PseudolithIC
Process Engineer – Electroplating & Heterogeneous Integration
PseudolithIC, Santa Barbara, California, us, 93190
Process Engineer – Electroplating & Heterogeneous Integration
Join to apply for the
Process Engineer – Electroplating & Heterogeneous Integration
role at
PseudolithIC .
We are seeking a highly skilled Process Engineer specializing in electroplating, advanced wafer-level processes, and heterogeneous integration to support the development, optimization, and scaling of next-generation device packaging. This role is critical to enabling high-performance interconnects, 2.5D/3D integration, and novel substrate/wafer bonding schemes. The ideal candidate thrives in a hands‑on environment, excels at root‑cause analysis, and is comfortable owning processes from R&D through production transfer.
Key Responsibilities Process Development & Optimization
Support production wafer runs through electroplating and process steps associated with electroplating (litho, metallization, etching, inspection, and characterization).
Characterize and optimize electroplating processes (Cu) for TSV, RDL, micro‑bump, pillar, or other advanced interconnect applications.
Drive DOE (Design of Experiments) to reduce variation, increase yield, and improve process robustness.
Maintain and update detailed process documentation (SOPs, traveler sheets, control plans).
Tool Ownership & Technical Support
Serve as tool owner for plating and integration-related equipment (wet benches, plating tools, metrology, bonding systems).
Collaborate with equipment vendors on installation, qualification, preventive maintenance, and troubleshooting.
Develop and maintain SPC control charts and equipment health dashboards.
Materials & Metrology
Oversee selection, characterization, and qualification of plating chemistries, additives, and incoming materials (wafers, substrates, photoresist, metals).
Utilize surface‑analysis and electrical/metrology tools (profilometry, SEM, AFM, XRF, TDR, FIB cross‑sections, ellipsometry) to evaluate process performance.
Cross‑Functional Collaboration
Partner with cross‑functional teams (Device, Manufacturing, Testing, Reliability) to perform root‑cause analysis on plating defects, adhesion failures, and interconnect reliability challenges.
Drive corrective actions, process improvements, and long‑term reliability enhancements.
Work closely with design, product, and manufacturing teams to ensure processes support program requirements and cost targets.
Qualifications Required
BS/MS/PhD in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
1+ year of hands‑on experience in electroplating, wafer-level processing, or advanced packaging.
Strong understanding of metallization, plating chemistries, current density effects, seed layers, and deposition mechanisms.
Proficiency with SPC, DOE, and structured problem‑solving (8D, DMAIC, FMEA).
Ability to interpret SEM, XRF, profilometry, and other metrology data.
Preferred
Experience with high‑density fan‑out, redistribution layers (RDL), or TSV technologies.
Familiarity with plating chemistries from major vendors (Enthone, Atotech, MacDermid, etc.).
Exposure to MEMS, RF devices, power devices, or compound semiconductor processes.
Prior experience in a startup, R&D pilot line, or low‑volume/high‑mix environment.
Experience writing MES recipes or Python/SQL scripts for basic automation.
Soft Skills & Culture
Hands‑on, detail‑oriented engineer who can own complex processes end‑to‑end.
Excellent communicator capable of presenting technical data clearly.
Thrives in a fast‑moving, collaborative environment with shifting priorities.
Comfortable balancing development work with day‑to‑day troubleshooting.
Physical & Work Requirements
Ability to work in a cleanroom environment wearing appropriate PPE.
Manual handling of wafers, chemicals, and precision tools.
Occasional off‑hours support during tool installs or process excursions.
Compensation & Benefits Target base salary for this role is $80,000 – $105,000 per year plus meaningful equity, bonus, benefits, and 401(k). Our salary ranges are determined by role, level, experience, and location.
This position must meet Export Control compliance requirements; therefore, a "U.S. Person" as defined by 22 C.F.R. is required. 120.15 is required; "U.S. Person" includes U.S. Citizen, lawful permanent resident, refugee, or asylee.
PseudolithIC, Inc. is an Equal Employment Opportunity employer and does not discriminate in recruiting, hiring, training or promoting, on the basis of race, ethnicity, color, creed, religion, sex, sexual orientation, gender, gender identity, genetic information, national origin, physical or mental disability, pregnancy, medical condition, age, U.S. military or protected veteran status, union membership, or political affiliation.
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Process Engineer – Electroplating & Heterogeneous Integration
role at
PseudolithIC .
We are seeking a highly skilled Process Engineer specializing in electroplating, advanced wafer-level processes, and heterogeneous integration to support the development, optimization, and scaling of next-generation device packaging. This role is critical to enabling high-performance interconnects, 2.5D/3D integration, and novel substrate/wafer bonding schemes. The ideal candidate thrives in a hands‑on environment, excels at root‑cause analysis, and is comfortable owning processes from R&D through production transfer.
Key Responsibilities Process Development & Optimization
Support production wafer runs through electroplating and process steps associated with electroplating (litho, metallization, etching, inspection, and characterization).
Characterize and optimize electroplating processes (Cu) for TSV, RDL, micro‑bump, pillar, or other advanced interconnect applications.
Drive DOE (Design of Experiments) to reduce variation, increase yield, and improve process robustness.
Maintain and update detailed process documentation (SOPs, traveler sheets, control plans).
Tool Ownership & Technical Support
Serve as tool owner for plating and integration-related equipment (wet benches, plating tools, metrology, bonding systems).
Collaborate with equipment vendors on installation, qualification, preventive maintenance, and troubleshooting.
Develop and maintain SPC control charts and equipment health dashboards.
Materials & Metrology
Oversee selection, characterization, and qualification of plating chemistries, additives, and incoming materials (wafers, substrates, photoresist, metals).
Utilize surface‑analysis and electrical/metrology tools (profilometry, SEM, AFM, XRF, TDR, FIB cross‑sections, ellipsometry) to evaluate process performance.
Cross‑Functional Collaboration
Partner with cross‑functional teams (Device, Manufacturing, Testing, Reliability) to perform root‑cause analysis on plating defects, adhesion failures, and interconnect reliability challenges.
Drive corrective actions, process improvements, and long‑term reliability enhancements.
Work closely with design, product, and manufacturing teams to ensure processes support program requirements and cost targets.
Qualifications Required
BS/MS/PhD in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
1+ year of hands‑on experience in electroplating, wafer-level processing, or advanced packaging.
Strong understanding of metallization, plating chemistries, current density effects, seed layers, and deposition mechanisms.
Proficiency with SPC, DOE, and structured problem‑solving (8D, DMAIC, FMEA).
Ability to interpret SEM, XRF, profilometry, and other metrology data.
Preferred
Experience with high‑density fan‑out, redistribution layers (RDL), or TSV technologies.
Familiarity with plating chemistries from major vendors (Enthone, Atotech, MacDermid, etc.).
Exposure to MEMS, RF devices, power devices, or compound semiconductor processes.
Prior experience in a startup, R&D pilot line, or low‑volume/high‑mix environment.
Experience writing MES recipes or Python/SQL scripts for basic automation.
Soft Skills & Culture
Hands‑on, detail‑oriented engineer who can own complex processes end‑to‑end.
Excellent communicator capable of presenting technical data clearly.
Thrives in a fast‑moving, collaborative environment with shifting priorities.
Comfortable balancing development work with day‑to‑day troubleshooting.
Physical & Work Requirements
Ability to work in a cleanroom environment wearing appropriate PPE.
Manual handling of wafers, chemicals, and precision tools.
Occasional off‑hours support during tool installs or process excursions.
Compensation & Benefits Target base salary for this role is $80,000 – $105,000 per year plus meaningful equity, bonus, benefits, and 401(k). Our salary ranges are determined by role, level, experience, and location.
This position must meet Export Control compliance requirements; therefore, a "U.S. Person" as defined by 22 C.F.R. is required. 120.15 is required; "U.S. Person" includes U.S. Citizen, lawful permanent resident, refugee, or asylee.
PseudolithIC, Inc. is an Equal Employment Opportunity employer and does not discriminate in recruiting, hiring, training or promoting, on the basis of race, ethnicity, color, creed, religion, sex, sexual orientation, gender, gender identity, genetic information, national origin, physical or mental disability, pregnancy, medical condition, age, U.S. military or protected veteran status, union membership, or political affiliation.
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