Northrop Grumman Corp. (AU)
Principal / Senior Principal Physical Vapor Deposition (PVD) Proc...
Northrop Grumman Corp. (AU) - Linthicum, Maryland, United States
Work at Northrop Grumman Corp. (AU)
Overview
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Overview
Requisition ID: R10178625
Category:
Engineering
Location:
Linthicum, Maryland, United States of America
Clearance Type:
Secret
Telecommute:
No - Teleworking not available for this position
Shift:
1st Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work. The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative 1st Shift
Physical Vapor Deposition (PVD)
Process Engineer
for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland. The 1st shift
PVD Process Engineer
will be responsible for but not limited to: All aspects of sustaining PVD processes for semiconductor manufacturing including process qualifications, technician training and certification, and process safety. Interfacing with other unit process engineers and product integration engineers to develop processes to support emerging technologies. Supporting statistical process control (SPC) and continuous improvement efforts. Establishing and sustaining standard operating procedures and engaging the operations team to ensure these are followed. Creating and maintaining process documentation. Performing all other related duties as assigned. Basic Qualifications for Principal Physical Vapor Deposition (PVD) Process Engineer: Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or closely related discipline with 5 years technical related experience in semiconductor fabrication, or Master’s Degree with 3 years’ experience; PhD with 0 years experience. Hands-on experience with evaporators and/or sputtering equipment from OEMs like CHA Industries, KDF, Materials Research Corp., Temescal, PERKIN-ELMER, and Applied Materials, Inc. (AMAT). Direct experience with semiconductor fabrication and working in a cleanroom environment. Good interpersonal and communication skills, both written and verbal, problem-solving skills. Ability to work a large percentage of time in a Class 100 cleanroom environment and meet all physical and PPE requirements. Ability to obtain and maintain Secret clearance. Must be a US citizen. Basic Qualifications for Senior Principal Physical Vapor Deposition (PVD) Process Engineer: Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or closely related discipline with 8 years technical related experience in semiconductor fabrication; Master’s degree with 6 years of experience; or PhD with 3 years of experience. Hands-on experience with evaporators and/or sputtering equipment from OEMs like CHA Industries, KDF, Materials Research Corp., Temescal, PERKIN-ELMER, and Applied Materials, Inc. (AMAT). Direct experience with semiconductor fabrication and working in a cleanroom environment. Good interpersonal and communication skills, both written and verbal, problem-solving skills. Ability to work a large percentage of time in a Class 100 cleanroom environment and meet all physical and PPE requirements. Ability to obtain and maintain Secret clearance. Must be a US citizen. Preferred Qualifications: Experience with statistical process control (SPC). Experience in lean manufacturing practices and structured problem-solving methodology, DOEs, RCCA. Familiar with various software packages commonly found in Semiconductor Wafer Fabs. Salary Range:
$105,400 - $158,000 Salary Range 2:
$131,100 - $196,700 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.
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Engineering
Location:
Linthicum, Maryland, United States of America
Clearance Type:
Secret
Telecommute:
No - Teleworking not available for this position
Shift:
1st Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work. The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative 1st Shift
Physical Vapor Deposition (PVD)
Process Engineer
for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland. The 1st shift
PVD Process Engineer
will be responsible for but not limited to: All aspects of sustaining PVD processes for semiconductor manufacturing including process qualifications, technician training and certification, and process safety. Interfacing with other unit process engineers and product integration engineers to develop processes to support emerging technologies. Supporting statistical process control (SPC) and continuous improvement efforts. Establishing and sustaining standard operating procedures and engaging the operations team to ensure these are followed. Creating and maintaining process documentation. Performing all other related duties as assigned. Basic Qualifications for Principal Physical Vapor Deposition (PVD) Process Engineer: Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or closely related discipline with 5 years technical related experience in semiconductor fabrication, or Master’s Degree with 3 years’ experience; PhD with 0 years experience. Hands-on experience with evaporators and/or sputtering equipment from OEMs like CHA Industries, KDF, Materials Research Corp., Temescal, PERKIN-ELMER, and Applied Materials, Inc. (AMAT). Direct experience with semiconductor fabrication and working in a cleanroom environment. Good interpersonal and communication skills, both written and verbal, problem-solving skills. Ability to work a large percentage of time in a Class 100 cleanroom environment and meet all physical and PPE requirements. Ability to obtain and maintain Secret clearance. Must be a US citizen. Basic Qualifications for Senior Principal Physical Vapor Deposition (PVD) Process Engineer: Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or closely related discipline with 8 years technical related experience in semiconductor fabrication; Master’s degree with 6 years of experience; or PhD with 3 years of experience. Hands-on experience with evaporators and/or sputtering equipment from OEMs like CHA Industries, KDF, Materials Research Corp., Temescal, PERKIN-ELMER, and Applied Materials, Inc. (AMAT). Direct experience with semiconductor fabrication and working in a cleanroom environment. Good interpersonal and communication skills, both written and verbal, problem-solving skills. Ability to work a large percentage of time in a Class 100 cleanroom environment and meet all physical and PPE requirements. Ability to obtain and maintain Secret clearance. Must be a US citizen. Preferred Qualifications: Experience with statistical process control (SPC). Experience in lean manufacturing practices and structured problem-solving methodology, DOEs, RCCA. Familiar with various software packages commonly found in Semiconductor Wafer Fabs. Salary Range:
$105,400 - $158,000 Salary Range 2:
$131,100 - $196,700 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.
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