Broadcom Inc.
* **Support high data rate SerDes applications - up to 112Gbps NRZ and 224G PAM4 systems*** **System level Signal and Power Integrity design trade-offs and debug.*** **Collaborate with package, PCB, and silicon designers to complete measurement-simulation correlation projects.*** **Develop models with electromagnetic field solvers: primarily with Ansys HFSS and electronic suite.*** **Ability to understand laminate design and fabrication techniques and limitations for both package and PCB designs.*** **Evaluate system, PCB and package material and connector solutions for future designs.*** **Simulate schematic models and environments within Keysight ADS.*** **Ensure and know trade-offs for the accuracy of models (3D/2.5D/2D) used for design simulations.*** **Perform and develop VNA/TDR (50GHz+) measurement techniques and correlate with models and simulations.*** **Provide feedback and learnings from measurement-simulation correlation investigations to improve best practices for modeling and simulations.*** **Capture high fidelity lab measurements to be used for correlation and debug purposes*** **Experience with sampling and real-time oscilloscopes, spectrum analyzers, and optical oscilloscopes.*** **Understand and apply:**
+ **High speed data communications**
+ **Transmission-line and electromagnetic-field theory**
+ **Numerical analysis**
+ **VNA/TDR measurements**
+ **Bit-by-bit and Statistical simulators for serial data (SerDes) links**
+ **Insertion loss, return loss, crosstalk, BER, jitter, and statistical eye diagrams**
+ **Work in either time domain or frequency domain**
+ **Phase noise analysis as it applies to PLL’s, reference clocks, SerDes TX-RX links**
+ **Jitter sensitivity measurement and analysis for SerDes IP*** **Organize and manage multiple projects*** **Develop, clearly and effectively document, and track project plans*** **Effectively communicate complex concepts in conversation, presentations and written documents*** **Determine and document applicable requirements for ASIC package and PCB designs, drawing from industry standards, customer requirements, and/or APD Broadcom’s internal performance goals*** **Collaborate with Package and PCB Engineers to fulfill System SI requirements, while balancing objectives (reliability, cost, complexity, etc.)*** **Pre-layout and post-layout modeling and simulation to support package and PCB engineering for signal integrity*** **Document and deliver SI models with supporting documentation to customer and internal engineers*** **Support customer analysis and debug efforts related to our deliverables*** **Understanding of optical/electrical engine concepts and theory of operation, CWDM, OMA, etc..*** **Familiarity with optical channel impairments such as chromatic dispersion (CD) and four-wave mixing (FWM).*** **Power Integrity Concepts:
PDN impedance analysis and design, ultra-low impedance measurements, understanding of SMT capacitor performance metrics, use of CPA and/or SI-Wave for PDN simulations.**- **BS +8yrs, MS +6 yrs or PhD +3yrs Electrical Engineering or Physics and
years experience in one or more of:**
* **Signal/Power integrity for high-speed digital applications**
* **Electromagnetic transmission line theory**
* **Microwave theory**
* **Numerical Field solver theory**
* **Power integrity**
* **IC package design**
* **Photonics** #J-18808-Ljbffr
+ **High speed data communications**
+ **Transmission-line and electromagnetic-field theory**
+ **Numerical analysis**
+ **VNA/TDR measurements**
+ **Bit-by-bit and Statistical simulators for serial data (SerDes) links**
+ **Insertion loss, return loss, crosstalk, BER, jitter, and statistical eye diagrams**
+ **Work in either time domain or frequency domain**
+ **Phase noise analysis as it applies to PLL’s, reference clocks, SerDes TX-RX links**
+ **Jitter sensitivity measurement and analysis for SerDes IP*** **Organize and manage multiple projects*** **Develop, clearly and effectively document, and track project plans*** **Effectively communicate complex concepts in conversation, presentations and written documents*** **Determine and document applicable requirements for ASIC package and PCB designs, drawing from industry standards, customer requirements, and/or APD Broadcom’s internal performance goals*** **Collaborate with Package and PCB Engineers to fulfill System SI requirements, while balancing objectives (reliability, cost, complexity, etc.)*** **Pre-layout and post-layout modeling and simulation to support package and PCB engineering for signal integrity*** **Document and deliver SI models with supporting documentation to customer and internal engineers*** **Support customer analysis and debug efforts related to our deliverables*** **Understanding of optical/electrical engine concepts and theory of operation, CWDM, OMA, etc..*** **Familiarity with optical channel impairments such as chromatic dispersion (CD) and four-wave mixing (FWM).*** **Power Integrity Concepts:
PDN impedance analysis and design, ultra-low impedance measurements, understanding of SMT capacitor performance metrics, use of CPA and/or SI-Wave for PDN simulations.**- **BS +8yrs, MS +6 yrs or PhD +3yrs Electrical Engineering or Physics and
years experience in one or more of:**
* **Signal/Power integrity for high-speed digital applications**
* **Electromagnetic transmission line theory**
* **Microwave theory**
* **Numerical Field solver theory**
* **Power integrity**
* **IC package design**
* **Photonics** #J-18808-Ljbffr