Nutanix
Position: Thermal Architect
Qualcomm Data Center team is developing high‑performance, energy‑efficient server solutions for data center applications. We are looking for highly talented, innovative, teamwork‑oriented individuals for our cutting‑edge technology work.
Key Responsibilities
Lead system‑level thermal architecture, modeling, and optimization for complex server platforms.
Drive end‑to‑end thermal design—from concept and analysis to validation and manufacturing readiness.
Coordinate planning, schedules, and deliverables across thermal, mechanical, and system teams.
Provide technical direction and mentorship, promoting best practices in thermal design and validation.
Correlate simulations with hardware data to improve model accuracy and design robustness.
Explore and integrate advanced thermal materials and cooling technologies for high‑power electronics.
Prepare clear documentation, reports, and presentations for internal and external stakeholders.
Qualifications
Master’s degree in Mechanical Engineering, Engineering Mechanics, Materials Science, or a related field.
8+ years of experience in thermal modeling and system‑level design within the high‑tech or data center industry.
Strong foundation in heat transfer (conduction, convection, radiation).
Proficiency with CFD tools (e.g., Celsius EC, Flotherm, Icepak) and thermal testing techniques.
Experience coordinating cross‑functional deliverables and influencing system‑level design.
Excellent communication and technical documentation skills.
Preferred Qualifications
Ph.D. in Mechanical Engineering, Engineering Mechanics, Materials Science, or a related field.
12+ years of thermal design experience for high‑performance computing or server systems.
Familiarity with OCP designs and industry thermal standards.
Expertise in simulation‑to‑test correlation and thermal validation.
Programming experience (e.g., Python, MATLAB, C/C++) for analysis automation.
CAD proficiency (e.g., SolidWorks, Creo).
Minimum Qualifications
Broad degree of Bachelor’s, Master’s, or Ph.D. in Engineering or related field with:
8+ years of systems engineering or related work experience.
Example: Bachelor's in Engineering, Computer Science, or Information Systems with 8+ years of systems engineering experience; Master’s with 7+ years; Ph.D. with 6+ years.
Equal Opportunity Employer Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Pay Range $220,200.00 - $330,400.00
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Key Responsibilities
Lead system‑level thermal architecture, modeling, and optimization for complex server platforms.
Drive end‑to‑end thermal design—from concept and analysis to validation and manufacturing readiness.
Coordinate planning, schedules, and deliverables across thermal, mechanical, and system teams.
Provide technical direction and mentorship, promoting best practices in thermal design and validation.
Correlate simulations with hardware data to improve model accuracy and design robustness.
Explore and integrate advanced thermal materials and cooling technologies for high‑power electronics.
Prepare clear documentation, reports, and presentations for internal and external stakeholders.
Qualifications
Master’s degree in Mechanical Engineering, Engineering Mechanics, Materials Science, or a related field.
8+ years of experience in thermal modeling and system‑level design within the high‑tech or data center industry.
Strong foundation in heat transfer (conduction, convection, radiation).
Proficiency with CFD tools (e.g., Celsius EC, Flotherm, Icepak) and thermal testing techniques.
Experience coordinating cross‑functional deliverables and influencing system‑level design.
Excellent communication and technical documentation skills.
Preferred Qualifications
Ph.D. in Mechanical Engineering, Engineering Mechanics, Materials Science, or a related field.
12+ years of thermal design experience for high‑performance computing or server systems.
Familiarity with OCP designs and industry thermal standards.
Expertise in simulation‑to‑test correlation and thermal validation.
Programming experience (e.g., Python, MATLAB, C/C++) for analysis automation.
CAD proficiency (e.g., SolidWorks, Creo).
Minimum Qualifications
Broad degree of Bachelor’s, Master’s, or Ph.D. in Engineering or related field with:
8+ years of systems engineering or related work experience.
Example: Bachelor's in Engineering, Computer Science, or Information Systems with 8+ years of systems engineering experience; Master’s with 7+ years; Ph.D. with 6+ years.
Equal Opportunity Employer Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Pay Range $220,200.00 - $330,400.00
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