Adeia
Staff Thermal Engineer – Job Description
About Us
Adeia Inc. (Nasdaq: ADEA) is a technology company known for developing foundational innovations that enable next‑generation solutions for the semiconductor and media industries. Adeia is headquartered in San Jose, CA, with approximately 150 employees, primarily in North America. Adeia invents, develops, and licenses fundamental innovations that shape the way millions of people explore and experience entertainment in an increasingly connected world. From TVs to smartphones, and across all types of entertainment experiences, Adeia’s technologies allow users to manage content and connections in a way that is smart, immersive, and personal.
Adeia is proud to be recognized by U.S. News & World Report as one of the “Best Companies to Work For” in 2025 - 2026.
Position Summary
We are seeking a highly experienced and self‑motivated Staff Thermal Engineer to lead the design, simulation, and validation of thermal solutions for complex electronic systems. The ideal candidate is a critical thinker with a rigorous attention to detail, capable of working independently with minimal supervision, while managing multiple high‑priority projects under tight deadlines. This role requires deep expertise in both traditional and advanced thermal management approaches across electronic packaging technologies.
Key Responsibilities
Independently lead thermal simulation and characterization of electronic assemblies, including MCMs, interposers, substrates, PCBs, cold plates, and system‑level components.
Develop and implement innovative thermal management strategies with a focus on advanced liquid cooling and high‑performance air‑cooling technologies.
Validate cooling solutions through end‑to‑end thermal modeling (e.g., Ansys IcePak, Fluent) and physical prototype testing — ensuring results are accurate, reliable, and replicable.
Collaborate with cross‑functional teams (electrical, mechanical, packaging, manufacturing) to drive thermal performance optimization in early‑stage designs.
Deliver high‑quality technical presentations and documentation, clearly communicating complex findings to technical and executive audiences.
Publish and present at conferences and industry forums to advance the company's visibility in the thermal engineering space.
Develop and execute comprehensive test plans to ensure manufacturability, reliability, and cost‑effectiveness of proposed solutions.
Minimum Qualifications
Bachelor’s degree in Mechanical, Thermal, or related engineering field.
Proficiency in using ANSYS DesignModeler to create 3D geometry for thermal simulation purposes.
Experience using DesignModeler’s parametric modeling features for geometry automation and design exploration.
Strong proficiency with simulation and modeling tools such as Ansys IcePak, Fluent, and SolidWorks, emphasizing modeling accuracy and interpretation.
Minimum 5–7 years of hands‑on experience designing and validating thermal solutions for electronic systems, with increasing scope and leadership responsibility.
Proven track record of independent ownership of complex thermal engineering projects from concept through deployment.
Deep expertise in air‑cooling techniques (e.g., vapor chambers, heat pipes, TIMs) and familiarity with liquid cooling systems.
Demonstrated ability to meet aggressive deadlines and manage priorities across multiple high‑impact programs.
Excellent written and verbal communication skills, with attention to technical clarity and completeness.
Preferred Qualifications
Master’s or PhD in Mechanical, Thermal, or related field.
8–10+ years of experience in thermal design for microelectronics, high‑performance computing, or advanced packaging technologies (e.g., 2.5D/3D).
Experience with JEDEC thermal standards, advanced packaging, and system‑level integration.
Deep understanding of interconnect processes and materials such as solder bumping, copper pillars, and thermally conductive adhesives.
Familiarity with industry‑leading thermal practices for high‑density, high‑power electronics and heterogeneous integration platforms.
Compensation
The base compensation range for this San Jose, CA position is $150,000–$215,000. Actual compensation packages are based on a wide array of factors unique to each candidate, including but not limited to skill set, years of experience, and depth of experience.
Location
Bay Area candidates have the flexibility to go into the office on Tuesdays and other days as needed.
Benefits
Competitive compensation (salary, equity, and bonuses) and comprehensive benefits designed to foster work‑life balance, care for your health, protect your finances, and help you save and invest for the future.
Generous paid time away from work, including flexible time off, holidays and sick time, health and wellness initiatives, and a charitable match program to help you give back to your community.
Great benefits, which vary by location and can be site‑specific: employee discounts, transportation reimbursements, and fitness facilities.
A flexible, hybrid work environment combining the best of in‑office collaboration and community building along with the benefits of working from home.
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Adeia Inc. (Nasdaq: ADEA) is a technology company known for developing foundational innovations that enable next‑generation solutions for the semiconductor and media industries. Adeia is headquartered in San Jose, CA, with approximately 150 employees, primarily in North America. Adeia invents, develops, and licenses fundamental innovations that shape the way millions of people explore and experience entertainment in an increasingly connected world. From TVs to smartphones, and across all types of entertainment experiences, Adeia’s technologies allow users to manage content and connections in a way that is smart, immersive, and personal.
Adeia is proud to be recognized by U.S. News & World Report as one of the “Best Companies to Work For” in 2025 - 2026.
Position Summary
We are seeking a highly experienced and self‑motivated Staff Thermal Engineer to lead the design, simulation, and validation of thermal solutions for complex electronic systems. The ideal candidate is a critical thinker with a rigorous attention to detail, capable of working independently with minimal supervision, while managing multiple high‑priority projects under tight deadlines. This role requires deep expertise in both traditional and advanced thermal management approaches across electronic packaging technologies.
Key Responsibilities
Independently lead thermal simulation and characterization of electronic assemblies, including MCMs, interposers, substrates, PCBs, cold plates, and system‑level components.
Develop and implement innovative thermal management strategies with a focus on advanced liquid cooling and high‑performance air‑cooling technologies.
Validate cooling solutions through end‑to‑end thermal modeling (e.g., Ansys IcePak, Fluent) and physical prototype testing — ensuring results are accurate, reliable, and replicable.
Collaborate with cross‑functional teams (electrical, mechanical, packaging, manufacturing) to drive thermal performance optimization in early‑stage designs.
Deliver high‑quality technical presentations and documentation, clearly communicating complex findings to technical and executive audiences.
Publish and present at conferences and industry forums to advance the company's visibility in the thermal engineering space.
Develop and execute comprehensive test plans to ensure manufacturability, reliability, and cost‑effectiveness of proposed solutions.
Minimum Qualifications
Bachelor’s degree in Mechanical, Thermal, or related engineering field.
Proficiency in using ANSYS DesignModeler to create 3D geometry for thermal simulation purposes.
Experience using DesignModeler’s parametric modeling features for geometry automation and design exploration.
Strong proficiency with simulation and modeling tools such as Ansys IcePak, Fluent, and SolidWorks, emphasizing modeling accuracy and interpretation.
Minimum 5–7 years of hands‑on experience designing and validating thermal solutions for electronic systems, with increasing scope and leadership responsibility.
Proven track record of independent ownership of complex thermal engineering projects from concept through deployment.
Deep expertise in air‑cooling techniques (e.g., vapor chambers, heat pipes, TIMs) and familiarity with liquid cooling systems.
Demonstrated ability to meet aggressive deadlines and manage priorities across multiple high‑impact programs.
Excellent written and verbal communication skills, with attention to technical clarity and completeness.
Preferred Qualifications
Master’s or PhD in Mechanical, Thermal, or related field.
8–10+ years of experience in thermal design for microelectronics, high‑performance computing, or advanced packaging technologies (e.g., 2.5D/3D).
Experience with JEDEC thermal standards, advanced packaging, and system‑level integration.
Deep understanding of interconnect processes and materials such as solder bumping, copper pillars, and thermally conductive adhesives.
Familiarity with industry‑leading thermal practices for high‑density, high‑power electronics and heterogeneous integration platforms.
Compensation
The base compensation range for this San Jose, CA position is $150,000–$215,000. Actual compensation packages are based on a wide array of factors unique to each candidate, including but not limited to skill set, years of experience, and depth of experience.
Location
Bay Area candidates have the flexibility to go into the office on Tuesdays and other days as needed.
Benefits
Competitive compensation (salary, equity, and bonuses) and comprehensive benefits designed to foster work‑life balance, care for your health, protect your finances, and help you save and invest for the future.
Generous paid time away from work, including flexible time off, holidays and sick time, health and wellness initiatives, and a charitable match program to help you give back to your community.
Great benefits, which vary by location and can be site‑specific: employee discounts, transportation reimbursements, and fitness facilities.
A flexible, hybrid work environment combining the best of in‑office collaboration and community building along with the benefits of working from home.
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