Senior Microelectronics Packaging Engineer – MCM/SiP Leader

Join a forward-thinking company that leads the market in innovative microelectronics packaging solutions. This role involves leading a talented team to design and develop high-density memory products for defense and aerospace sectors. You will manage complex projects, ensuring timely execution and quality delivery while interfacing with both local and international partners. Your expertise in semiconductor packaging will drive the development of cutting-edge solutions, making a significant impact in a rapidly evolving industry. If you're passionate about technology and ready to take on exciting challenges, this opportunity is for you. #J-18808-Ljbffr