Vinci4d
Sales Engineer (Thermal Simulation Software)
Vinci4d, Palo Alto, California, United States, 94306
About Us
We are building an AI assistant for hardware design. Our product helps engineers explore, analyze, and optimize hardware systems, integrating cutting‑edge AI with the realities of engineering design workflows.
Role Overview We are seeking a
Sales Engineer
based in the
San Francisco Bay Area
who will partner closely with prospective customers to demonstrate how our thermal simulation platform accelerates design decisions and improves product reliability. You’ll be the technical voice in the sales cycle—showing value through hands‑on demos, performance evaluations, and solution architecture discussions. Your role bridges customer needs and our product strengths, ensuring clear alignment between business outcomes and engineering performance.
This is a
hybrid role , with the expectation of working
3 days per week in our Palo Alto office
for close collaboration with Sales, Product, and Engineering. The role includes
moderate travel , primarily within the United States. Some
infrequent international travel
may be required for key customers and events in
Asia and Europe .
This position requires a solid background in electronics thermal management—you should be comfortable leading conversations on heat transfer, thermal bottlenecks, multiphysics simulation workflows, and tradeoffs impacting manufacturability and reliability.
Responsibilities
Partner with sales to conduct product demos, scoping sessions, and proof‑of‑concept evaluations
Support customer technical teams during the evaluation phase, including simulation setup, model ingestion, and results interpretation
Support customer deployments, in collaboration with the Engineering team
Translate engineering pain points into compelling value propositions and ROI narratives
Document customer workflows and provide structured feedback to improve product features, usability, and onboarding
Deliver training sessions and presentations to help customers assess our technology confidently
Lead onsite presence at industry conferences and semiconductor events by delivering live product demonstrations, managing booth activities, and driving technical engagement with attendees
Maintain strong awareness of competitive technologies and market positioning
Qualifications Required
Degree in Mechanical, Electrical, or related engineering field
3+ years of electronics thermal engineering or simulation experience (CFD/FEA, Ansys ICEPAK, Siemens FLOTHERM, Cadence Celsius, etc.)
Experience in pre‑sales, technical sales, or customer‑facing engineering roles
Strong problem‑solving mindset and ability to quickly learn new tools and workflows
Strong ability to communicate complex results clearly to a mixed audience (technical + business)
Preferred
Familiarity with semiconductor packaging and advanced cooling (cold plates, vapor chambers, 2.5D/3D IC, etc.)
Ability to rapidly learn and adapt to new physics‑based workflows and AI-assisted design tools
Experience with commercializing technical software—ideally EDA or simulation tools—into semiconductor and electronics companies
Why Join Us
Be part of a team defining the future of AI in hardware design.
Work at the intersection of advanced AI, real‑world engineering, and customer success.
Collaborate with world‑class engineers and researchers in a fast‑moving startup environment.
#J-18808-Ljbffr
Role Overview We are seeking a
Sales Engineer
based in the
San Francisco Bay Area
who will partner closely with prospective customers to demonstrate how our thermal simulation platform accelerates design decisions and improves product reliability. You’ll be the technical voice in the sales cycle—showing value through hands‑on demos, performance evaluations, and solution architecture discussions. Your role bridges customer needs and our product strengths, ensuring clear alignment between business outcomes and engineering performance.
This is a
hybrid role , with the expectation of working
3 days per week in our Palo Alto office
for close collaboration with Sales, Product, and Engineering. The role includes
moderate travel , primarily within the United States. Some
infrequent international travel
may be required for key customers and events in
Asia and Europe .
This position requires a solid background in electronics thermal management—you should be comfortable leading conversations on heat transfer, thermal bottlenecks, multiphysics simulation workflows, and tradeoffs impacting manufacturability and reliability.
Responsibilities
Partner with sales to conduct product demos, scoping sessions, and proof‑of‑concept evaluations
Support customer technical teams during the evaluation phase, including simulation setup, model ingestion, and results interpretation
Support customer deployments, in collaboration with the Engineering team
Translate engineering pain points into compelling value propositions and ROI narratives
Document customer workflows and provide structured feedback to improve product features, usability, and onboarding
Deliver training sessions and presentations to help customers assess our technology confidently
Lead onsite presence at industry conferences and semiconductor events by delivering live product demonstrations, managing booth activities, and driving technical engagement with attendees
Maintain strong awareness of competitive technologies and market positioning
Qualifications Required
Degree in Mechanical, Electrical, or related engineering field
3+ years of electronics thermal engineering or simulation experience (CFD/FEA, Ansys ICEPAK, Siemens FLOTHERM, Cadence Celsius, etc.)
Experience in pre‑sales, technical sales, or customer‑facing engineering roles
Strong problem‑solving mindset and ability to quickly learn new tools and workflows
Strong ability to communicate complex results clearly to a mixed audience (technical + business)
Preferred
Familiarity with semiconductor packaging and advanced cooling (cold plates, vapor chambers, 2.5D/3D IC, etc.)
Ability to rapidly learn and adapt to new physics‑based workflows and AI-assisted design tools
Experience with commercializing technical software—ideally EDA or simulation tools—into semiconductor and electronics companies
Why Join Us
Be part of a team defining the future of AI in hardware design.
Work at the intersection of advanced AI, real‑world engineering, and customer success.
Collaborate with world‑class engineers and researchers in a fast‑moving startup environment.
#J-18808-Ljbffr