NVIDIA
NVIDIA's High-Speed Interconnect (HSIC) team is seeking a versatile engineer to work on next‑generation high‑speed interconnects like NVLink and NVLink‑C2C to improve efficiency and stability for products in AI, graphics, self‑driving, and more.
What You'll Be Doing
Silicon bringup, validation, and debug NVIDIA's multiple HSIOs, including NVLink and NVLink‑C2C. Profiling HSIO workloads on key use cases such as MLPerf on single and multi‑node datacenter products. Investigate HSIO power features, datapath analysis, and electrical for next‑gen products. Power feature char and tuning for key use cases, balancing performance and power. What We Need To See
BS or MS degree in EE/CE or equivalent experience. 5+ years working on bringup, validation, or design of HSIOs (eg: PCIe/CXL, DDR, USB, UCIE). Experience with HSIOs like PCIE or chip‑to‑chip interconnects including understanding of process/temp/voltage sensitivity. Understanding of HSIO power management. Understanding of firmware/driver structures and their interaction with hardware. Strong EE fundamentals, knowledgeable in computer architecture, high‑speed interfaces, timing analysis, process variations, statistical error rates and power analysis. Enjoy working in a collaborative environment. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is $136,000 USD – $212,750 USD for Level 3, and $168,000 USD – $264,500 USD for Level 4. You will also be eligible for equity and benefits. Applications for this job will be accepted at least until September 26, 2025. NVIDIA is committed to fostering a diverse work environment and proud to be an equal‑opportunity employer. NVIDIA does not discriminate on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.
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Silicon bringup, validation, and debug NVIDIA's multiple HSIOs, including NVLink and NVLink‑C2C. Profiling HSIO workloads on key use cases such as MLPerf on single and multi‑node datacenter products. Investigate HSIO power features, datapath analysis, and electrical for next‑gen products. Power feature char and tuning for key use cases, balancing performance and power. What We Need To See
BS or MS degree in EE/CE or equivalent experience. 5+ years working on bringup, validation, or design of HSIOs (eg: PCIe/CXL, DDR, USB, UCIE). Experience with HSIOs like PCIE or chip‑to‑chip interconnects including understanding of process/temp/voltage sensitivity. Understanding of HSIO power management. Understanding of firmware/driver structures and their interaction with hardware. Strong EE fundamentals, knowledgeable in computer architecture, high‑speed interfaces, timing analysis, process variations, statistical error rates and power analysis. Enjoy working in a collaborative environment. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is $136,000 USD – $212,750 USD for Level 3, and $168,000 USD – $264,500 USD for Level 4. You will also be eligible for equity and benefits. Applications for this job will be accepted at least until September 26, 2025. NVIDIA is committed to fostering a diverse work environment and proud to be an equal‑opportunity employer. NVIDIA does not discriminate on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.
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