Vinci4D.ai
Sales Engineer (Thermal Simulation Software)
Vinci4D.ai, San Francisco, California, United States, 94199
Sales Engineer (Thermal Simulation Software)
Join to apply for the Sales Engineer (Thermal Simulation Software) role at Vinci4D.ai. We are building an AI assistant for hardware design. Our product helps engineers explore, analyze, and optimize hardware systems, integrating cutting‑edge AI with the realities of engineering design workflows.
Role Overview We are seeking a Sales Engineer based in the San Francisco Bay Area who will partner closely with prospective customers to demonstrate how our thermal simulation platform accelerates design decisions and improves product reliability. You’ll be the technical voice in the sales cycle—showing value through hands‑on demos, performance evaluations, and solution architecture discussions. Your role bridges customer needs and our product strengths, ensuring clear alignment between business outcomes and engineering performance.
This is a hybrid role, with the expectation of working three days per week in our Palo Alto office for close collaboration with Sales, Product, and Engineering. The role includes moderate travel, primarily within the United States, with infrequent international travel to key customers and events in Asia and Europe.
This position requires a solid background in electronics thermal management—you should be comfortable leading conversations on heat transfer, thermal bottlenecks, multiphysics simulation workflows, and trade‑offs impacting manufacturability and reliability.
Responsibilities
Partner with sales to conduct product demos, scoping sessions, and proof‑of‑concept evaluations.
Support customer technical teams during the evaluation phase, including simulation setup, model ingestion, and results interpretation.
Support customer deployments, in collaboration with the Engineering team.
Translate engineering pain points into compelling value propositions and ROI narratives.
Document customer workflows and provide structured feedback to improve product features, usability, and onboarding.
Deliver training sessions and presentations to help customers assess our technology confidently.
Lead onsite presence at industry conferences and semiconductor events by delivering live product demonstrations, managing booth activities, and driving technical engagement with attendees.
Maintain strong awareness of competitive technologies and market positioning.
Qualifications Required
Degree in Mechanical, Electrical, or related engineering field.
3+ years of electronics thermal engineering or simulation experience (CFD/FEA, Ansys ICEPAK, Siemens FLOTHERM, Cadence Celsius, etc.).
Experience in pre‑sales, technical sales, or customer‑facing engineering roles.
Strong problem‑solving mindset and ability to quickly learn new tools and workflows.
Strong ability to communicate complex results clearly to a mixed audience (technical + business).
Preferred
Familiarity with semiconductor packaging and advanced cooling (cold plates, vapor chambers, 2.5D/3D IC, etc.).
Ability to rapidly learn and adapt to new physics‑based workflows and AI‑assisted design tools.
Experience with commercializing technical software—ideally EDA or simulation tools—into semiconductor and electronics companies.
Why Join Us
Be part of a team defining the future of AI in hardware design.
Work at the intersection of advanced AI, real‑world engineering, and customer success.
Collaborate with world‑class engineers and researchers in a fast‑moving startup environment.
Seniority level
Mid‑Senior level
Employment type
Full‑time
Job function
Sales and Business Development
Industries
Technology, Information and Internet
#J-18808-Ljbffr
Role Overview We are seeking a Sales Engineer based in the San Francisco Bay Area who will partner closely with prospective customers to demonstrate how our thermal simulation platform accelerates design decisions and improves product reliability. You’ll be the technical voice in the sales cycle—showing value through hands‑on demos, performance evaluations, and solution architecture discussions. Your role bridges customer needs and our product strengths, ensuring clear alignment between business outcomes and engineering performance.
This is a hybrid role, with the expectation of working three days per week in our Palo Alto office for close collaboration with Sales, Product, and Engineering. The role includes moderate travel, primarily within the United States, with infrequent international travel to key customers and events in Asia and Europe.
This position requires a solid background in electronics thermal management—you should be comfortable leading conversations on heat transfer, thermal bottlenecks, multiphysics simulation workflows, and trade‑offs impacting manufacturability and reliability.
Responsibilities
Partner with sales to conduct product demos, scoping sessions, and proof‑of‑concept evaluations.
Support customer technical teams during the evaluation phase, including simulation setup, model ingestion, and results interpretation.
Support customer deployments, in collaboration with the Engineering team.
Translate engineering pain points into compelling value propositions and ROI narratives.
Document customer workflows and provide structured feedback to improve product features, usability, and onboarding.
Deliver training sessions and presentations to help customers assess our technology confidently.
Lead onsite presence at industry conferences and semiconductor events by delivering live product demonstrations, managing booth activities, and driving technical engagement with attendees.
Maintain strong awareness of competitive technologies and market positioning.
Qualifications Required
Degree in Mechanical, Electrical, or related engineering field.
3+ years of electronics thermal engineering or simulation experience (CFD/FEA, Ansys ICEPAK, Siemens FLOTHERM, Cadence Celsius, etc.).
Experience in pre‑sales, technical sales, or customer‑facing engineering roles.
Strong problem‑solving mindset and ability to quickly learn new tools and workflows.
Strong ability to communicate complex results clearly to a mixed audience (technical + business).
Preferred
Familiarity with semiconductor packaging and advanced cooling (cold plates, vapor chambers, 2.5D/3D IC, etc.).
Ability to rapidly learn and adapt to new physics‑based workflows and AI‑assisted design tools.
Experience with commercializing technical software—ideally EDA or simulation tools—into semiconductor and electronics companies.
Why Join Us
Be part of a team defining the future of AI in hardware design.
Work at the intersection of advanced AI, real‑world engineering, and customer success.
Collaborate with world‑class engineers and researchers in a fast‑moving startup environment.
Seniority level
Mid‑Senior level
Employment type
Full‑time
Job function
Sales and Business Development
Industries
Technology, Information and Internet
#J-18808-Ljbffr