Qualcomm
Company:
Qualcomm Technologies, Inc.
Job Area: Engineering Group, Systems Engineering
General Summary: Qualcomm Data Center team is developing high performance, energy efficient server solutions for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting‑edge technology work!
Our Mission We are dedicated to transforming the industry by reimagining silicon and developing next‑generation computing platforms. By joining our team, you’ll collaborate with world‑class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm’s Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.
Position: Thermal Architect As a
Thermal Architect , you will define and drive thermal strategies for high‑performance server platforms. Working closely with mechanical, electrical, and packaging teams, and component suppliers, you will ensure robust thermal performance from concept through validation and production. This role combines deep technical expertise with cross‑functional coordination, influencing design direction, and ensuring execution aligned with program milestones.
Key Responsibilities
Lead system‑level thermal architecture, modeling, and optimization for complex server platforms.
Drive end‑to‑end thermal design—from concept and analysis to validation and manufacturing readiness.
Coordinate planning, schedules, and deliverables across thermal, mechanical, and system teams.
Provide technical direction and mentorship, promoting best practices in thermal design and validation.
Correlate simulations with hardware data to improve model accuracy and design robustness.
Explore and integrate advanced thermal materials and cooling technologies for high‑power electronics.
Prepare clear documentation, reports, and presentations for internal and external stakeholders.
Qualifications
Master’s degree in Mechanical Engineering, Engineering Mechanics, Materials Science, or a related field.
8+ years of experience in thermal modeling and system‑level design within the high‑tech or data center industry.
Strong foundation in heat transfer (conduction, convection, radiation).
Proficiency with CFD tools (e.g., Celsius EC, Flotherm, Icepak) and thermal testing techniques.
Experience coordinating cross‑functional deliverables and influencing system‑level design.
Excellent communication and technical documentation skills.
Preferred Qualifications
Ph.D. in Mechanical Engineering, Engineering Mechanics, Materials Science, or a related field.
12+ years of thermal design experience for high‑performance computing or server systems.
Familiarity with OCP designs and industry thermal standards.
Expertise in simulation‑to‑test correlation and thermal validation.
Programming experience (e.g., Python, MATLAB, C/C++) for analysis automation.
CAD proficiency (e.g., SolidWorks, Creo).
Minimum Qualifications
Bachelor’s degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience.
Master’s degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience.
Ph.D. in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.
Equal Opportunity and Accommodations Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e‑mail disability‑accomodations@qualcomm.com or call Qualcomm’s toll‑free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or résumé inquiries).
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Pay range and Other Compensation & Benefits $220,200.00 - $330,400.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
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Job Area: Engineering Group, Systems Engineering
General Summary: Qualcomm Data Center team is developing high performance, energy efficient server solutions for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting‑edge technology work!
Our Mission We are dedicated to transforming the industry by reimagining silicon and developing next‑generation computing platforms. By joining our team, you’ll collaborate with world‑class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm’s Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.
Position: Thermal Architect As a
Thermal Architect , you will define and drive thermal strategies for high‑performance server platforms. Working closely with mechanical, electrical, and packaging teams, and component suppliers, you will ensure robust thermal performance from concept through validation and production. This role combines deep technical expertise with cross‑functional coordination, influencing design direction, and ensuring execution aligned with program milestones.
Key Responsibilities
Lead system‑level thermal architecture, modeling, and optimization for complex server platforms.
Drive end‑to‑end thermal design—from concept and analysis to validation and manufacturing readiness.
Coordinate planning, schedules, and deliverables across thermal, mechanical, and system teams.
Provide technical direction and mentorship, promoting best practices in thermal design and validation.
Correlate simulations with hardware data to improve model accuracy and design robustness.
Explore and integrate advanced thermal materials and cooling technologies for high‑power electronics.
Prepare clear documentation, reports, and presentations for internal and external stakeholders.
Qualifications
Master’s degree in Mechanical Engineering, Engineering Mechanics, Materials Science, or a related field.
8+ years of experience in thermal modeling and system‑level design within the high‑tech or data center industry.
Strong foundation in heat transfer (conduction, convection, radiation).
Proficiency with CFD tools (e.g., Celsius EC, Flotherm, Icepak) and thermal testing techniques.
Experience coordinating cross‑functional deliverables and influencing system‑level design.
Excellent communication and technical documentation skills.
Preferred Qualifications
Ph.D. in Mechanical Engineering, Engineering Mechanics, Materials Science, or a related field.
12+ years of thermal design experience for high‑performance computing or server systems.
Familiarity with OCP designs and industry thermal standards.
Expertise in simulation‑to‑test correlation and thermal validation.
Programming experience (e.g., Python, MATLAB, C/C++) for analysis automation.
CAD proficiency (e.g., SolidWorks, Creo).
Minimum Qualifications
Bachelor’s degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience.
Master’s degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience.
Ph.D. in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.
Equal Opportunity and Accommodations Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e‑mail disability‑accomodations@qualcomm.com or call Qualcomm’s toll‑free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or résumé inquiries).
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Pay range and Other Compensation & Benefits $220,200.00 - $330,400.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
#J-18808-Ljbffr