TE Connectivity
Principal R&D Thermal Product Development Engineer
TE Connectivity, Middletown, Pennsylvania, United States
Principal R&D Thermal Product Development Engineer
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Principal R&D Thermal Product Development Engineer
role at
TE Connectivity
Job Overview TE Connectivity’s R&D/Product Development Engineering Teams are responsible for driving new products from concept to high-volume manufacturing. From market definition through production and release, the team
conduct feasibility studies
perform/direct/support detailed design, prototyping, testing, and manufacturing ramp of new and modified designs
define material requirements and new or improved manufacturing processes
assist in the qualification of suppliers for new product
The Thermal Development Group within the Advanced Development Team has responsibility for finding innovative solutions to thermal challenges in the high-speed interconnect industry, including thermal design and evaluation of associated products. Through modeling and physical validation, those solutions are enabled by the larger TE manufacturing base to be brought to the global market.
Job Requirements
Develop innovative cooling solutions for the high-speed digital interconnect industry.
Research and apply emerging technologies to new product development.
Analyze electronics cooling problems through robust modeling methods.
Address near‑adjacent technical challenges such as:
Manufacturability
Tolerancing
Structural Integrity
Life Cycle
Cost & Market Acceptance
Help expand global Best Known Methods related to simulation.
Present data and ideas in a clear and impactful manner.
Interface with engineering teams of various disciplines, including external customers.
What Your Background Should Look Like
Bachelor’s Degree in related field required; Masters or PhD preferred.
10+ years of engineering experience, including 6+ years in the electronics cooling industry.
10+ years of thermal modeling with ANSYS Icepak, Fluent, and/or similar CFD tool.
3D CAD skills with PTC Creo (ProE) or ANSYS SpaceClaim.
Experience with and knowledge of liquid and/or immersion cooling.
Experience with mechanical structural analysis is a plus.
Self‑motivated, efficient, able to work with little or no supervision, and committed to a team approach.
Strong interpersonal, organization, and project management skills.
Ability to prioritize responsibilities in a fast‑paced work environment.
Experience in core processes such as stamping, molding, plating, and assembly preferred.
Familiarity with standards related to data center cooling (e.g., ASHRAE).
Track record of innovation (patents, publications, etc.)
Key Attributes Needed
Ability to understand and discuss technical engineering issues.
Ability to read and understand engineering drawings and specifications.
Comfortable interfacing with and presenting to various disciplines.
Attention to detail and accuracy.
Ability to work on multiple concurrent projects.
Competencies SET : Strategy, Execution, Talent (for managers)
Compensation
Competitive base salary commensurate with experience: $154,100 – 192,600 (subject to change dependent on physical location)
Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
Total Compensation = Base Salary + Incentive(s) + Benefits
Benefits
A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.
EOE, Including Disability/Vet IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com. If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities.
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Principal R&D Thermal Product Development Engineer
role at
TE Connectivity
Job Overview TE Connectivity’s R&D/Product Development Engineering Teams are responsible for driving new products from concept to high-volume manufacturing. From market definition through production and release, the team
conduct feasibility studies
perform/direct/support detailed design, prototyping, testing, and manufacturing ramp of new and modified designs
define material requirements and new or improved manufacturing processes
assist in the qualification of suppliers for new product
The Thermal Development Group within the Advanced Development Team has responsibility for finding innovative solutions to thermal challenges in the high-speed interconnect industry, including thermal design and evaluation of associated products. Through modeling and physical validation, those solutions are enabled by the larger TE manufacturing base to be brought to the global market.
Job Requirements
Develop innovative cooling solutions for the high-speed digital interconnect industry.
Research and apply emerging technologies to new product development.
Analyze electronics cooling problems through robust modeling methods.
Address near‑adjacent technical challenges such as:
Manufacturability
Tolerancing
Structural Integrity
Life Cycle
Cost & Market Acceptance
Help expand global Best Known Methods related to simulation.
Present data and ideas in a clear and impactful manner.
Interface with engineering teams of various disciplines, including external customers.
What Your Background Should Look Like
Bachelor’s Degree in related field required; Masters or PhD preferred.
10+ years of engineering experience, including 6+ years in the electronics cooling industry.
10+ years of thermal modeling with ANSYS Icepak, Fluent, and/or similar CFD tool.
3D CAD skills with PTC Creo (ProE) or ANSYS SpaceClaim.
Experience with and knowledge of liquid and/or immersion cooling.
Experience with mechanical structural analysis is a plus.
Self‑motivated, efficient, able to work with little or no supervision, and committed to a team approach.
Strong interpersonal, organization, and project management skills.
Ability to prioritize responsibilities in a fast‑paced work environment.
Experience in core processes such as stamping, molding, plating, and assembly preferred.
Familiarity with standards related to data center cooling (e.g., ASHRAE).
Track record of innovation (patents, publications, etc.)
Key Attributes Needed
Ability to understand and discuss technical engineering issues.
Ability to read and understand engineering drawings and specifications.
Comfortable interfacing with and presenting to various disciplines.
Attention to detail and accuracy.
Ability to work on multiple concurrent projects.
Competencies SET : Strategy, Execution, Talent (for managers)
Compensation
Competitive base salary commensurate with experience: $154,100 – 192,600 (subject to change dependent on physical location)
Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
Total Compensation = Base Salary + Incentive(s) + Benefits
Benefits
A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.
EOE, Including Disability/Vet IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com. If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities.
#J-18808-Ljbffr