Nokia
Position:
Mechanical Packaging Engineer Co-op Number of Positions:
1 Date:
January 2026 - May 2026 Duration:
4 months Location:
Sunnyvale, CA or New York, NY - Onsite EDUCATIONAL RECOMMENDATIONS Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US. Qualifications
Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software. Experience with thermal and thermo-mechanical simulations using ANSYS or similar software. Experience with documentation of fabrication, inspection, and assembly processes. Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. It would be nice if you also had: Knowledge of design for manufacturing of 2.5D/3D packaging. Experience in high-speed electronics package design and/or laser package design. Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience. Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
Responsibilities
Design advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings. Perform mechanical integrity and thermal simulations, tolerance analyses and characterization. Plan and drive prototype assembly builds with contract manufacturers for early design validation. Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements. Drive package debug activities during product validation and qualification.
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Mechanical Packaging Engineer Co-op Number of Positions:
1 Date:
January 2026 - May 2026 Duration:
4 months Location:
Sunnyvale, CA or New York, NY - Onsite EDUCATIONAL RECOMMENDATIONS Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US. Qualifications
Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software. Experience with thermal and thermo-mechanical simulations using ANSYS or similar software. Experience with documentation of fabrication, inspection, and assembly processes. Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. It would be nice if you also had: Knowledge of design for manufacturing of 2.5D/3D packaging. Experience in high-speed electronics package design and/or laser package design. Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience. Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
Responsibilities
Design advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings. Perform mechanical integrity and thermal simulations, tolerance analyses and characterization. Plan and drive prototype assembly builds with contract manufacturers for early design validation. Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements. Drive package debug activities during product validation and qualification.
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