Senior Packaging Design Engineer - TSV OSAT & Interconnects

A leading semiconductor solutions provider in California seeks a Packaging Design Engineer to lead the development of advanced semiconductor packaging. This position involves designing high-reliability packaging processes, collaborating with foundry partners, and qualifying OSAT assembly processes. The ideal candidate should possess a degree in Electrical or Mechanical Engineering and have over 5 years of experience with semiconductor packaging and interconnects. The annual salary ranges from $200,000 to $260,000, commensurate with experience. #J-18808-Ljbffr