Barrington James
Overview
Quantum Computing Recruitment Consultant at Barrington James Our client is a venture-backed, pre-IPO technology company focused on data center and high-performance computing (HPC). They are developing ultra-high-density optical interconnect solutions to address AI and machine learning data bottlenecks, with a world-class team in photonics, electronics, and advanced packaging. Position Summary
Director of Advanced Photonic Packaging to lead the design and development of state-of-the-art optical interconnect products. This strategic role requires a leader who understands that advanced packaging is a critical component of system-level performance in high-speed systems. The ideal candidate will be an expert in semiconductor or optical packaging with deep understanding of high-speed electrical challenges. You will build and mentor a world-class packaging and signal/power integrity team, define the technical roadmap, and drive execution of packaging solutions essential to the company’s success. Key Responsibilities
Develop and execute the long-term packaging strategy for co-packaged optics and high-density optical engines. Drive innovation in package design, materials, and assembly processes to meet performance, power, and cost targets. Recruit, lead, and mentor a high-performing team, starting with a foundational SI/PI Engineer. Foster a culture of technical excellence, cross-functional collaboration, and innovation. Lead architectural design and validation of complex packages, ensuring robust thermal management, optical alignment, and mechanical stability. Provide expert oversight on all Signal Integrity (SI) and Power Integrity (PI) challenges for high-speed electrical I/O in advanced packages. Guide design trade-offs. Collaborate with IC design, photonics, and systems engineering to define requirements and ensure the package is optimized as part of the overall product. Manage relationships with OSATs and other supply chain vendors to ensure successful New Product Introduction (NPI) and transition to high-volume manufacturing (HVM). Essential Qualifications & Experience
Master’s Degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, or related field. 10+ years of experience in semiconductor, electronics, or photonics packaging, with at least 3 years in a leadership or management role. Demonstrable, in-depth understanding of Signal Integrity (SI) and Power Integrity (PI) for high-speed systems (e.g., 100G/200G+ per lane). Proven experience with advanced packaging technologies such as 2.5D/3D integration, System-in-Package (SiP), flip-chip, and Through-Silicon Vias (TSVs). Strong track record of leading complex packaging projects from concept through mass production. Excellent leadership, communication, and interpersonal skills with the ability to articulate complex technical concepts to both technical and non-technical audiences. Preferred Qualifications
Direct experience with co-packaged optics (CPO) and integrating photonics with high-performance ASICs. Familiarity with industry-standard EDA tools for packaging and SI/PI analysis (e.g., Ansys HFSS, Siwave, Cadence Sigrity/Allegro). Experience designing packages for high-volume, cost-sensitive markets. Established relationships with leading OSATs and packaging material suppliers. How to Apply
Please click "apply" or contact Chris Green, a specialist recruiter, for more information about the opportunity and potential for career growth. Chris can also discuss other opportunities that are available now or imminently becoming available. Note: This position has been highly popular and may close soon. Apply promptly to avoid disappointment. --- Employment details Location: New Jersey, United States (various cities listed below) Salary ranges vary by location and role; listed examples include New Jersey cities such as Jersey City, Elizabeth, Parsippany, and others. Job Functions & Industry
Job function: Science, Engineering, and Management Industries: Semiconductor Manufacturing and Research Services
#J-18808-Ljbffr
Quantum Computing Recruitment Consultant at Barrington James Our client is a venture-backed, pre-IPO technology company focused on data center and high-performance computing (HPC). They are developing ultra-high-density optical interconnect solutions to address AI and machine learning data bottlenecks, with a world-class team in photonics, electronics, and advanced packaging. Position Summary
Director of Advanced Photonic Packaging to lead the design and development of state-of-the-art optical interconnect products. This strategic role requires a leader who understands that advanced packaging is a critical component of system-level performance in high-speed systems. The ideal candidate will be an expert in semiconductor or optical packaging with deep understanding of high-speed electrical challenges. You will build and mentor a world-class packaging and signal/power integrity team, define the technical roadmap, and drive execution of packaging solutions essential to the company’s success. Key Responsibilities
Develop and execute the long-term packaging strategy for co-packaged optics and high-density optical engines. Drive innovation in package design, materials, and assembly processes to meet performance, power, and cost targets. Recruit, lead, and mentor a high-performing team, starting with a foundational SI/PI Engineer. Foster a culture of technical excellence, cross-functional collaboration, and innovation. Lead architectural design and validation of complex packages, ensuring robust thermal management, optical alignment, and mechanical stability. Provide expert oversight on all Signal Integrity (SI) and Power Integrity (PI) challenges for high-speed electrical I/O in advanced packages. Guide design trade-offs. Collaborate with IC design, photonics, and systems engineering to define requirements and ensure the package is optimized as part of the overall product. Manage relationships with OSATs and other supply chain vendors to ensure successful New Product Introduction (NPI) and transition to high-volume manufacturing (HVM). Essential Qualifications & Experience
Master’s Degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, or related field. 10+ years of experience in semiconductor, electronics, or photonics packaging, with at least 3 years in a leadership or management role. Demonstrable, in-depth understanding of Signal Integrity (SI) and Power Integrity (PI) for high-speed systems (e.g., 100G/200G+ per lane). Proven experience with advanced packaging technologies such as 2.5D/3D integration, System-in-Package (SiP), flip-chip, and Through-Silicon Vias (TSVs). Strong track record of leading complex packaging projects from concept through mass production. Excellent leadership, communication, and interpersonal skills with the ability to articulate complex technical concepts to both technical and non-technical audiences. Preferred Qualifications
Direct experience with co-packaged optics (CPO) and integrating photonics with high-performance ASICs. Familiarity with industry-standard EDA tools for packaging and SI/PI analysis (e.g., Ansys HFSS, Siwave, Cadence Sigrity/Allegro). Experience designing packages for high-volume, cost-sensitive markets. Established relationships with leading OSATs and packaging material suppliers. How to Apply
Please click "apply" or contact Chris Green, a specialist recruiter, for more information about the opportunity and potential for career growth. Chris can also discuss other opportunities that are available now or imminently becoming available. Note: This position has been highly popular and may close soon. Apply promptly to avoid disappointment. --- Employment details Location: New Jersey, United States (various cities listed below) Salary ranges vary by location and role; listed examples include New Jersey cities such as Jersey City, Elizabeth, Parsippany, and others. Job Functions & Industry
Job function: Science, Engineering, and Management Industries: Semiconductor Manufacturing and Research Services
#J-18808-Ljbffr