Atum Works
Senior/Principal R&D Engineer - Electrochemistry
Atum Works, Mountain View, California, us, 94039
Senior/Principal R&D Engineer – Electrochemistry
About Atum Works. We're a well‑funded startup on a mission to extend humanity's ability to structure matter at the smallest scales in three dimensions. Atum Works is building the world's first scalable 3D lithography foundry, unlocking nanoscale manufacturing and forging the next generation of microelectronics: smaller, denser, and infinitely customizable. By crossing the cost and speed thresholds that make 3D microfabrication commercially viable, we're enabling technology to finally catch up with nature's three‑dimensional complexity and opening the door to a future of full‑dimensional manufacturing.
Position Summary We are seeking an accomplished and visionary Senior or Principal R&D Process Engineer to lead the invention, fundamental characterization, and scalable implementation of next‑generation electrochemical and materials deposition technologies. In this role, you will own end‑to‑end development of novel plating and wet‑chemical processes, including high‑precision, resist‑enabled electroplating solutions tailored for advanced device architectures. The ideal candidate brings deep theoretical understanding of electrochemistry, strong command of polymer and materials chemistry, and a track record of solving complex cross‑disciplinary problems at the interface of plating, patterning, and surface engineering. As a senior technical leader, you will set strategy, mentor junior engineers, and shape both the IP landscape and the long‑term R&D roadmap.
Key Responsibilities
Technical Leadership and Strategy
Define the technical vision and research roadmap for novel electrochemical deposition and patterning processes, aligning near‑term experiments with long‑term platform scalability.
Serve as the internal subject‑matter expert on electroplating and wet‑chemical deposition mechanisms, interface chemistry, and advanced materials interactions.
Novel Process Invention
Architect, design, and direct complex R&D programs for new plating and wet‑chemical deposition processes targeting unique structures, geometries, and device requirements.
Develop next‑generation chemistries and deposition pathways enabled by advanced resist and surface‑patterning materials.
Mechanistic and Analytical Characterization
Lead deep mechanistic investigations using electrochemical methods, analytical chemistry, and advanced metrology to uncover rate‑limiting steps, interfacial behaviors, and material‑property relationships.
Apply modeling, simulation, or first‑principles reasoning to inform design of experiments and accelerate optimization.
Surface Science and Interface Engineering
Develop high‑performance surface preparation, activation, and modification strategies to improve adhesion, nucleation behavior, uniformity, and defectivity.
Chemistry, Bath, and Tooling Optimization
Collaborate closely with chemical suppliers and internal chemistry and tooling teams to co‑develop tailored bath chemistries, additives, inhibitors, and stabilizers.
Guide development of prototype reactors, small‑scale tooling, and custom test structures to improve process control, throughput, and reproducibility.
IP Creation and Technical Differentiation
Drive significant contributions to the company's IP portfolio, including new chemistries, deposition methods, bath designs, patterning materials, and integrated process flows.
Scale‑Up and HVM Readiness
Define scalability criteria, analyze manufacturability risks, and translate R&D innovations into robust, statistically‑controlled processes suitable for high‑volume manufacturing.
Establish rigorous DOE frameworks, process control plans, and documentation packages for transfer to operations and partner fabs.
Mentorship and Cross‑Functional Impact
Mentor junior engineers and scientists, elevating team technical capabilities.
Act as a key technical interface to device engineers, materials scientists, metrology teams, and external partners.
Required Qualifications
Education: Ph.D. preferred, or M.S. in Chemical Engineering, Materials Science, Electrochemistry, Chemistry, Polymer Chemistry, or a related field.
Experience: 6 to 10 years of hands‑on R&D experience for Ph.D. holders, or 10 or more years for M.S. holders, in electroplating, wet‑chemical deposition, or related electrochemical processes within semiconductor, microfabrication, advanced materials, or adjacent industries such as batteries or sensors.
Electrochemical Expertise: Demonstrated mastery of electrochemical fundamentals, kinetics, interface behavior, bath stability, additive dynamics, and process control.
Integrated Materials Knowledge: Deep experience managing interactions at the chemistry, substrate, and resist interface, including polymer behavior, surface energetics, and materials compatibility.
Technical Leadership: Proven ability to define research strategy, lead complex R&D programs, mentor technical teams, and deliver innovations with clear paths to manufacturing.
Additional Preferred Skills
Experience in process development for semiconductor packaging, BEOL, or microfabrication.
Familiarity with industrial plating tools including rack plating, fountain plating, PCB plating, or wafer‑level plating, and with custom electrochemical reactors.
Experience with SPC, JMP or Minitab, statistical modeling, or data‑driven process optimization.
Exposure to interface modeling, impedance spectroscopy, finite‑element simulation, or mechanistic modeling of electrochemical systems.
Compensation and Benefits
$160-250k (depending on level of experience) + equity
Medical, Dental, Vision and 401k matching
Free daily lunches
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Position Summary We are seeking an accomplished and visionary Senior or Principal R&D Process Engineer to lead the invention, fundamental characterization, and scalable implementation of next‑generation electrochemical and materials deposition technologies. In this role, you will own end‑to‑end development of novel plating and wet‑chemical processes, including high‑precision, resist‑enabled electroplating solutions tailored for advanced device architectures. The ideal candidate brings deep theoretical understanding of electrochemistry, strong command of polymer and materials chemistry, and a track record of solving complex cross‑disciplinary problems at the interface of plating, patterning, and surface engineering. As a senior technical leader, you will set strategy, mentor junior engineers, and shape both the IP landscape and the long‑term R&D roadmap.
Key Responsibilities
Technical Leadership and Strategy
Define the technical vision and research roadmap for novel electrochemical deposition and patterning processes, aligning near‑term experiments with long‑term platform scalability.
Serve as the internal subject‑matter expert on electroplating and wet‑chemical deposition mechanisms, interface chemistry, and advanced materials interactions.
Novel Process Invention
Architect, design, and direct complex R&D programs for new plating and wet‑chemical deposition processes targeting unique structures, geometries, and device requirements.
Develop next‑generation chemistries and deposition pathways enabled by advanced resist and surface‑patterning materials.
Mechanistic and Analytical Characterization
Lead deep mechanistic investigations using electrochemical methods, analytical chemistry, and advanced metrology to uncover rate‑limiting steps, interfacial behaviors, and material‑property relationships.
Apply modeling, simulation, or first‑principles reasoning to inform design of experiments and accelerate optimization.
Surface Science and Interface Engineering
Develop high‑performance surface preparation, activation, and modification strategies to improve adhesion, nucleation behavior, uniformity, and defectivity.
Chemistry, Bath, and Tooling Optimization
Collaborate closely with chemical suppliers and internal chemistry and tooling teams to co‑develop tailored bath chemistries, additives, inhibitors, and stabilizers.
Guide development of prototype reactors, small‑scale tooling, and custom test structures to improve process control, throughput, and reproducibility.
IP Creation and Technical Differentiation
Drive significant contributions to the company's IP portfolio, including new chemistries, deposition methods, bath designs, patterning materials, and integrated process flows.
Scale‑Up and HVM Readiness
Define scalability criteria, analyze manufacturability risks, and translate R&D innovations into robust, statistically‑controlled processes suitable for high‑volume manufacturing.
Establish rigorous DOE frameworks, process control plans, and documentation packages for transfer to operations and partner fabs.
Mentorship and Cross‑Functional Impact
Mentor junior engineers and scientists, elevating team technical capabilities.
Act as a key technical interface to device engineers, materials scientists, metrology teams, and external partners.
Required Qualifications
Education: Ph.D. preferred, or M.S. in Chemical Engineering, Materials Science, Electrochemistry, Chemistry, Polymer Chemistry, or a related field.
Experience: 6 to 10 years of hands‑on R&D experience for Ph.D. holders, or 10 or more years for M.S. holders, in electroplating, wet‑chemical deposition, or related electrochemical processes within semiconductor, microfabrication, advanced materials, or adjacent industries such as batteries or sensors.
Electrochemical Expertise: Demonstrated mastery of electrochemical fundamentals, kinetics, interface behavior, bath stability, additive dynamics, and process control.
Integrated Materials Knowledge: Deep experience managing interactions at the chemistry, substrate, and resist interface, including polymer behavior, surface energetics, and materials compatibility.
Technical Leadership: Proven ability to define research strategy, lead complex R&D programs, mentor technical teams, and deliver innovations with clear paths to manufacturing.
Additional Preferred Skills
Experience in process development for semiconductor packaging, BEOL, or microfabrication.
Familiarity with industrial plating tools including rack plating, fountain plating, PCB plating, or wafer‑level plating, and with custom electrochemical reactors.
Experience with SPC, JMP or Minitab, statistical modeling, or data‑driven process optimization.
Exposure to interface modeling, impedance spectroscopy, finite‑element simulation, or mechanistic modeling of electrochemical systems.
Compensation and Benefits
$160-250k (depending on level of experience) + equity
Medical, Dental, Vision and 401k matching
Free daily lunches
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