Broadcom Inc.
* Support high data rate SerDes applications - up to 112Gbps NRZ and 224G PAM4 systems* System level Signal and Power Integrity design trade-offs and debug* Collaborate with package, PCB, and silicon designers to complete measurement-simulation correlation projects* Develop models with electromagnetic field solvers: primarily with Ansys HFSS and electronic suite.* Ability to understand laminate design and fabrication techniques and limitations for both package and PCB designs.* Evaluate system, PCB and package material and connector solutions for future designs.* Simulate schematic models and environments within Keysight ADS.* Ensure and know trade-offs for the accuracy of models (3D/2.5D/2D) used for design simulations.* Perform and develop VNA/TDR (50GHz+) measurement techniques and correlate with models and simulations.* Provide feedback and learnings from measurement-simulation correlation investigations to improve best practices for modeling and simulations.* Capture high fidelity lab measurements to be used for correlation and debug purposes
+ Experience with sampling and real-time oscilloscopes, spectrum analyzers, and optical oscilloscopes.* High speed data communications* Transmission-line and electromagnetic-field theory* Numerical analysis* VNA/TDR measurements* Bit-by-bit and Statistical simulators for serial data (SerDes) links* Insertion loss, return loss, crosstalk, BER, jitter, and statistical eye diagrams* Work in either time domain or frequency domain* Phase noise analysis as it applies to PLL’s, reference clocks, SerDes TX-RX links* Jitter sensitivity measurement and analysis for SerDes IP* Organize and manage multiple projects* Develop, clearly and effectively document, and track project plans* Effectively communicate complex concepts in conversation, presentations and written documents* Determine and document applicable requirements for ASIC package and PCB designs, drawing from industry standards, customer requirements, and/or APD Broadcom’s internal performance goals* Collaborate with Package and PCB Engineers to fulfill System SI requirements, while balancing objectives (reliability, cost, complexity, etc.)* Pre-layout and post-layout modeling and simulation to support package and PCB engineering for signal integrity* Document and deliver SI models with supporting documentation to customer and internal engineers* Support customer analysis and debug efforts related to our deliverables* Understanding of optical/electrical engine concepts and theory of operation, CWDM, OMA, etc..* Familiarity with optical channel impairments such as chromatic dispersion (CD) and four-wave mixing (FWM).* Power Integrity Concepts:
PDN impedance analysis and design, ultra-low impedance measurements, understanding of SMT capacitor performance metrics, use of CPA and/or SI-Wave for PDN simulations.- BS and 12+ yrs, MS and 10+ yrs or PhD and 7+yrs Electrical Engineering or Physics experience in one or more of:
* Signal integrity for high-speed digital applications
* Electromagnetic transmission line theory
* Microwave theory
* Numerical Field solver theory
* Power integrity
* IC package design
* Photonics #J-18808-Ljbffr
+ Experience with sampling and real-time oscilloscopes, spectrum analyzers, and optical oscilloscopes.* High speed data communications* Transmission-line and electromagnetic-field theory* Numerical analysis* VNA/TDR measurements* Bit-by-bit and Statistical simulators for serial data (SerDes) links* Insertion loss, return loss, crosstalk, BER, jitter, and statistical eye diagrams* Work in either time domain or frequency domain* Phase noise analysis as it applies to PLL’s, reference clocks, SerDes TX-RX links* Jitter sensitivity measurement and analysis for SerDes IP* Organize and manage multiple projects* Develop, clearly and effectively document, and track project plans* Effectively communicate complex concepts in conversation, presentations and written documents* Determine and document applicable requirements for ASIC package and PCB designs, drawing from industry standards, customer requirements, and/or APD Broadcom’s internal performance goals* Collaborate with Package and PCB Engineers to fulfill System SI requirements, while balancing objectives (reliability, cost, complexity, etc.)* Pre-layout and post-layout modeling and simulation to support package and PCB engineering for signal integrity* Document and deliver SI models with supporting documentation to customer and internal engineers* Support customer analysis and debug efforts related to our deliverables* Understanding of optical/electrical engine concepts and theory of operation, CWDM, OMA, etc..* Familiarity with optical channel impairments such as chromatic dispersion (CD) and four-wave mixing (FWM).* Power Integrity Concepts:
PDN impedance analysis and design, ultra-low impedance measurements, understanding of SMT capacitor performance metrics, use of CPA and/or SI-Wave for PDN simulations.- BS and 12+ yrs, MS and 10+ yrs or PhD and 7+yrs Electrical Engineering or Physics experience in one or more of:
* Signal integrity for high-speed digital applications
* Electromagnetic transmission line theory
* Microwave theory
* Numerical Field solver theory
* Power integrity
* IC package design
* Photonics #J-18808-Ljbffr