiency in applying Statistical Process Control (SPC) and Design of Experiments (DOE) to solve manufacturing problems. Preferred Qualifications
Master’s degree or PhD in a relevant technical discipline. A proven track record of successfully developing manufacturing processes and ramping them into high-volume manufacturing. Deep expertise in materials and characterization techniques used in microelectronic and photonic assembly.
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