Inside Higher Ed
Associate Research Scientist (PREP0003538)
Inside Higher Ed, Baltimore, Maryland, United States, 21276
Associate Research Scientist (PREP0003538)
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Associate Research Scientist (PREP0003538)
role at
Inside Higher Ed
PREP Research Associate – CHIPS Funded Project
This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. Employees in this position will perform technical work that underpins the scientific research of the collaboration.
Research Title
Reliability Testing and Failure Analysis for Advanced Packaging of CHIPS
The Work Will Entail
The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a researcher with knowledge of reliability testing and modeling for advanced semiconductor packaging and extensive expertise in one or more of the following technical areas: polymer degradation, thermal and mechanical analysis, failure analysis using microscopy, spectroscopy, or scattering based techniques, accelerated laboratory testing and thin film characterization. If selected, you will play a significant role in projects related to reliability testing and modeling for advanced packaging in semiconductors. This includes working with NIST staff and external partners on planning and executing experimental research to evaluate changes in mechanical, thermal, and electrical properties of polymeric materials used in advanced packaging in CHIPS after aging under environmental stresses. The results will be used to understand the failure mechanism, develop more accurate prediction models for long‑term reliability of advanced packaging, and provide a scientific basis for test method development, material selection, and product quality assurance for the semiconductor industry.
Key Responsibilities Will Include But Are Not Limited To
Characterizing the degradation of materials and interfaces before, during, and after exposure to accelerated laboratory aging.
Developing thermal conductivity/thermal resistance and specific thermal analyzers for samples used in CHIPS advanced packaging.
Conducting in‑situ mechanical property (elastic modulus, storage modulus, material creep, relaxation, adhesion) measurements at different temperatures.
Developing test protocol for X‑ray computed tomography for analysis of packaged samples before and after multi‑stress testing.
Developing microscopic and spectroscopic analytical methods for complex advanced packaging systems.
Developing robust datasets of materials and interface properties before and after aging for reliability models.
Disseminating research results through presentations at conferences, publication of journal papers, and technical reports.
Qualifications – U.S. Citizen
Ph.D. in Materials Science / Mechanical Engineering / Electrical Engineering / Physics / Chemical Engineering / Chemistry.
Strong oral and written communication skills.
Experience in: X‑ray scattering or computed tomography; nano‑ and micro‑scale materials characterization; degradation or failure analysis of polymeric materials; experience in advanced semiconductor packaging is preferred.
Application Instructions Please Upload The Following With Your Application
CV/Resume.
Please limit the CV to 3 pages only and only include a valid email address for your contact info. Do not include telephone numbers, home address, or photos on your resume.
Privacy Act Statement
Authority:
15 U.S.C.
278g-1(e)(1) and (e)(3) and 15 U.S.C.
272(b) and (c)
Purpose:
The National Institute for Standards and Technology (NIST) hosts the Professional Research Experience Program (PREP) which is designed to provide valuable laboratory experience and financial assistance to undergraduates, post‑bachelor's degree holders, graduate students, master's degree holders, postdocs, and faculty.
Routine Uses:
NIST will use the information collected to perform the requisite reviews of the applications to determine eligibility, and to meet programmatic requirements. Disclosure of this information is also subject to all the published routine uses as identified in the Privacy Act System of Records Notices: NIST-1: NIST Associates.
Disclosure:
Furnishing this information is voluntary. When you submit the form, you are indicating your voluntary consent for NIST to use the information you submit for the purpose stated. By applying to a CHIPS‑funded PREP opportunity, you also acknowledge that participation in the project requires signing a Non‑Disclosure Agreement (NDA) prior to beginning any work.
To apply for this position, visit: apply.interfolio.com/169499
Equal Opportunity Employer
The Johns Hopkins University is committed to equal opportunity for its faculty, staff, and students. To that end, the university does not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status or other legally protected characteristic. The university is committed to providing qualified individuals access to all academic and employment programs, benefits and activities on the basis of demonstrated ability, performance and merit without regard to personal factors that are irrelevant to the program involved.
Background Checks
The successful candidate(s) for this position will be subject to a pre‑employment background check including education verification.
EEO Is The Law
https://www.eeoc.gov/sites/default/files/2023-06/22-088_EEOC_KnowYourRights6.12ScreenRdr.pdf
Diversity and Inclusion
The Johns Hopkins University values diversity, equity and inclusion and advances these through our key strategic framework, the JHU Roadmap on Diversity and Inclusion.
Vaccine Requirements
Johns Hopkins University strongly encourages, but no longer requires, at least one dose of the COVID‑19 vaccine. The COVID‑19 vaccine does not apply to positions located in the State of Florida. We still require all faculty, staff, and students to receive the seasonal flu vaccine.
#J-18808-Ljbffr
Associate Research Scientist (PREP0003538)
role at
Inside Higher Ed
PREP Research Associate – CHIPS Funded Project
This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. Employees in this position will perform technical work that underpins the scientific research of the collaboration.
Research Title
Reliability Testing and Failure Analysis for Advanced Packaging of CHIPS
The Work Will Entail
The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a researcher with knowledge of reliability testing and modeling for advanced semiconductor packaging and extensive expertise in one or more of the following technical areas: polymer degradation, thermal and mechanical analysis, failure analysis using microscopy, spectroscopy, or scattering based techniques, accelerated laboratory testing and thin film characterization. If selected, you will play a significant role in projects related to reliability testing and modeling for advanced packaging in semiconductors. This includes working with NIST staff and external partners on planning and executing experimental research to evaluate changes in mechanical, thermal, and electrical properties of polymeric materials used in advanced packaging in CHIPS after aging under environmental stresses. The results will be used to understand the failure mechanism, develop more accurate prediction models for long‑term reliability of advanced packaging, and provide a scientific basis for test method development, material selection, and product quality assurance for the semiconductor industry.
Key Responsibilities Will Include But Are Not Limited To
Characterizing the degradation of materials and interfaces before, during, and after exposure to accelerated laboratory aging.
Developing thermal conductivity/thermal resistance and specific thermal analyzers for samples used in CHIPS advanced packaging.
Conducting in‑situ mechanical property (elastic modulus, storage modulus, material creep, relaxation, adhesion) measurements at different temperatures.
Developing test protocol for X‑ray computed tomography for analysis of packaged samples before and after multi‑stress testing.
Developing microscopic and spectroscopic analytical methods for complex advanced packaging systems.
Developing robust datasets of materials and interface properties before and after aging for reliability models.
Disseminating research results through presentations at conferences, publication of journal papers, and technical reports.
Qualifications – U.S. Citizen
Ph.D. in Materials Science / Mechanical Engineering / Electrical Engineering / Physics / Chemical Engineering / Chemistry.
Strong oral and written communication skills.
Experience in: X‑ray scattering or computed tomography; nano‑ and micro‑scale materials characterization; degradation or failure analysis of polymeric materials; experience in advanced semiconductor packaging is preferred.
Application Instructions Please Upload The Following With Your Application
CV/Resume.
Please limit the CV to 3 pages only and only include a valid email address for your contact info. Do not include telephone numbers, home address, or photos on your resume.
Privacy Act Statement
Authority:
15 U.S.C.
278g-1(e)(1) and (e)(3) and 15 U.S.C.
272(b) and (c)
Purpose:
The National Institute for Standards and Technology (NIST) hosts the Professional Research Experience Program (PREP) which is designed to provide valuable laboratory experience and financial assistance to undergraduates, post‑bachelor's degree holders, graduate students, master's degree holders, postdocs, and faculty.
Routine Uses:
NIST will use the information collected to perform the requisite reviews of the applications to determine eligibility, and to meet programmatic requirements. Disclosure of this information is also subject to all the published routine uses as identified in the Privacy Act System of Records Notices: NIST-1: NIST Associates.
Disclosure:
Furnishing this information is voluntary. When you submit the form, you are indicating your voluntary consent for NIST to use the information you submit for the purpose stated. By applying to a CHIPS‑funded PREP opportunity, you also acknowledge that participation in the project requires signing a Non‑Disclosure Agreement (NDA) prior to beginning any work.
To apply for this position, visit: apply.interfolio.com/169499
Equal Opportunity Employer
The Johns Hopkins University is committed to equal opportunity for its faculty, staff, and students. To that end, the university does not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status or other legally protected characteristic. The university is committed to providing qualified individuals access to all academic and employment programs, benefits and activities on the basis of demonstrated ability, performance and merit without regard to personal factors that are irrelevant to the program involved.
Background Checks
The successful candidate(s) for this position will be subject to a pre‑employment background check including education verification.
EEO Is The Law
https://www.eeoc.gov/sites/default/files/2023-06/22-088_EEOC_KnowYourRights6.12ScreenRdr.pdf
Diversity and Inclusion
The Johns Hopkins University values diversity, equity and inclusion and advances these through our key strategic framework, the JHU Roadmap on Diversity and Inclusion.
Vaccine Requirements
Johns Hopkins University strongly encourages, but no longer requires, at least one dose of the COVID‑19 vaccine. The COVID‑19 vaccine does not apply to positions located in the State of Florida. We still require all faculty, staff, and students to receive the seasonal flu vaccine.
#J-18808-Ljbffr