FLIR
Be visionary
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, environmental monitoring, electronics, oceanographic research, oil and gas exploration, medical imaging, and pharmaceuticals. We seek individuals who thrive on making an impact and enjoy being part of a winning team. Job Description
Job Summary: As part of the uncooled detector (focal plane array) R&D team, the successful candidate will manage engineering wafer fab processes such as plasma etch, thin film deposition, lithography, and wet cleans for next-generation infrared detectors. Responsibilities include designing and implementing new processes, automating or refining existing ones, and characterizing wafers and devices using SEM or FIB/SEM. Hands-on wafer fabrication and characterization of pilot lots are required. This role suits a self-directed, goal-oriented, collaborative engineer. The environment is varied, challenging, and fosters creative problem solving. The culture is collaborative, supportive, and enjoyable, with a mixed office and clean room/lab setting. Primary Duties & Responsibilities
Innovate new processes to support the technology roadmap Design experiments, analyze data, and communicate results Assess feasibility of new processes through pilot lot processing Characterize results with quantitative metrology tools Automate or improve existing processes Transition knowledge to sustainment engineers or technicians Document methods and workflows in MES-ready format Implement statistical process control (SPC) practices as appropriate Address production yield challenges and suggest improvements Collaborate with physicists, technicians, and engineers in the R&D cycle Job Qualifications
Bachelor's degree or equivalent in a related technical field 0-5 years of relevant experience preferred Proficient in Word, Excel, Outlook; strong data analysis skills (Excel, MATLAB, JMP, Python, SQL) Experience with inspection and fabrication equipment (microscopes, FIB/SEM, interferometers, wet benches) Experience with wafer fabrication processes Interest or experience in microelectronics/semiconductor and MEMS fabrication Eligibility to work in the U.S. or obtain necessary export licenses Desired Background
Experience with wafer processing tools, infrared detector technology, SPC, DOE, and problem-solving methods like Lean Six Sigma. Salary Range
$90,800 - $121,100 Pay Transparency
The listed salary is an estimate; actual compensation depends on various factors including location, experience, and skills. Teledyne is committed to ethical standards and equal opportunity employment, considering all qualified applicants without discrimination.
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Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, environmental monitoring, electronics, oceanographic research, oil and gas exploration, medical imaging, and pharmaceuticals. We seek individuals who thrive on making an impact and enjoy being part of a winning team. Job Description
Job Summary: As part of the uncooled detector (focal plane array) R&D team, the successful candidate will manage engineering wafer fab processes such as plasma etch, thin film deposition, lithography, and wet cleans for next-generation infrared detectors. Responsibilities include designing and implementing new processes, automating or refining existing ones, and characterizing wafers and devices using SEM or FIB/SEM. Hands-on wafer fabrication and characterization of pilot lots are required. This role suits a self-directed, goal-oriented, collaborative engineer. The environment is varied, challenging, and fosters creative problem solving. The culture is collaborative, supportive, and enjoyable, with a mixed office and clean room/lab setting. Primary Duties & Responsibilities
Innovate new processes to support the technology roadmap Design experiments, analyze data, and communicate results Assess feasibility of new processes through pilot lot processing Characterize results with quantitative metrology tools Automate or improve existing processes Transition knowledge to sustainment engineers or technicians Document methods and workflows in MES-ready format Implement statistical process control (SPC) practices as appropriate Address production yield challenges and suggest improvements Collaborate with physicists, technicians, and engineers in the R&D cycle Job Qualifications
Bachelor's degree or equivalent in a related technical field 0-5 years of relevant experience preferred Proficient in Word, Excel, Outlook; strong data analysis skills (Excel, MATLAB, JMP, Python, SQL) Experience with inspection and fabrication equipment (microscopes, FIB/SEM, interferometers, wet benches) Experience with wafer fabrication processes Interest or experience in microelectronics/semiconductor and MEMS fabrication Eligibility to work in the U.S. or obtain necessary export licenses Desired Background
Experience with wafer processing tools, infrared detector technology, SPC, DOE, and problem-solving methods like Lean Six Sigma. Salary Range
$90,800 - $121,100 Pay Transparency
The listed salary is an estimate; actual compensation depends on various factors including location, experience, and skills. Teledyne is committed to ethical standards and equal opportunity employment, considering all qualified applicants without discrimination.
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