Northrop Grumman Corp. (AU)
Principal / Senior Principal Dry Etch Sustaining Semiconductor Process Engineer-
Northrop Grumman Corp. (AU), Linthicum, Maryland, United States
Requisition ID: R10186792
Category:
Engineering
Location:
Linthicum, Maryland, United States of America
Clearance Type:
Secret
Telecommute:
No- Teleworking not available for this position
Shift:
2nd Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
1
The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an independent and resourceful Dry Etch Sustaining Semiconductor Process Engineer. Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland – is where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry has unique capabilities supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. The Dry Etch Sustaining Semiconductor Process Engineer will be responsible for: All aspects of sustaining existing Dry Etch and Ash processes for a development line including process qualifications and technician training. Interfacing with other unit process engineers, operations, and integration engineers during the design and execution of process/equipment improvement projects. Developing Dry Etch processes for new materials and emerging technologies in both microelectronics and superconducting electronics. Writing and maintaining process documentation. Supporting statistical process control (SPC) and continuous improvement efforts. Performing all other related duties as assigned. This is a full-time 2nd shift position (2 pm to 11 pm), Monday – Friday. Basic Qualifications for Principal Dry Etch Sustaining Semiconductor Process Engineer: Bachelors of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or other related technical discipline with 5 years of relevant experience (3 years with a MS, 0 with a PhD). Must have Dry Etch industry experience. Hands-on experience running semiconductor process equipment and with process sustaining/development activities. Must be able to work independently, providing technical solutions to a wide range of complex problems. Must be able to work a large percentage of time in a Class 100 cleanroom environment. Must be able to work 2nd shift. Knowledge of statistical process control (SPC). Must be a US Citizen. Must be able to obtain and maintain a Secret clearance. Basic Qualifications for Senior Principal Dry Etch Sustaining Semiconductor Process Engineer: Bachelors of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or other related technical discipline with 8 years of relevant experience (6 years with a MS and 3 with a PhD). Must have Dry Etch industry experience. Hands-on experience running semiconductor process equipment and with process sustaining/development activities. Must be able to work independently, providing technical solutions to a wide range of complex problems. Must be able to work a large percentage of time in a Class 100 cleanroom environment. Must be able to work 2nd shift. Knowledge of statistical process control (SPC). Must be a US Citizen. Must be able to obtain and maintain a Secret clearance. Preferred Qualifications: Direct experience with semiconductor fabrication, working in a cleanroom environment. Hands-on experience running Dry Etch process equipment and with process sustaining/development activities. Experience with AMAT tools. Demonstrated ability to communicate well with others and work independently. Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions. Experience in structured problem-solving methodology to troubleshoot tool and process issues. Data analysis and visualization (JMP and/or MiniTab). Advanced knowledge of statistical process control (SPC). Active Secret clearance. Salary Range:
$105,400 - $158,000 Salary Range 2:
$131,100 - $196,700 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
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Engineering
Location:
Linthicum, Maryland, United States of America
Clearance Type:
Secret
Telecommute:
No- Teleworking not available for this position
Shift:
2nd Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
1
The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an independent and resourceful Dry Etch Sustaining Semiconductor Process Engineer. Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland – is where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry has unique capabilities supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. The Dry Etch Sustaining Semiconductor Process Engineer will be responsible for: All aspects of sustaining existing Dry Etch and Ash processes for a development line including process qualifications and technician training. Interfacing with other unit process engineers, operations, and integration engineers during the design and execution of process/equipment improvement projects. Developing Dry Etch processes for new materials and emerging technologies in both microelectronics and superconducting electronics. Writing and maintaining process documentation. Supporting statistical process control (SPC) and continuous improvement efforts. Performing all other related duties as assigned. This is a full-time 2nd shift position (2 pm to 11 pm), Monday – Friday. Basic Qualifications for Principal Dry Etch Sustaining Semiconductor Process Engineer: Bachelors of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or other related technical discipline with 5 years of relevant experience (3 years with a MS, 0 with a PhD). Must have Dry Etch industry experience. Hands-on experience running semiconductor process equipment and with process sustaining/development activities. Must be able to work independently, providing technical solutions to a wide range of complex problems. Must be able to work a large percentage of time in a Class 100 cleanroom environment. Must be able to work 2nd shift. Knowledge of statistical process control (SPC). Must be a US Citizen. Must be able to obtain and maintain a Secret clearance. Basic Qualifications for Senior Principal Dry Etch Sustaining Semiconductor Process Engineer: Bachelors of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or other related technical discipline with 8 years of relevant experience (6 years with a MS and 3 with a PhD). Must have Dry Etch industry experience. Hands-on experience running semiconductor process equipment and with process sustaining/development activities. Must be able to work independently, providing technical solutions to a wide range of complex problems. Must be able to work a large percentage of time in a Class 100 cleanroom environment. Must be able to work 2nd shift. Knowledge of statistical process control (SPC). Must be a US Citizen. Must be able to obtain and maintain a Secret clearance. Preferred Qualifications: Direct experience with semiconductor fabrication, working in a cleanroom environment. Hands-on experience running Dry Etch process equipment and with process sustaining/development activities. Experience with AMAT tools. Demonstrated ability to communicate well with others and work independently. Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions. Experience in structured problem-solving methodology to troubleshoot tool and process issues. Data analysis and visualization (JMP and/or MiniTab). Advanced knowledge of statistical process control (SPC). Active Secret clearance. Salary Range:
$105,400 - $158,000 Salary Range 2:
$131,100 - $196,700 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
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