University of Texas
Design Engineering Manager, Texas Institute for Electronics
University of Texas, Austin, Texas, us, 78716
* Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)* Voluntary Vision, Dental, Life, and Disability insurance options* Generous paid vacation, sick time, and holidays* Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds* Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)* Flexible spending account options for medical and childcare expenses* Robust free training access through LinkedIn Learning plus professional conference opportunities* Tuition assistance* Expansive employee discount program including athletic tickets* Free access to UT Austin's libraries and museums with staff ID card* Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card* For more details, please see:
and* Supervise, guide, direct, and help train team of TIE Design Engineers through hands-on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment* Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D-ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro-systems.* Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities.* Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages.* Participate in industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility.* Design and execute experiments for packaging performance optimization. Conduct multi-physics modeling and simulation studies. Stay current with industry trends and emerging technologies.* Other related functions as assigned.* Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field* 10+ years of relevant industry experience in semiconductor IC design* Previous supervisory experience with small to medium-sized teams* Strong understanding of semiconductor device physics and mixed signal circuit design* Excellent problem-solving skills and attention to detail* Strong communication and teamwork skills* Ability to manage multiple projects in a fast-paced environment* Proficiency in industry-standard EDA software for circuit and/or package design* Master's or higher degree in relevant semiconductor engineering fields* Experience with 2.5D and 3D semiconductor packaging technologies* Solid understanding of various packaging technologies (wire bonding, flip-chip, wafer-level packaging)* Strong background in DFT/DFM methodologies and BIST techniques* Experience in multi-physics modeling (Power, Thermal, Mechanical, Signal Integrity, RF)* Experience in a startup or R&D environment**Start Here, Change the World**At The University of Texas at Austin, tradition meets innovation in the heart of a city that frequents lists of the best places to live and work. Named by Forbes as one of America's Best Large Employers for the sixth year in a row in 2025, UT offers both a dynamic work environment and a gateway to vibrant local culture. Whether you're at the forefront of the student experience, conducting world-changing research or supporting the engine that drives Texas’ flagship university, working at UT means making a lasting impact on our city, our state and our world.Our more than 20,000 faculty and staff empower 55,000+ students to challenge ideas, pursue passions and shape their futures. Joining UT, you’ll become part of a community dedicated to making a meaningful impact on campus and throughout the world.Please see our .**Comments and Inquiries:**Email comments to hrsc@austin.utexas.edu. For questions or concerns regarding equal opportunity only, contact .Additional information for applicants can be found on the Human Resources web page: .
For more job information, call the Human Resource Service Center at (512) 471-4772, or toll-free at (800) 687-4178. #J-18808-Ljbffr
and* Supervise, guide, direct, and help train team of TIE Design Engineers through hands-on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment* Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D-ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro-systems.* Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities.* Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages.* Participate in industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility.* Design and execute experiments for packaging performance optimization. Conduct multi-physics modeling and simulation studies. Stay current with industry trends and emerging technologies.* Other related functions as assigned.* Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field* 10+ years of relevant industry experience in semiconductor IC design* Previous supervisory experience with small to medium-sized teams* Strong understanding of semiconductor device physics and mixed signal circuit design* Excellent problem-solving skills and attention to detail* Strong communication and teamwork skills* Ability to manage multiple projects in a fast-paced environment* Proficiency in industry-standard EDA software for circuit and/or package design* Master's or higher degree in relevant semiconductor engineering fields* Experience with 2.5D and 3D semiconductor packaging technologies* Solid understanding of various packaging technologies (wire bonding, flip-chip, wafer-level packaging)* Strong background in DFT/DFM methodologies and BIST techniques* Experience in multi-physics modeling (Power, Thermal, Mechanical, Signal Integrity, RF)* Experience in a startup or R&D environment**Start Here, Change the World**At The University of Texas at Austin, tradition meets innovation in the heart of a city that frequents lists of the best places to live and work. Named by Forbes as one of America's Best Large Employers for the sixth year in a row in 2025, UT offers both a dynamic work environment and a gateway to vibrant local culture. Whether you're at the forefront of the student experience, conducting world-changing research or supporting the engine that drives Texas’ flagship university, working at UT means making a lasting impact on our city, our state and our world.Our more than 20,000 faculty and staff empower 55,000+ students to challenge ideas, pursue passions and shape their futures. Joining UT, you’ll become part of a community dedicated to making a meaningful impact on campus and throughout the world.Please see our .**Comments and Inquiries:**Email comments to hrsc@austin.utexas.edu. For questions or concerns regarding equal opportunity only, contact .Additional information for applicants can be found on the Human Resources web page: .
For more job information, call the Human Resource Service Center at (512) 471-4772, or toll-free at (800) 687-4178. #J-18808-Ljbffr