Senior Optoelectronic Packaging Architect

A leading manufacturer of electronic interconnect solutions seeks an Advanced Packaging and Process Architect in San Diego, CA. The role involves designing next-generation optoelectronic packaging, leading process development, and mentoring engineers. Candidates should have extensive experience in optoelectronic package development and a degree in engineering. This position offers a salary range of $187,000 – $212,000 annually, plus generous bonuses and a comprehensive benefits package. #J-18808-Ljbffr