Energy Jobline ZR
Senior/Staff Packaging Engineer - Electro-Thermal in Mundelein
Energy Jobline ZR, Mundelein, Illinois, United States, 60060
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Job DescriptionJob DescriptionJoin the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team. You will develop comprehensive thermal and electrical simulations for next- semiconductor packaging solutions, including 2.5D/3D IC integration, chiplet-based systems, and advanced heterogeneous integration technologies. This role is critical in enabling high-performance computing, AI accelerators, and advanced chiplet architectures. We offer a fun work environment with excellent benefits. ONSITE M-FKey Responsibilities:
Develop detailed thermal models for 2.5D/3D IC packages, chiplets, and multi-die systems; perform steady-state and transient thermal analysis with hotspot identification
Execute power integrity (PI) and IR drop analysis; optimize power distribution networks (PDN) and power delivery architectures
Conduct electromigration (EM) and reliability analysis for interconnects, bumps, TSVs, and redistribution layers (RDL)
Develop chip-package co-simulation workflows using industry-standard EDA tools (ANSYS RedHawk\u0002SC, RHSC-ET, SIwave, Cadence Sigrity/Clarity)
Create hierarchical compact macro models (CMM) and reduced-order thermal models for early\u0002stage design optimization
Automate simulation workflows using Python, TCL, and Shell scripting; build design space exploration tools
Collaborate with silicon design, package design, and manufacturing teams on design-for-reliability (DFR) initiatives
Support customer engagements with technical analysis and present findings to stakeholders
Minimum Qualifications:
Education:
PhD in Electrical/Mechanical Engineering, or related field with focus on thermal management, power delivery, or electronic packaging (Master's with 5+ years experience considered)
Strong academic background in power integrity, signal integrity, and thermal management for advanced packaging
Technical Skills:
Expert proficiency in: ANSYS RedHawk-SC, RHSC Electrothermal, Totem, PathFinder, SIwave, HFSS, Q3D; Cadence Voltus, Sigrity, Clarity; Synopsys RedHawk Fusion, PrimeTime, ICC2
Experience with physical design tools (Cadence Innovus, Synopsys ICC2, Siemens Calibre) and RTL\u0002to-GDSII flows
Strong programming/scripting: Python, C/C++, Tcl, Shell (bash); Verilog/VHDL/SystemVerilog for verification
Knowledge of advanced packaging: 2.5D/3D ICs (CoWoS, InFO, EMIB), chiplets, TSVs, interposers, FOWLP, RDL design
Domain Expertise:
Deep understanding of EM/IR analysis, power integrity, thermal physics, and electrothermal co\u0002simulation
Expertise in heat transfer principles (conduction, convection, radiation), thermal material properties, and CTE mismatch
Knowledge of chiplet standards (UCIe and BoW), die-to-die interfaces, and wafer-scale integration
Hands-on experience with semiconductor package thermal/electrical analysis and tape-outs
Ideal Qualifications:
Familiarity with machine learning applications in EDA and design optimization
Experience with HPC, AI/ML accelerator packaging, or co-packaged optics (CPO)
Background in reliability testing (thermal cycling, HTOL, THB) and measurement correlation
What we are looking for:
Strong analytical mindset with expertise across multiple physics domains (thermal, electrical, mechanical)
Excellent communication skills to present complex technical concepts to diverse audiences
Cross-functional collaboration abilities to work with silicon, package, product, and manufacturing teams
Self-motivated professional who thrives in fast-paced environments with minimal supervision
Continuous learner staying current with emerging technologies; innovation-driven with creative problem-solving
Results-oriented engineer delivering high-quality work to enable product milestones on schedule
We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
If you are interested in applying for this job please press the Apply Button and follow the application process. Energy Jobline wishes you the very best of luck in your next career move.
We focus on the Oil & Gas, Renewables, Engineering, Power, and Nuclear markets as well as emerging technologies in EV, Battery, and Fusion. We are committed to ensuring that we offer the most exciting career opportunities from around the world for our jobseekers.
Job DescriptionJob DescriptionJoin the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team. You will develop comprehensive thermal and electrical simulations for next- semiconductor packaging solutions, including 2.5D/3D IC integration, chiplet-based systems, and advanced heterogeneous integration technologies. This role is critical in enabling high-performance computing, AI accelerators, and advanced chiplet architectures. We offer a fun work environment with excellent benefits. ONSITE M-FKey Responsibilities:
Develop detailed thermal models for 2.5D/3D IC packages, chiplets, and multi-die systems; perform steady-state and transient thermal analysis with hotspot identification
Execute power integrity (PI) and IR drop analysis; optimize power distribution networks (PDN) and power delivery architectures
Conduct electromigration (EM) and reliability analysis for interconnects, bumps, TSVs, and redistribution layers (RDL)
Develop chip-package co-simulation workflows using industry-standard EDA tools (ANSYS RedHawk\u0002SC, RHSC-ET, SIwave, Cadence Sigrity/Clarity)
Create hierarchical compact macro models (CMM) and reduced-order thermal models for early\u0002stage design optimization
Automate simulation workflows using Python, TCL, and Shell scripting; build design space exploration tools
Collaborate with silicon design, package design, and manufacturing teams on design-for-reliability (DFR) initiatives
Support customer engagements with technical analysis and present findings to stakeholders
Minimum Qualifications:
Education:
PhD in Electrical/Mechanical Engineering, or related field with focus on thermal management, power delivery, or electronic packaging (Master's with 5+ years experience considered)
Strong academic background in power integrity, signal integrity, and thermal management for advanced packaging
Technical Skills:
Expert proficiency in: ANSYS RedHawk-SC, RHSC Electrothermal, Totem, PathFinder, SIwave, HFSS, Q3D; Cadence Voltus, Sigrity, Clarity; Synopsys RedHawk Fusion, PrimeTime, ICC2
Experience with physical design tools (Cadence Innovus, Synopsys ICC2, Siemens Calibre) and RTL\u0002to-GDSII flows
Strong programming/scripting: Python, C/C++, Tcl, Shell (bash); Verilog/VHDL/SystemVerilog for verification
Knowledge of advanced packaging: 2.5D/3D ICs (CoWoS, InFO, EMIB), chiplets, TSVs, interposers, FOWLP, RDL design
Domain Expertise:
Deep understanding of EM/IR analysis, power integrity, thermal physics, and electrothermal co\u0002simulation
Expertise in heat transfer principles (conduction, convection, radiation), thermal material properties, and CTE mismatch
Knowledge of chiplet standards (UCIe and BoW), die-to-die interfaces, and wafer-scale integration
Hands-on experience with semiconductor package thermal/electrical analysis and tape-outs
Ideal Qualifications:
Familiarity with machine learning applications in EDA and design optimization
Experience with HPC, AI/ML accelerator packaging, or co-packaged optics (CPO)
Background in reliability testing (thermal cycling, HTOL, THB) and measurement correlation
What we are looking for:
Strong analytical mindset with expertise across multiple physics domains (thermal, electrical, mechanical)
Excellent communication skills to present complex technical concepts to diverse audiences
Cross-functional collaboration abilities to work with silicon, package, product, and manufacturing teams
Self-motivated professional who thrives in fast-paced environments with minimal supervision
Continuous learner staying current with emerging technologies; innovation-driven with creative problem-solving
Results-oriented engineer delivering high-quality work to enable product milestones on schedule
We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
If you are interested in applying for this job please press the Apply Button and follow the application process. Energy Jobline wishes you the very best of luck in your next career move.