University of Texas
Design Engineering Manager, Texas Institute for Electronics
University of Texas, Austin, Texas, us, 78716
* Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)* Voluntary Vision, Dental, Life, and Disability insurance options* Generous paid vacation, sick time, and holidays* Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds* Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)* Flexible spending account options for medical and childcare expenses* Robust free training access through LinkedIn Learning plus professional conference opportunities* Tuition assistance* Expansive employee discount program including athletic tickets* Free access to UT Austin's libraries and museums with staff ID card* Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card* For more details, please see:
and* Supervise, guide, direct, and help train team of TIE Design Engineers through hands-on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment* Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D-ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro-systems.* Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities.* Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages.* Participate in industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility.* Design and execute experiments for packaging performance optimization. Conduct multi-physics modeling and simulation studies. Stay current with industry trends and emerging technologies.* Other related functions as assigned.* Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field* 10+ years of relevant industry experience in semiconductor IC design* Previous supervisory experience with small to medium-sized teams* Strong understanding of semiconductor device physics and mixed signal circuit design* Excellent problem-solving skills and attention to detail* Strong communication and teamwork skills* Ability to manage multiple projects in a fast-paced environment* Proficiency in industry-standard EDA software for circuit and/or package design* Master's or higher degree in relevant semiconductor engineering fields* Experience with 2.5D and 3D semiconductor packaging technologies* Solid understanding of various packaging technologies (wire bonding, flip-chip, wafer-level packaging)* Strong background in DFT/DFM methodologies and BIST techniques* Experience in multi-physics modeling (Power, Thermal, Mechanical, Signal Integrity, RF)* Experience in a startup or R&D environmentIn 2024, The University of Texas at Austin was recognized as a 5 Year Champion having placed in the top 10 among Texas employers and top 15 for higher education institutions on Forbes’s list of 500 best large employers five years running. The University’s aspiration to become the world’s highest-impact public research university is driven by our outstanding people. Our employees are the bedrock of our university and are empowered to be true to themselves, to participate fully in our vibrant university, and to thrive as individuals. UT Austin offers competitive salaries, full benefits, an extensive support network, and above all, an enriching and highly collaborative working community that is deeply passionate about our vision for higher education and public service.Please see our .**Comments and Inquiries:**Email comments to:
.
For questions or concerns regarding equal opportunity only, contact .Additional information for applicants can be found on the Human Resources web page: .
For more job information, call the Human Resource Service Center at (512) 471-4772, or toll-free at (800) 687-4178. #J-18808-Ljbffr
and* Supervise, guide, direct, and help train team of TIE Design Engineers through hands-on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment* Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D-ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro-systems.* Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities.* Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages.* Participate in industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility.* Design and execute experiments for packaging performance optimization. Conduct multi-physics modeling and simulation studies. Stay current with industry trends and emerging technologies.* Other related functions as assigned.* Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field* 10+ years of relevant industry experience in semiconductor IC design* Previous supervisory experience with small to medium-sized teams* Strong understanding of semiconductor device physics and mixed signal circuit design* Excellent problem-solving skills and attention to detail* Strong communication and teamwork skills* Ability to manage multiple projects in a fast-paced environment* Proficiency in industry-standard EDA software for circuit and/or package design* Master's or higher degree in relevant semiconductor engineering fields* Experience with 2.5D and 3D semiconductor packaging technologies* Solid understanding of various packaging technologies (wire bonding, flip-chip, wafer-level packaging)* Strong background in DFT/DFM methodologies and BIST techniques* Experience in multi-physics modeling (Power, Thermal, Mechanical, Signal Integrity, RF)* Experience in a startup or R&D environmentIn 2024, The University of Texas at Austin was recognized as a 5 Year Champion having placed in the top 10 among Texas employers and top 15 for higher education institutions on Forbes’s list of 500 best large employers five years running. The University’s aspiration to become the world’s highest-impact public research university is driven by our outstanding people. Our employees are the bedrock of our university and are empowered to be true to themselves, to participate fully in our vibrant university, and to thrive as individuals. UT Austin offers competitive salaries, full benefits, an extensive support network, and above all, an enriching and highly collaborative working community that is deeply passionate about our vision for higher education and public service.Please see our .**Comments and Inquiries:**Email comments to:
.
For questions or concerns regarding equal opportunity only, contact .Additional information for applicants can be found on the Human Resources web page: .
For more job information, call the Human Resource Service Center at (512) 471-4772, or toll-free at (800) 687-4178. #J-18808-Ljbffr