Northrop Grumman Corp. (AU)
Principal Packaging Engineer - Space Microelectronics
Northrop Grumman Corp. (AU), Baltimore, Maryland, United States, 21276
A premier defense contractor in Baltimore seeks a seasoned Principal or Senior Principal Engineer in Microelectronic Semiconductors. This on-site role involves packaging process leadership, compliance assurance, and mentorship of engineering talents while contributing to cutting-edge technology programs in defense and space systems. A degree in Mechanical Engineering or Materials Science and significant experience in semiconductor packaging processes are required. Competitive salary from $105,400 to $196,700 offered.
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