TSMC - Taiwan Semiconductor Manufacturing Company Limited
COUPE Design and Flow Development Engineer (7091)
TSMC - Taiwan Semiconductor Manufacturing Company Limited, California, Missouri, United States, 65018
We are seeking a highly skilled and motivated Design Flow and System Integration Engineer to join our advanced COUPE (Compact Universal Photonic Engine) design flow team. The ideal candidate will bring strong expertise in silicon photonics tape-out, photonic device physics, and hands-on experience with EDA tools. This role will directly support the integration of photonic engines into 3DIC infrastructure, enabling next-generation optical/electrical COUPE technologies and supporting strategic customer programs.
Responsibilities
Design, simulate, and analyze optical, analog, and RF circuits for COUPE applications. Develop and scale bandwidth in simulations for next-generation optical chip design. Collaborate with process R&D, EDA partners, and cross-functional teams to drive DTCO/STCO efforts. Integrate COUPE optical engines into 3DIC structures to support high-bandwidth transceiver applications. Enhance design flows and verification processes to ensure alignment with customer requirements. Contribute to long-term CPO technology roadmap and system-level integration projects. Required Skills
Master's or Ph.D. in Optoelectronics, Electrical Engineering, or related field. Proven silicon photonics tape-out experience. Strong knowledge of photonic device physics and semiconductor fundamentals. At least 15+ years of experience in circuit design, device modeling, and use of EDA tools. Excellent problem-solving and collaboration skills in fast-paced environments. Preferred Skills
Familiarity with scripting languages (Python, Perl) for design automation. Experience with reliability analysis (electromigration, IR-drop, thermal). Knowledge of high-speed data link and system budgets. Exposure to machine learning or AI methods for design optimization. Experience with DTCO and 3DIC integration of photonic systems. Location
San Jose, CA or Hsinchu, Taiwan. Why TSMC?
At TSMC, we are at the forefront of semiconductor innovation, enabling the most advanced technologies in the world. By joining our team, you will work on cutting-edge challenges in high-performance computing, 2.5D/3DIC integration, and power distribution networks that directly shape the future of technology. We offer an environment that fosters collaboration, growth, and impact—empowering you to bring groundbreaking ideas to life. TSMC Commitment to Diversity
TSMC Technology, Inc. is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law. Pay Transparency / Benefits statement
At TSMC, your base pay is only part of your overall total compensation package. This role typically pays a base salary between $153,500 and $250,000 per year. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range.
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Design, simulate, and analyze optical, analog, and RF circuits for COUPE applications. Develop and scale bandwidth in simulations for next-generation optical chip design. Collaborate with process R&D, EDA partners, and cross-functional teams to drive DTCO/STCO efforts. Integrate COUPE optical engines into 3DIC structures to support high-bandwidth transceiver applications. Enhance design flows and verification processes to ensure alignment with customer requirements. Contribute to long-term CPO technology roadmap and system-level integration projects. Required Skills
Master's or Ph.D. in Optoelectronics, Electrical Engineering, or related field. Proven silicon photonics tape-out experience. Strong knowledge of photonic device physics and semiconductor fundamentals. At least 15+ years of experience in circuit design, device modeling, and use of EDA tools. Excellent problem-solving and collaboration skills in fast-paced environments. Preferred Skills
Familiarity with scripting languages (Python, Perl) for design automation. Experience with reliability analysis (electromigration, IR-drop, thermal). Knowledge of high-speed data link and system budgets. Exposure to machine learning or AI methods for design optimization. Experience with DTCO and 3DIC integration of photonic systems. Location
San Jose, CA or Hsinchu, Taiwan. Why TSMC?
At TSMC, we are at the forefront of semiconductor innovation, enabling the most advanced technologies in the world. By joining our team, you will work on cutting-edge challenges in high-performance computing, 2.5D/3DIC integration, and power distribution networks that directly shape the future of technology. We offer an environment that fosters collaboration, growth, and impact—empowering you to bring groundbreaking ideas to life. TSMC Commitment to Diversity
TSMC Technology, Inc. is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law. Pay Transparency / Benefits statement
At TSMC, your base pay is only part of your overall total compensation package. This role typically pays a base salary between $153,500 and $250,000 per year. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range.
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